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PLATING SOLUTION FOR ELECTROLESS DEPOSITION OF COPPER

  • US 20070261594A1
  • Filed: 05/11/2006
  • Published: 11/15/2007
  • Est. Priority Date: 05/11/2006
  • Status: Active Grant
First Claim
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1. An electroless copper plating solution, comprising:

  • an aqueous copper salt component;

    an aqueous cobalt salt component;

    a complexing agent that is a triamine compound; and

    a pH-modifying substance in an amount sufficient to make the electroless copper plating solution acidic, wherein, the acidic pH-modifying substance is selected from a group consisting of sulfuric acid, nitric acid, hydrochloric acid, fluoroboric acid, and acetic acid.

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