Inductor element and method for production thereof, and semiconductor module with inductor element

• US 20070247268A1
• Filed: 02/27/2007
• Published: 10/25/2007
• Est. Priority Date: 03/17/2006
• Status: Abandoned Application

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Oka, Shuichi, Yanagawa, Shusaku, Oya, Yoichi
• Application Number:
  US11/711,521
• Publication Number:
  US 20070247268A1
• Time in Patent Office: Days
• US Class Current: 336/200
• CPC Class Codes: H01F 1/344 Ferrites, e.g. having a cubic spinel structure (X2+O)(Y23+O3), e.g. magnetite Fe3O4
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 2017/0066 with a magnetic layer
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16265 the item being a discrete passive component
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/14 characterised by the material or its electrical properties printed circuit boards H05K1/00
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/15192 : Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19106 : in a mirrored arrangement on two different side of a common die mounting substrate
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: Y10T 29/4902 : Electromagnet, transformer or inductor

Abstract

An inductor element includes a substrate of magnetic material, a coil, and a layer of magnetic material. The coil of conductive material is formed on the substrate. The layer of magnetic material is so formed by aerosol deposition as to enclose the coil on the substrate of magnetic material.

Claims

1. An inductor element comprising:

a substrate of magnetic material;

a coil of conductive material formed on said substrate; and

a layer of magnetic material which is so formed by aerosol deposition as to enclose said coil on said substrate.

2. The inductor element as defined in claim 1, wherein the substrate of magnetic material is formed from a high-permeability material.

3. The inductor element as defined in claim 1, wherein the layer of magnetic material is formed from a high-permeability material.

4. The inductor element as defined in claim 1, wherein the substrate of magnetic material is formed from ferrite.

5. The inductor element as defined in claim 1, wherein the layer of magnetic material is formed from ferrite.

6. The inductor element as defined in claim 5, wherein the ferrite has a thickness larger than 50 μ

m.

7. The inductor element as defined in claim 1, wherein the coil is a planar coil.

8. The inductor element as defined in claim 7, wherein the planar coil has a thickness larger than 50 μ

m.

9. The inductor element as defined in claim 1,

wherein the coil has the terminals connected to both ends which are formed on the outside of the layer of magnetic material.

10. The inductor element as defined in claim 1, wherein the substrate of magnetic material has a thin titanium layer and a thin copper layer which are sequentially formed on said titanium layer, and the coil is formed from a copper plating layer as said conductive layer which is formed on said thin copper layer.

11. The inductor element of claim 1, comprising:

a semiconductor module, the inductor element secured within the semiconductor module and a semiconductor chip electrically connected to the inductor element.

12. The semiconductor module as defined in claim 11, wherein both terminals of the coil are electrically connected to the terminals formed on the outside of the layer of magnetic material and the semiconductor chip is mounted on the inductor element.

13. The semiconductor module as defined in claim 11, wherein the inductor element is arranged on a mounting board.

14. The semiconductor module as defined in claim 11,

wherein the semiconductor chip is arranged on a mounting board and the inductor element is electrically connected to the mounting board.

15. The semiconductor module as defined in claim 14,

wherein the semiconductor chip is arranged on one side of the mounting board and the inductor element is arranged on the other side of the mounting board.

16. The semiconductor module as defined in claim 11,

wherein the inductor element is mounted on a lead frame.

17. A method for producing an inductor element comprising the steps of:

forming a coil from a conductive material on a substrate of magnetic material; and

forming by aerosol deposition a layer of magnetic material so as to enclose said coil on said substrate.

18. The method for producing an inductor element as defined in claim 17,

wherein the step of forming the layer of magnetic material by aerosol deposition employs a mask which leaves openings through which both ends of the coil of the inductor element are exposed.

19. The method for producing an inductor element as defined in claim 17,

wherein the layer of magnetic material is formed by aerosol deposition on the substrate of magnetic material and subsequently the layer of magnetic material is fabricated to make openings through which both ends or any desirable parts of the coil are exposed.

20. The method for producing an inductor element as defined in claim 17,

wherein to form the layer of magnetic material is accomplished by jetting out fine particles of magnetic material in the form of aerosol toward the substrate of magnetic material in such a way that the fine particles break as they impinge upon the surface of the substrate and breakage creates activated surfaces that help bind the broken particles with the substrate of magnetic material and the broken particles together.

21. The method for producing an inductor element as defined in claim 17, comprising the steps of:

forming a titanium thin layer on the substrate of magnetic material;

forming a copper thin layer on the titanium thin layer;

forming a copper plating layer on the copper thin layer as the conductive material; and

forming the coil from the copper plating layer.

22. The method for producing an inductor element as defined in claim 18,

wherein the openings are formed at both ends of the coil and terminals are formed in these openings.

23. The method for producing an inductor element as defined in claim 19,

wherein the openings are formed at both ends of the coil and terminals are formed in these openings.