×

Thermal and conductivity sensing systems, devices and methods

  • US 20070253463A1
  • Filed: 04/13/2007
  • Published: 11/01/2007
  • Est. Priority Date: 04/14/2006
  • Status: Active Grant
First Claim
Patent Images

1. A sensing probe comprising:

  • a probe housing;

    a thermal sensor in said probe housing having a sensing end and a connector end;

    a probe tip thermally coupled to said sensing end of the thermal sensor and attached to said probe housing, the probe tip adapted for thermal coupling with an inner surface of a thermal well; and

    at least two leads connected to said connector end of said thermal sensor, whereby thermal energy is transferred from said thermal well to said thermal sensor and whereby temperature information is conveyed through said leads.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×