Multi chip LED lamp

• US 20070247852A1
• Filed: 04/21/2006
• Published: 10/25/2007
• Est. Priority Date: 04/21/2006
• Status: Abandoned Application

• Current Assignee: Xiaoping Wang
• Original Assignee: Xiaoping Wang
• Inventors: Wang, Xiaoping
• Application Number:
  US11/408,715
• Publication Number:
  US 20070247852A1
• Time in Patent Office: Days
• US Class Current: 362/294
• CPC Class Codes: F21K 9/68 Details of reflectors forming part of the light source
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48139 with an intermediate bond, e.g. continuous wire daisy chain
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A multi chip LED lamp comprises a reflector and a plurality of LED chips mounted on a top surface of the reflector. A triple laminate board has a board layer; a circuit layer formed on the board layer; and a thermal conductor layer laminated under the board layer. A well is formed in the triple laminate board, the well sized to receive the reflector in snug fit. The multi chip LED circuit layer can be copper and the thermal conductor layer can be aluminum. A heat sink having fins can be attached to the thermal conductor layer. Material can be removed from the triple laminate board to form the well and reflector. Three or more LED chips can be mounted on the top surface of the reflector. The chips can be less than 2 mm from each other.

Claims

1. A multi chip LED lamp comprising:

a. a reflector;

b. a plurality of LED chips mounted on a top surface of the one reflector;

c. a triple laminate board comprising;

a board layer;

a circuit layer formed on the board layer; and

a thermal conductor layer laminated under the board layer.

d. a well formed in the triple laminate board, the well sized to receive the reflector in snug fit.

2. The multi chip LED lamp of claim 1, wherein the circuit layer is copper and the thermal conductor layer is aluminum.

3. The multi chip LED lamp of claim 1, further comprising a heat sink having fins attached to the thermal conductor layer.

4. The multi chip LED lamp of claim 1, wherein a step of removing material from the triple laminate board forms the well and reflector.

5. The multi chip LED lamp of claim 1, wherein three or more LED chips are mounted on the top surface of the reflector.

6. The multi chip LED lamp of claim 5, wherein the chips are less than 2 mm from each other.

7. The multi chip LED lamp of claim 6, wherein the reflector has a base width and height, wherein the width is greater than the height.

8. The multi chip LED lamp of claim 6, wherein the reflector has a base width and height, wherein the height is greater than the width.

9. The multi chip LED lamp of claim 1, wherein a first step of forming a through hole to form the well in the triple laminate board and a second step of inserting a reflector into the well forms the well and reflector.

10. The multi chip LED lamp of claim 9, wherein three or more LED chips are mounted on the top surface of the reflector.

11. The multi chip LED lamp of claim 10, wherein the chips are less than 2 mm from each other.

12. The multi chip LED lamp of claim 11, wherein the reflector has a base width and height, wherein the width is greater than the height.

13. The multi chip LED lamp of claim 11, wherein the reflector has a base width and height, wherein the height is greater than the width.

14. A multi chip LED lamp construction process comprising the steps of:

a. forming a reflector;

b. mounting more than three LED chips on a top surface of the reflector;

c. forming a triple laminate board comprising;

a board layer;

a circuit layer formed on the board layer; and

a thermal conductor layer laminated under the board layer;

d. forming a through hole to form a well in the triple laminate board;

e. inserting the reflector into the well wherein the reflector is in snug fit with the through hole or the triple laminate board; and

f. connecting the PCB to the chips with connecting wire.

15. The multi chip LED lamp construction process of claim 14, further comprising the step of attaching a heat sink to the thermal conductor layer.

16. The multi chip LED lamp construction process of claim 14, wherein the reflector has a base width and height, wherein the width is greater than the height.

17. The multi chip LED lamp construction process of claim 14, wherein the reflector has a base width and height, wherein the height is greater than the width.

18. The multi chip LED lamp construction process of claim 14, wherein the step of mounting more than three LED chips on a top surface of the reflector further includes the substep of mounting the chips less than 2 mm from each other.

19. The multi chip LED lamp construction process of claim 18, wherein the reflector has a base width and height, wherein the width is greater than the height.

20. The multi chip LED lamp construction process of claim 18, wherein the reflector has a base width and height, wherein the height is greater than the width.