EMBEDDED INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM

• US 20070246813A1
• Filed: 04/19/2006
• Published: 10/25/2007
• Est. Priority Date: 04/19/2006
• Status: Active Grant

• Current Assignee: Stats Chippac Pte. Ltd. (JCET Group Co., Ltd.)
• Original Assignee: Stats Chippac BVI limited (JCET Group Co., Ltd.)
• Inventors: Chow, Seng Guan, Ong, You Yang, Merilo, Dioscoro
• Granted Patent: US 8,546,929 B2
• Time in Patent Office: Days
• US Class Current: 257/686
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2225/06517 Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 2225/107 Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
• CPC Class Codes: H01L 2225/1094 Thermal management, e.g. cooling
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/03 : all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15331 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

An embedded integrated circuit package-on-package system is provided forming a first integrated circuit package system, forming a second integrated circuit package system, and mounting the second integrated circuit package system over the first integrated circuit package system with the first integrated circuit package system, the second integrated circuit package system, or a combination thereof being an embedded integrated circuit package system or an embedded stacked integrated circuit package system.

Claims

1. An embedded integrated circuit package-on-package system comprising:

forming a first integrated circuit package system;

forming a second integrated circuit package system; and

mounting the second integrated circuit package system over the first integrated circuit package system with the first integrated circuit package system, the second integrated circuit package system, or a combination thereof being an embedded integrated circuit package system or an embedded stacked integrated circuit package system.

2. The system as claimed in claim 1 wherein:

forming the first integrated circuit package system comprises;

forming the embedded integrated circuit package system; and

further comprising;

stacking an integrated circuit die on the embedded integrated circuit package system;

connecting the integrated circuit die and the embedded integrated circuit package system; and

encapsulating the integrated circuit die.

3. The system as claimed in claim 1 wherein:

forming the second integrated circuit package system comprises;

forming the embedded integrated circuit package system; and

further comprising;

forming a heat slug on an integrated circuit die of the embedded integrated circuit package system.

4. The system as claimed in claim 1 wherein:

forming the second integrated circuit package system comprises;

forming the embedded integrated circuit package system; and

further comprising;

mounting a device on the embedded integrated circuit package system.

5. The system as claimed in claim 1 further comprising:

stacking an interposer on the first integrated circuit package system; and

wherein;

forming the second integrated circuit package system comprises;

forming the embedded integrated circuit package system; and

mounting the second integrated circuit package system over the first integrated circuit package system further comprises;

mounting the embedded integrated circuit package system on the interposer.

6. An embedded integrated circuit package-on-package system comprising:

forming a first integrated circuit package system having a first integrated circuit die;

forming a second integrated circuit package system having a second integrated circuit die; and

mounting the second integrated circuit package system over the first integrated circuit package system with the first integrated circuit package system, the second integrated circuit package system, or a combination thereof is an embedded integrated circuit package system or an embedded stacked integrated circuit package system.

7. The system as claimed in claim 6 wherein forming the first integrated circuit package system includes:

forming the embedded integrated circuit package system; and

stacking the first integrated circuit die below a third integrated circuit die.

8. The system as claimed in claim 6 wherein:

forming the first integrated circuit package system having the first integrated circuit die includes;

forming the embedded integrated circuit package system having a first ultra thin integrated circuit die; and

forming the second integrated circuit package system having the second integrated circuit die further includes;

forming the embedded integrated circuit package system having a second ultra thin integrated circuit die.

9. The system as claimed in claim 6 wherein:

forming the first integrated circuit package system comprises;

forming the embedded stacked integrated circuit package system; and

further comprising;

mounting an external interconnect on the embedded stacked integrated circuit package system.

10. The system as claimed in claim 6 wherein:

forming the second integrated circuit package system comprises;

forming the embedded integrated circuit package system; and

further comprising;

mounting an external interconnect on the embedded integrated circuit package system.

11. An embedded integrated circuit package-on-package system comprising:

a first integrated circuit package system;

a second integrated circuit package system; and

the second integrated circuit package system over the first integrated circuit package system with the first integrated circuit package system, the second integrated circuit package system, or a combination thereof being an embedded integrated circuit package system or an embedded stacked integrated circuit package system.

12. The system as claimed in claim 11 wherein:

the first integrated circuit package system comprises;

the embedded integrated circuit package system; and

further comprising;

an integrated circuit die on the embedded integrated circuit package system;

an interconnect between the integrated circuit die and the embedded integrated circuit package system; and

an encapsulation to cover the integrated circuit die.

13. The system as claimed in claim 11 wherein:

the second integrated circuit package system comprises;

the embedded integrated circuit package system; and

further comprising;

a heat slug on an integrated circuit die of the embedded integrated circuit package system.

14. The system as claimed in claim 11 wherein:

the second integrated circuit package system comprises;

the embedded integrated circuit package system; and

further comprising;

a device on the embedded integrated circuit package system.

15. The system as claimed in claim 11 further comprising:

an interposer on the first integrated circuit package system; and

wherein;

the second integrated circuit package system comprises;

the embedded integrated circuit package system; and

the second integrated circuit package system over the first integrated circuit package system further comprises;

the embedded integrated circuit package system on the interposer.

16. The system as claimed in claim 11 wherein:

the first integrated circuit package system has a first integrated circuit die;

the second integrated circuit package system has a second integrated circuit die; and

the second integrated circuit package system is over the first integrated circuit package system, the first integrated circuit package system, the second integrated circuit package system, or a combination thereof is the embedded integrated circuit package system or the embedded stacked integrated circuit package system with a substrate forming encapsulation.

17. The system as claimed in claim 16 wherein the first integrated circuit package system includes:

the embedded integrated circuit package system; and

the first integrated circuit die below a third integrated circuit die.

18. The system as claimed in claim 16 wherein:

the first integrated circuit package system having the first integrated circuit die includes;

the embedded integrated circuit package system having a first ultra thin integrated circuit die; and

the second integrated circuit package system having the second integrated circuit die further includes;

the embedded integrated circuit package system having a second ultra thin integrated circuit die.

19. The system as claimed in claim 16 wherein:

the first integrated circuit package system comprises;

the embedded stacked integrated circuit package system; and

further comprising;

an external interconnect on the embedded stacked integrated circuit package system.

20. The system as claimed in claim 16 wherein:

the second integrated circuit package system comprises;

the embedded integrated circuit package system; and

further comprising;

an external interconnect on the embedded integrated circuit package system.