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EMBEDDED INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM

  • US 20070246813A1
  • Filed: 04/19/2006
  • Published: 10/25/2007
  • Est. Priority Date: 04/19/2006
  • Status: Active Grant
First Claim
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1. An embedded integrated circuit package-on-package system comprising:

  • forming a first integrated circuit package system;

    forming a second integrated circuit package system; and

    mounting the second integrated circuit package system over the first integrated circuit package system with the first integrated circuit package system, the second integrated circuit package system, or a combination thereof being an embedded integrated circuit package system or an embedded stacked integrated circuit package system.

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