Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof

• US 20070246715A1
• Filed: 04/13/2007
• Published: 10/25/2007
• Est. Priority Date: 04/21/2006
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Shin, Sang Hyun, Lee, Young Ki, Choi, Seog Moon
• Granted Patent: US 7,547,923 B2
• Time in Patent Office: Days
• US Class Current: 257/79
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/641 characterized by the materials

Abstract

A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.

Claims

1. A light emitting diode package comprising:

an Al substrate having a recessed multi-stepped reflecting surface formed in a side thereof;

a light source comprising light emitting diodes mounted on the reflecting surface and electrically connected to patterned electrodes;

anodized insulation layers formed between the patterned electrodes and the substrate;

an encapsulant covering over the light source of the substrate; and

an Al radiator formed under the light emitting diodes of the light source to enhance heat radiation capacity.

2. The LED package according to claim 1, wherein the multi-stepped reflecting surface is coated with highly reflective Ag.

3. The LED package according to claim 1, wherein the reflecting surface is defined by a recessed space in the Al substrate and comprises a planar central reflecting surface portion, on which the light source is seated, and inclined reflecting surface portions surrounding the central reflecting surface portion.

4. A method of fabricating an LED package having a multi-stepped reflecting surface structure, comprising:

etching a surface of a substrate to integrally form a reflecting surface;

anodizing surfaces of the substrate to form insulation layers;

coating a highly reflective metallic material on the reflecting surface;

forming patterned electrodes on the insulation layers of the substrate;

mounting a light source on the substrate and electrically connecting the light source to the patterned electrodes; and

forming an encapsulant over the light source of the substrate.

5. The method according to claim 4, wherein the etching step comprises:

forming a first photoresist layer on a surface of the substrate and selectively etching the surface of the substrate to form a first inclined reflecting surface portion; and

forming a second photoresist layer on an inner side of the first inclined reflecting surface portion and selectively etching the inner side surface of the substrate to form a second inclined reflecting surface portion and a central reflecting surface portion on which the light source is seated.

6. The method according to claim 4, wherein the encapsulant forming step comprises dispensing and curing a transparent material selected from the group consisting of a silicone resin, an epoxy resin, an Epoxy Molding Compound (EMC) and mixtures thereof in a recessed space of the reflecting surface of the substrate.

7. The method according to claim 4, further comprising dicing a mother substrate to produce a plurality of LED packages.