CHIP LEVEL BIOSTABLE INTERCONNECT FOR IMPLANTABLE MEDICAL DEVICES

• US 20070260287A1
• Filed: 04/16/2007
• Published: 11/08/2007
• Est. Priority Date: 04/26/2005
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Receveur, Rogier
• Granted Patent: US 7,853,328 B2
• Time in Patent Office: Days
• US Class Current: 607/37
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: H01L 2224/05099 Material
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/13599 Material
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/29599 Material
• CPC Class Codes: H01L 2924/00013 Fully indexed content
• CPC Class Codes: Y10S 439/909 Medical use or attached to human body

Abstract

A lead is connected to an integrated circuit in an implantable medical device in a lead bonding area that includes a lead-receiving recessed region. At least a portion of a lead conductor is bonded in the lead-receiving recessed region, making an electrical and mechanical connection to the integrated circuit that is strong and potentially biostable. In some embodiments, a filler material is provided around the recessed portion of the integrated circuit that receives the lead conductor, and a metal coating is provided around an outer surface of the filler material for additional mechanical stability.

Claims

1. A lead chip level biostable interconnect for an implantable medical device, comprising:

an integrated circuit having a lead bonding area that includes a lead-receiving recessed region selected from a shape of a semicircle, a triangle, a square, and a rectangle; and

a lead conductor having at least a portion thereof bonded in the lead-receiving recessed region.

2. The lead connection structure of claim 1, wherein the lead-receiving recessed region is formed in the integrated circuit.

3. The lead connection structure of claim 1, further comprising a lead-receiving structure on the integrated circuit that includes the lead-receiving recessed region.

4. The structure of claim 1, further comprising a non-conductive filler material around the lead-receiving recessed region.

5. The structure of claim 4, wherein the integrated circuit carries a pressure sensor that is not covered by the non-conductive filler material.

6. The structure of claim 4, further comprising a metal coating over an outer surface of the filler material.

7. The structure of claim 1, wherein the integrated circuit carries electronics, and the lead conductor bonded in the lead-receiving recessed region is conductively connected to the electronics carried by the integrated circuit.

8. The structure of claim 7, wherein conductive connection between the lead conductor and the electronics carried by the integrated circuit is achieved by a conductive lining of the lead-receiving recessed region and a conductive via extending through the integrated circuit to the electronics.

9. The structure of claim 7, wherein the conductive connection between the lead conductor and the electronics carried by the integrated circuit is achieved by a conductive lining of the lead-receiving recessed region and a conductive trace on a surface of the integrated circuit extending from the lead-receiving recessed region to the electronics.

10. The structure of claim 7, wherein a capacitor is mounted to a portion of the integrated circuit that carries the electronics.

11. The structure of claim 10, further comprising a non-conductive filler material around the lead-receiving recessed region, configured so that the electronics, the capacitor and the pressure sensor carried by the integrated circuit are not covered by the non-conductive filler material.

12. The structure of claim 1, wherein the recessed region is semicircular in shape.

13. The structure of claim 1, wherein the recessed region is triangular in shape.

14. The structure of claim 1, wherein the recessed region is rectangular in shape.

15. The structure of claim 1, wherein the recessed region is square in shape.

16. A chip level biostable interconnect for interconnecting a lead to an integrated circuit in an implantable medical device, comprising:

a lead conductor bonded to the integrated circuit in a lead bonding area;

a non-conductive filler material around the lead conductor in at least the lead bonding area; and

a metal coating around an outer surface of the non-conductive filler material.

17. The interconnect of claim 16, wherein the integrated circuit carries a pressure sensor, and wherein the non-conductive filler material does not cover the pressure sensor.

18. The interconnect of claim 16, wherein the integrated circuit carries electronics conductively connected to the lead conductor by a conductive via extending through the integrated circuit in a region that is covered by the non-conductive filler material.

19. The interconnect of claim 16, wherein the integrated circuit carries electronics conductively connected to the lead conductor by a conductive trace on a surface of the integrated circuit, the electronics being located in a region that is not covered by the non-conductive filler material.

20. The interconnect of claim 16, wherein the metal coating is composed of titanium.