Power inverter

• US 20070247823A1
• Filed: 04/19/2007
• Published: 10/25/2007
• Est. Priority Date: 04/22/2006
• Status: Active Grant

• Current Assignee: SMA Solar Technology AG
• Original Assignee: SMA Technologie AG (SMA Solar Technology AG)
• Inventors: Falk, Andreas, Yasat, Nafiz
• Granted Patent: US 7,463,489 B2
• Time in Patent Office: Days
• US Class Current: 361/752
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 7/20418 the radiating structures being additional and fastened onto the housing
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

The object of the invention is a power inverter, the bottom of the housing (1) of the power inverter being configured to be stepped, cooling bodies (10, 11) being disposed on the exterior face of the stepped bottom, at least two printed circuit boards (6, 8) that overlap each other and communicate with the respective one of the cooling bodies (10, 11) through semiconductor components being provided.

Claims

1. A power inverter, with the bottom of the housing (1) of the power inverter being configured to be stepped, cooling bodies (10, 11) being disposed on the exterior face of the stepped bottom, at least two printed circuit boards (6, 8) that overlap each other and communicate with the respective one of the cooling bodies (10, 11) through semiconductor components being provided.

2. The power inverter as set forth in claim 1, wherein the height of the cooling bodies (10, 11) for mounting to the stepped bottom is selected so that the cooling bodies (10, 11) form a plane when mounted to the housing (1).

6. The power inverter as set forth in claim 1, wherein the cooling bodies (10, 11) are arranged laterally offset in the housing (1) when viewed from the front.

7. The power inverter as set forth in claim 1, wherein the printed circuit boards (6, 8, 6a, 8a) communicate with a respective one of the cooling bodies (10, 11, 11a) through semiconductor components (9, 9a).

8. The power inverter as set forth in claim 1, wherein the magnetic components (15) are also cooled by the air flowing through the cooling bodies (10, 11, 11a).

9. The power inverter as set forth in claim 1, wherein the cooling bodies (10, 11, 11a) comprise means (21) for fastening to a housing part (20).

10. The power inverter as set forth in claim 9, wherein the housing (1, 1a) comprises a connection region (30) for the cable supply.

11. The power inverter as set forth in claim 1, wherein the connection region (30) comprises at least one pole block (35) with a plurality of terminals.

12. The power inverter as set forth in claim 1, wherein the transition from the connection chamber (30) to the housing (1, 1a) is sealed with rubber collars (39) in the region of the cable passageways.

13. The power inverter as set forth in claim 1, wherein the connection region comprises a wall (31) oriented at an incline and having a sealable opening (32) for the cables (40).

14. The power inverter as set forth in claim 1, wherein the housing (1, 1a, 1b) is configured to be a cast housing, said cast housing (1, 1a, 1b) comprising cooling ribs.

3. A power inverter with at least one cooling body (11a) disposed outside of the housing (1a) and at least two printed circuit boards (6a, 8a) that communicate with the at least one cooling body (11a) through semiconductor elements, the one printed circuit board (6a) overlapping the other printed circuit board (8c) in the housing (1a) at an incline.

4. The power inverter as set forth in claim 3, wherein the inclined printed circuit board (6a) communicates with the at least one cooling body (11a) through a ramp (12).

5. The power inverter as set forth in claim 4, wherein the semiconductor component (9a) is interposed between the ramp (12) and the printed circuit board (6a).