Thermally controllable substrate

• US 20070252268A1
• Filed: 03/31/2006
• Published: 11/01/2007
• Est. Priority Date: 03/31/2006
• Status: Abandoned Application

• Current Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Inventors: Yoganandan, Sundar, Chew, Tong, Kuan, Yew, Mok, Thye, Pang, Siew
• Application Number:
  US11/395,303
• Publication Number:
  US 20070252268A1
• Time in Patent Office: Days
• US Class Current: 257/714
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes

Abstract

A thermally controllable substrate is disclosed. The substrate supports a heat generating source. One of more microchannels are embedded within the substrate and preferably circulate a cooling fluid to dissipate heat being generated by the source. The flow of the cooling fluid serves to remove heat entering the substrate proximate the source providing for the use of enhanced electrical devices which generate more heat in their normal operation.

Claims

1. A thermally controllable substrate for a heat-generating source comprising:

an electrically conductive base that receives a portion of the heat from the source; and

at least one channel formed within said base that conducts a cooling fluid.

2. The substrate according to claim 1 wherein said base comprises:

a flexible material, and

said at least one channel extends substantially parallel to a longitudinal axis of said base so that said base may be bent and the opposite ends of said base joined aligning said at least one channel in fluid communication.

3. The substrate according to claim 1 wherein said substrate includes a cooling fluid within said at least one channel.

4. The substrate according to claim 1 wherein said base comprises at least two substantially parallel channels.

5. The substrate according to claim 1 wherein said base comprises at least three substantially parallel channels.

6. The substrate according to claim 1 wherein said base comprises a relatively inflexible material.

7. The substrate according to claim 6 wherein said at least one channel comprises a closed loop within said base and oriented generally perpendicular to a longitudinal axis of said base.

8. The substrate according to claim 6 wherein said substrate further includes means for auxiliary cooling of the substrate.

10. The substrate according to claim 6 wherein said substrate further includes means for circulating said cooling fluid within said at least one channel.

9. The substrate according to claim 9 wherein said auxiliary cooling means comprises a plurality of fins mounted to one surface of said base.

11. A substrate supporting a heat-generating electrical component comprising:

a flexible electrically conductive base that receives a portion of the heat from the component; and

at least one channel formed within said base extending substantially parallel to the longitudinal axis of said base and capable of conducting a cooling fluid,

wherein said base may be bent and the opposite ends of said base joined aligning at least one channel in fluid communication.

12. The substrate according to claim 11 wherein said substrate includes a cooling fluid within said at least one channel.

13. The substrate according to claim 11 wherein said base comprises at least two substantially parallel channels.

14. The substrate according to claim 11 wherein said base comprises at least three substantially parallel channels.

15. The substrate according to claim 11 wherein said substrate further includes means for circulating said cooling fluid within said at least one channel.

16. A thermally controllable substrate for a light emitting diode comprising:

an electrically conductive base that receives heat from the diode; and

at least one channel formed within said base capable of conducting a cooling fluid.

17. The substrate according to claim 16 wherein said base comprises:

a flexible material, and

said at least one channel extends substantially parallel to a longitudinal axis of said base so that said base may be bent and the opposite ends of said base joined aligning said at least one channel in fluid communication.

18. The substrate according to claim 16 wherein said substrate includes a cooling fluid within said at least one channel.

19. A substrate supporting a light emitting diode comprising:

a flexible electrically conductive base; and

at least one channel formed within said base extending substantially parallel to the longitudinal axis of said base and capable of conducting a cooling fluid,

wherein said base may be bent and the opposite ends of said base joined aligning at least one channel in fluid communication.

20. The substrate according to claim 19 wherein said substrate includes a cooling fluid within said at least one channel.

21. The substrate according to claim 19 wherein said substrate further includes means for circulating said cooling fluid within said at least one channel.

22. A method for manufacturing a substrate supporting a heat-generating electrical device, comprising the steps of:

providing a first electrically conductive layer having a first and second side;

creating at least one strip along the first side of said first layer; and

attaching a second electrically conductive layer to said first side of said first layer defining at least one enclosed channel capable of conducting a fluid.

23. The method according to claim 22 wherein said first and second layers comprise a flexible material, the method further comprising the steps of:

bending said first and second layers;

filling said at least one channel with a fluid; and

attaching the ends of said first and second layers so as to align the ends of said at least one channel enabling the fluid within said at least one channel to remain in fluid communication throughout.

24. A method for manufacturing a substrate, comprising the steps of:

providing an electrical device source electrically connected to a first conductive layer having a first and second side;

attaching at least two substantially parallel intermittently spaced electrical conductive spacers to said first side of said first conductive layer; and

attaching a second conductive layer to said spacers defining at least one channel between said at least two spacers and said first and second conductive layers.

25. The method according to claim 24, wherein said first and second layers and said spacers comprise a flexible material, the method further comprising the steps of:

bending said first and second layers and said spacers;

filling said at least one channel with a fluid; and

connecting the ends of said first and second layers so as to align the ends of said at least one channel enabling said fluid to remain within said channel in fluid communication.