Multi chip LED lamp
First Claim
1. A multi chip LED lamp comprising:
- a. a reflector;
b. a plurality of LED chips mounted on a top surface of the one reflector;
c. a triple laminate board comprising;
a board layer;
a circuit layer formed on the board layer; and
a thermal conductor layer laminated under the board layer. d. a well formed in the triple laminate board, the well sized to receive the reflector in snug fit.
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Abstract
A multi chip LED lamp comprises a reflector and a plurality of LED chips mounted on a top surface of the reflector. A triple laminate board has a board layer; a circuit layer formed on the board layer; and a thermal conductor layer laminated under the board layer. A well is formed in the triple laminate board, the well sized to receive the reflector in snug fit. The multi chip LED circuit layer can be copper and the thermal conductor layer can be aluminum. A heat sink having fins can be attached to the thermal conductor layer. Material can be removed from the triple laminate board to form the well and reflector. Three or more LED chips can be mounted on the top surface of the reflector. The chips can be less than 2 mm from each other.
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Citations
20 Claims
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1. A multi chip LED lamp comprising:
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a. a reflector;
b. a plurality of LED chips mounted on a top surface of the one reflector;
c. a triple laminate board comprising;
a board layer;
a circuit layer formed on the board layer; and
a thermal conductor layer laminated under the board layer.d. a well formed in the triple laminate board, the well sized to receive the reflector in snug fit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A multi chip LED lamp construction process comprising the steps of:
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a. forming a reflector;
b. mounting more than three LED chips on a top surface of the reflector;
c. forming a triple laminate board comprising;
a board layer;
a circuit layer formed on the board layer; and
a thermal conductor layer laminated under the board layer;
d. forming a through hole to form a well in the triple laminate board;
e. inserting the reflector into the well wherein the reflector is in snug fit with the through hole or the triple laminate board; and
f. connecting the PCB to the chips with connecting wire. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification