Method and apparatus for probing

• US 20070257025A1
• Filed: 05/04/2006
• Published: 11/08/2007
• Est. Priority Date: 05/04/2006
• Status: Active Grant

• Current Assignee: Tektronix Incorporated (Fortive Corp.)
• Original Assignee: Tektronix Incorporated (Fortive Corp.)
• Inventors: Nordstrom, Robert, Pollock, Ira, Law, William, Traa, Einar, Nightingale, Mark
• Granted Patent: US 8,067,718 B2
• Time in Patent Office: Days
• US Class Current: 219/501
• CPC Class Codes: G01R 1/0416 Connectors, terminals G01R1/0425 and G01R1/0433 take precedence; with measurement function for battery poles G01R31/364
• CPC Class Codes: G01R 1/06772 High frequency probes
• CPC Class Codes: G01R 31/2818 using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors G01R31/2805 takes precedence; printed circuits having, e.g. symbols, test patterns or visualisation means H05K1/0266
• CPC Class Codes: G01R 31/2884 using dedicated test connectors, test elements or test circuits on the IC under test G01R31/2855 takes precedence

Abstract

A probe comprises a small “consumable” probe substrate permanently mounted to a circuit-under-test. The probe substrate includes a high-fidelity signal pathway, which is inserted into a conductor of the circuit-under-test, and a high-bandwidth sensing circuit which senses the signal-under-test as it propagates along the signal pathway. The probe substrate further includes a probe socket for receiving a detachable interconnect to a measurement instrument. Power is alternatively supplied to the probe by the circuit-under-test or the interconnect. When the interconnect is attached, control signals from the measurement instrument are supplied to the sensing circuit and the output of the sensing circuit is supplied to the measurement instrument. In one embodiment, the sensing circuit uses high-breakdown transistors in order to avoid the use of passive attenuation. In a further embodiment, the sensing circuit includes broadband directional sensing circuitry.

Claims

1. A probe comprising:

a probe substrate adapted to be mounted to a circuit-under-test, the probe substrate having a signal pathway adapted to be inserted into a conductor of the circuit-under-test;

a sensing circuit coupled to the signal pathway for sensing a signal-under-test from the conductor; and

a probe socket coupled to the probe substrate adapted for receiving a detachable interconnect to a measurement instrument, the probe socket and interconnect providing an electrical interface between the sensing circuit and the measurement instrument for the signal-under-test.

2. A probe as recited in claim 1 wherein the detachable interconnect delivers power and control signals from the measurement instrument to the sensing circuit and delivers an output of the sensing circuit to the measurement instrument.

3. A probe as recited in claim 2 wherein the sensing circuit comprises a transistor having a high-breakdown characteristic, an input terminal of the transistor being coupled directly to the signal pathway with no intervening components.

4. A probe as recited in claim 2 wherein the sensing circuit comprises a directional sensing circuit.

5. A probe as recited in claim 4 wherein the directional sensing circuit comprises:

a power splitter having a first port, a second port, and a third port, the first and second ports being inserted into the signal pathway and the third port being terminated;

a first amplifier for measuring a voltage difference between the third port of the power splitter and ground;

a second amplifier for measuring a voltage difference between the first and second ports of the power splitter;

the sum of the outputs of the first and second amplifiers being the forward signal-under-test; and

the output of the second amplifier subtracted from the output of the first amplifier being the reverse signal-under-test.

6. A method of probing comprising the steps of:

mounting a probe substrate having a sensing circuit and a signal pathway to a circuit-under-test such that the signal pathway is inserted into a conductor of the circuit-under-test;

sensing a signal-under-test from the conductor with the sensing circuit as it propagates across the signal pathway; and

coupling a measurement instrument to the sensing circuit with a detachable interconnect, the interconnect being received by a probe socket coupled to the probe substrate, the interconnect and probe socket providing an electrical interface between the sensing circuit and the measurement instrument.

7. A method of probing as recited in claim 6 wherein the coupling step further comprises:

delivering power and control signals from the measurement instrument to the sensing circuit; and

delivering an output of the sensing circuit to the measurement instrument.

8. A method of probing as recited in claim 7 wherein the sensing step further comprises sensing the signal-under-test with a transistor having a high-breakdown characteristic, an input terminal of the transistor being coupled directly to the signal pathway with no intervening components.

9. A method of probing as recited in claim 7 wherein the sensing step further comprises directionally sensing the signal-under-test.

10. A method of probing as recited in claim 9 wherein the directional sensing step comprises the steps of:

a. inserting a power splitter in the signal pathway, the power splitter having a first port, a second port, and a third port, the first and second ports being in series with the signal pathway and the third port being terminated;

b. measuring a voltage difference between the third port of the power splitter and ground;

c. measuring a voltage difference between the first and second ports of the power splitter;

d. adding the measurements of steps b and c to form a forward signal-under-test; and

e. subtracting the measurement of step c from the measurement of step b to form a reverse signal-under-test.