Power adapter

• US 20070247817A1
• Filed: 07/26/2006
• Published: 10/25/2007
• Est. Priority Date: 04/25/2006
• Status: Active Grant

• Current Assignee: Chicony Power Technology Co. Ltd. (Chicony Electronics Company Limited)
• Original Assignee: Hipro Electronics Company Limited (Chicony Electronics Company Limited)
• Inventors: Huang, Ming-Ho
• Granted Patent: US 7,492,597 B2
• Time in Patent Office: Days
• US Class Current: 361/719
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/20009 using a gaseous coolant in electronic enclosures in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

A power adapter includes a housing formed of a bottom cover shell and a top cover shell and having an air passage extending across the bottom cover shell and an exhaust port in the top cover shell, a PC board mounted in the housing, two heat sinks covered on the PC board for absorbing heat from the primary and secondary sides of the PC board respectively for enabling absorbed heat to be carried to the outside of the housing by outside cooling air that is circulating through the exhaust port and the air passage, and a spacer set in the air passage between the heat sinks and working with the heat sinks to protect the PC board against outside dust and water.

Claims

1. A power adapter comprising:

a housing, said housing comprising a bottom cover shell and a top cover shell covering said bottom cover shell, said bottom cover shell having an inside space and an air passage extending through two opposite sides thereof and dividing said inside space into a first accommodation chamber and a second accommodation chamber, said top cover shell having at least one exhaust port adapted to guide circulation of outside cooling air through said air passage;

a printed circuit board mounted in said inside space inside said bottom cover shell of said housing and carrying a set of electronic component parts;

a first heat dissipation means mounted in said first accommodation chamber;

a second heat dissipation means mounted in said second accommodation chamber; and

a spacer mounted in said air passage and tightly set between said first heat dissipation means and said second heat dissipation means;

wherein said first heat dissipation means and said second heat dissipation means respectively absorb heat from the electronic component parts of said printed circuit board in said first accommodation chamber and said second accommodation chamber for enabling absorbed heat to be carried to the outside of said housing by outside cooling air passing through said at least one exhaust port and said air passage.

2. The power adapter as claimed in claim 1, wherein said air passage extending longitudinally through two opposite sides of said bottom cover shell.

3. The power adapter as claimed in claim 2, wherein said at least one exhaust port comprises a plurality of air vents on top and two opposite lateral sides of said top cover shell.

4. The power adapter as claimed in claim 3, wherein said spacer, said first heat dissipation means and said second heat dissipation means are tightly abutted against one another to block the inside space of said bottom cover shell and to protect said printed circuit board against outside dust and water.

5. The power adapter as claimed in claim 1, wherein said first heat dissipation means and said second heat dissipation means are heat sinks, and the size of said first heat dissipation means is greater than said second heat dissipation means.

6. The power adapter as claimed in claim 1, wherein said first accommodation chamber is smaller than said second accommodation chamber.

7. The power adapter as claimed in claim 6, wherein said printed circuit board has a primary side received in said first accommodation chamber and a secondary side received in said second accommodation chamber.

8. The power adapter as claimed in claim 1, wherein said spacer is made of Mylar.

9. The power adapter as claimed in claim 1, wherein said first heat dissipation means covering tightly said first accommodation chamber;

said second heat dissipation means covering tightly said second accommodation chamber.

10. The power adapter as claimed in claim 1, wherein said spacer has a U-shaped profile.