Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode

• US 20070246730A1
• Filed: 06/12/2007
• Published: 10/25/2007
• Est. Priority Date: 02/28/2003
• Status: Active Grant

• Current Assignee: Koichi Fukasawa, Nodoka Oishi, Sadato Imai
• Original Assignee: Koichi Fukasawa, Nodoka Oishi, Sadato Imai
• Inventors: Imai, Sadato, Fukasawa, Koichi, Oishi, Nodoka
• Granted Patent: US 7,745,835 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes

Abstract

A light emitting element has a base made of heat conductive material, a wire plate made of an insulation material and secured to an upper surface of the base. Conductive patterns are secured to the wire plate, and a light emitting chip is secured to the base at an exposed mounting area. The light emitting chip is electrically connected to the conductive patterns.

Claims

1. A light emitting element comprising:

a base made of heat conductive material and having a heat radiation surface formed on a surface thereof;

at least one wire plate made of an insulation material and secured to an upper surface of the base;

exposing means for forming an exposed mounting area on the surface of the base;

conductive patterns formed on the wire plate;

a light emitting chip secured to the base at the mounting area; and

connecting means for electrically connecting the light emitting chip to the conductive patterns.

2-15. -15. (canceled)

16. A light emitting diode comprising:

a base having an electric conducting property;

a wire plate made of insulating material, having at least one hole, and secured to an upper surface of the base;

at least one electric conductive pattern provided on the wire plate;

at least one light emitting diode element including an anode and a cathode, and secured to the base within the hole of the wire plate;

a wire which connects one selected from the anode and the cathode of the light emitting diode element to the electric conductive pattern provided on the wire plate, and the other of the anode and the cathode of the light emitting diode element electrically connected to the base;

the base having at least one projection on the upper surface thereof.

17. The light emitting diode according to claim 16, wherein the projection is a terminal portion.

18. The light emitting diode according to claim 16, wherein thickness of the wire plate with the electric conductive pattern provided thereon and thickness of the projection are substantially same.

19. The light emitting diode according to claim 16, wherein the wire plate has at least one notch to expose the projection of the base to an upper surface of the light emitting diode.

20. A light emitting diode device comprising:

the light emitting diode according to claim 16;

and

a circuit board including electric conductive patterns and a hole through which light emitted from the light emitting diode passes;

at least one part of the electric conductive pattern of the wire plate and the projection of the base being electrically connected to at least one part of the electric conductive patterns of the circuit board.

21. A light emitting diode device comprising:

at least two light emitting diode according to claim 16;

and

a circuit board including electric conductive patterns and at least two holes through which light emitted from the light emitting diodes pass;

at least one part of the electric conductive pattern of the wire plate and the projection of the base in each of the light emitting diode being electrically connected to at least one part of the electric conductive patterns of the circuit board.