Electronic devices with small functional elements supported on a carrier

• US 20070256291A1
• Filed: 07/02/2007
• Published: 11/08/2007
• Est. Priority Date: 05/31/2001
• Status: Active Grant

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: Glenn Gengel, Roger Stewart, Thomas Credelle, William Joseph
• Inventors: Stewart, Roger, Credelle, Thomas, Gengel, Glenn, Joseph, William
• Granted Patent: US 7,559,131 B2
• Time in Patent Office: Days
• US Class Current: 29/600
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07752 using an interposer
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 24/96 the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 29/0657 characterised by the shape of the body
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/10158 : at the passive surface
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 : the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01Q 1/2208 : associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00
• CPC Class Codes: H01Q 7/00 : Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H05K 1/141 : One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/183 : Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 2201/10477 : Inverted
• CPC Class Codes: H05K 3/222 : Completing of printed circuits by adding non-printed jumper connections printed jumper connections H05K3/4685
• CPC Class Codes: H05K 3/321 : by conductive adhesives
• CPC Class Codes: Y10T 29/49002 : Electrical device making
• CPC Class Codes: Y10T 29/49016 : Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 : with other electrical component
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49204 : Contact or terminal manufacturing

Abstract

Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.

Claims

1. A method of making an electronic assembly comprising:

providing a strap from a first web of flexible material, the strap comprising;

a functional component, the functional component being a radio frequency identification (RFID) flip chip;

a portion of the flexible material; and

first and second connection pads on the flexible material;

providing an antenna on a flexible substrate;

detecting for a defective functional component of the strap;

attaching the strap to the flexible substrate if a defect is not detected during the detecting,

wherein the antenna is electrically coupled to the RFID flip chip by the first and second connection pads, and

wherein the strap is smaller than the antenna.

2. The method of claim 1 furthering comprising printing the antenna on the flexible substrate.

3. The method of claim 1 wherein the attaching is by ultrasonic welding.

4. The method of claim 1 wherein the attaching is by cold swaging.

5. The method of claim 1 wherein the attaching uses a conductive adhesive.

6. The method of claim 1 wherein the flexible material is opaque.

7. The method of claim 1 wherein the flexible material is transparent.

8. The method of claim 1 wherein the flexible material is one of polyether sulfone, polyester terephthalate, polycarbonate, polybutylene terephthalate, polyphenylene sulfide, polypropylene, polyester, aramid, polyamide, polyimide, polyetherimide, polyvinyl chloride, polypropylene sulfate, and acrylonitrile butadiene styrene.

17. The method of claim 1 wherein the flexible material is one of polyether sulfone, polyester terephthalate, polycarbonate, polybutylene terephthalate, polyphenylene sulfide, polypropylene, polyester, aramid, polyamide, polyimide, polyetherimide, polyvinyl chloride, polypropylene sulfate, and acrylonitrile butadiene styrene.

9. A method of making an electronic assembly comprising:

providing a strap from a first web of flexible material, the strap comprising;

a functional component, the functional component being a radio frequency identification (RFID) chip configured for fluidic self assembly;

a portion of the flexible material; and

first and second connection pads on the flexible material;

providing an antenna on a flexible substrate;

detecting for a defective functional component of the strap;

attaching the strap to the flexible substrate if a defect is not detected during the detecting,

wherein the antenna is electrically coupled to the RFID chip by the first and second connection pads, and

wherein the strap is smaller than the antenna.

10. The method of claim 9 furthering comprising printing the antenna on the flexible substrate.

11. The method of claim 9 furthering comprising adhering the antenna to the flexible substrate with an adhesive.

12. The method of claim 9 wherein the attaching is by ultrasonic welding.

13. The method of claim 9 wherein the attaching is by cold swaging.

14. The method of claim 9 wherein the attaching uses a conductive adhesive.

15. The method of claim 9 wherein the flexible material is opaque.

16. The method of claim 9 wherein the flexible material is transparent.

18. A method of making a radio frequency identification (RFID) tag comprising:

providing a strap by;

disposing a plurality of RFID chips on a first web of flexible material;

forming first and second connection pads on the first web electrically coupled to an RFID chip of the plurality of RFID chips; and

removing the strap from the first web, the strap including the RFID chip, the first and second connection pads, a portion of the flexible material;

detecting for a defective component of the strap;

providing an antenna on a flexible substrate;

attaching the strap to the flexible substrate if a defect is not detected during the detecting,

wherein the antenna is electrically coupled to the RFID chip by the first and second connection pads, and

wherein the strap is smaller than the antenna.

19. The method of claim 18 furthering comprising adhering the antenna to the flexible substrate with an adhesive.

20. The method of claim 18 wherein the attaching is by ultrasonic welding.

21. The method of claim 18 wherein the attaching uses a conductive adhesive.

22. The method of claim 18 wherein the flexible material is opaque.

23. The method of claim 18 wherein the flexible material is one of polyether sulfone, polyester terephthalate, polycarbonate, polybutylene terephthalate, polyphenylene sulfide, polypropylene, polyester, aramid, polyamide, polyimide, polyetherimide, polyvinyl chloride, polypropylene sulfate, and acrylonitrile butadiene styrene.

24. The method of claim 18 wherein the RFID tag comprises a battery.