Three-Dimensional Shape Measuring Unit, Processing Unit, and Semiconductor Device Manufacturing Method
First Claim
1. A three-dimensional shape measuring apparatus comprising:
- a plurality of measurement heads for measuring a three-dimensional shape of a sample, wherein three-dimensional shapes at a plurality of points on the sample are simultaneously measured using the plurality of measurement heads.
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Abstract
A semiconductor device manufacturing technique measures simultaneously a plurality of points on a sample to realize a high-speed three-dimensional shape measurement and reflects it to setting of a processing condition in a semiconductor device process, thereby making it possible to realize stable device manufacture with high precision. A three-dimensional shape measuring apparatus loaded on a processing apparatus such as an etcher, a coater-developer, a baking machine, or a lithography machine measures a plurality of points (500) on a sample (300) at high speed by arranging a plurality of measurement heads (100) for measuring a three-dimensional shape of the sample and by combining it with movement of an loader/stage (200) loading the sample (300). By using this measurement result, feeding back for correcting a processing condition with respect to the subsequent sample (300) and feeding forward for correcting a processing condition in the next step are realized.
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Citations
16 Claims
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1. A three-dimensional shape measuring apparatus comprising:
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a plurality of measurement heads for measuring a three-dimensional shape of a sample, wherein three-dimensional shapes at a plurality of points on the sample are simultaneously measured using the plurality of measurement heads. - View Dependent Claims (2, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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3. A three-dimensional shape measuring apparatus comprising;
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a measurement head for measuring a three-dimensional shape of a sample;
a stage rotatably holding the sample thereon; and
a movement mechanism for horizontally moving a relative position between the sample and the measurement head, wherein three-dimensional shapes at a plurality of points on the sample are measured by a combination of operations of the stage and the movement mechanism and by the measurement head. - View Dependent Claims (4, 16)
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14. A semiconductor device manufacturing method using the processing apparatus according to claim 14, the method comprising the step of:
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observing a semiconductor circuit pattern or a resist pattern; and
feeding back, feeding forward, or feeding back and forward an observation result to an operative condition of the processing apparatus. - View Dependent Claims (15)
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Specification