Heat-Dissipating Device with Tapered Fins

• US 20070258214A1
• Filed: 05/04/2007
• Published: 11/08/2007
• Est. Priority Date: 05/08/2006
• Status: Abandoned Application

• Current Assignee: Yu-Nung Shen
• Original Assignee: Yu-Nung Shen
• Inventors: Shen, Yu-Nung
• Application Number:
  US11/744,378
• Publication Number:
  US 20070258214A1
• Time in Patent Office: Days
• US Class Current: 361/704
• CPC Class Codes: F21V 21/30 Pivoted housings or frames
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21V 31/00 Gas-tight or water-tight arrangements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: F28F 3/048 in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat-dissipating device includes a mounting seat and a plurality of tapered heat-dissipating fins. The mounting seat is made of a thermally conducting material, and has an inner side surface adapted to be in thermal contact with a heat source, and an outer side surface. The heat-dissipating fins extend from the outer side surface of the mounting seat in a direction away from the mounting seat. Each of the heat-dissipating fins has a proximate end proximate to the mounting seat, and a distal end distal from the mounting seat. The thickness of each of the heat-dissipating fins reduces gradually from the proximate end to the distal end. The distance between any two adjacent ones of the heat-dissipating fins increases gradually in the direction.

Claims

1. A heat dissipating device comprising:

a mounting seat made of a thermally conducting material and having an inner side surface adapted to be in thermal contact with a heat source, and an outer side surface opposite to said inner side surface; and

a plurality of tapered heat-dissipating fins extending from said outer side surface of said mounting seat in a direction away from said mounting seat, each of said heat-dissipating fins having a proximate end proximate to said mounting seat, a distal end distal from said mounting seat, and a thickness reducing gradually from said proximate end to said distal end such that a distance between any two adjacent ones of said heat-dissipating fins increases gradually in the direction.

2. The heat dissipating device as claimed in claim 1, wherein said thermally conducting material is aluminum.

3. The heat dissipating device as claimed in claim 1, wherein said distal end of each of said heat-dissipating fins is rounded, and said proximate ends of any two adjacent ones of said heat-dissipating fins cooperate with said outer side surface of said mounting seat to define a curved slot thereamong.

4. The heat dissipating device as claimed in claim 3, wherein, in a cross section of said heat-dissipating device, imaginary extension planes of two adjacent side surfaces of any two adjacent ones of said heat-dissipating fins are spaced apart from each other along a line extending along top ends of said corresponding two adjacent ones of said heat-dissipating fins by a long distance, and along a line perpendicular to the direction and extending through a lower end of said curved slot defined by said proximate ends of said corresponding two adjacent ones of said heat-dissipating fins and said outer side surface of said mounting seat by a short distance, a ratio of said short distance to said long distance being no greater than 0.75.

5. The heat dissipating device as claimed in claim 4, wherein said ratio of said short distance to said long distance is no greater than 0.5.

6. The heat dissipating device as claimed in claim 1, the heat source includes a plurality of light-emitting diode lamps serving as an illumination unit, wherein said inner side surface of said mounting seat is formed with a recess adapted to accommodate the heat source.

7. The heat dissipating device as claimed in claim 6, further comprising a cover plate attached fixedly to said mounting seat for covering said recess.

8. The heat dissipating device as claimed in claim 7, further comprising an annular water seal disposed between said cover plate and said mounting seat so as to establish a water-tight seal therebetween.

9. The heat dissipating device as claimed in claim 6, the heat source further including a circuit board unit electrically coupled to the light-emitting diode lamps, wherein said heat-dissipating device further comprises at least one graphite plate having two opposite side surfaces adapted to be in thermal contact with the circuit board unit and said mounting seat, respectively.