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SIMULTANEOUS INORGANIC, ORGANIC AND BYPRODUCT ANALYSIS IN ELECTROCHEMICAL DEPOSITION SOLUTIONS

  • US 20070261963A1
  • Filed: 02/02/2007
  • Published: 11/15/2007
  • Est. Priority Date: 02/02/2006
  • Status: Abandoned Application
First Claim
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1. A method for simultaneously determining concentrations of copper sulfate, sulfuric acid, chloride ion, suppressor, accelerator, leveler, and/or byproduct(s) thereof in a sample electrochemical deposition solution, comprising the steps of:

  • (a) identifying one or more non-compositional variables that affect electropotential responses of electrochemical deposition solutions during electrochemical metal deposition;

    (b) establishing a multiple regression model that expresses the electropotential responses of electrochemical deposition solutions as a function of (1) said one or more non-compositional variables, (2) organic additive concentrations in the solutions, (3) inorganic additive concentrations in the solutions, (4) byproduct concentrations in the solutions, and the corresponding coefficients;

    (c) conducting multiple calibration runs, by measuring electropotential responses of multiple calibration solutions having unique, known organic additive, inorganic additive, and/or byproduct concentrations at unique, predetermined values of said one or more variables;

    (d) determining the coefficients that correspond to said one or more variables and the organic additive, inorganic additive, and/or byproduct concentrations in the multiple regression model, based on information obtained from the calibration runs; and

    (e) conducting N experimental runs, by measuring electropotential responses of the sample electrochemical deposition solution at unique, predetermined values of said one or more variables;

    (f) establishing N number of equations based on the established multiple regression model, said equations containing the coefficients determined in step (d), the electropotential responses measured during the N experimental runs in step (e) and the corresponding predetermined values of said one or more variables, and the unknown concentrations of the copper sulfate, sulfuric acid, chloride ion, suppressor, accelerator, leveler, and/or byproduct(s) thereof in the sample electrochemical deposition solution; and

    (g) calculating said copper sulfate, sulfuric acid, chloride ion, suppressor, accelerator, leveler, and/or byproduct concentrations in the sample solution by solving the N equations provided in step (f).

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