Multiple thermal path packaging for solid state light emitting apparatus and associated assembling methods
First Claim
1. A light emitting apparatus comprising:
- a mounting substrate that includes a peripheral portion and a central portion;
a plurality of solid state light emitting elements on the mounting substrate;
a housing that is configured to thermally couple to the peripheral portion of the mounting substrate so as to provide a first thermal conduction path for at least some heat generated by the solid state light emitting elements; and
a thermal conduction apparatus that is configured to thermally couple the central portion of the mounting substrate to the housing so as to provide a second thermal conduction path that is different than the first thermal conduction path for at least some heat generated by the solid state light emitting elements.
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Accused Products
Abstract
A mounting substrate includes a peripheral portion and a central portion. Solid state light emitting elements are provided on the mounting substrate. A housing is configured to thermally couple to the peripheral portion of the mounting substrate, so as to provide a first thermal conduction path for at least some heat generated by the solid state light emitting elements. A thermal conduction member is configured to thermally couple the central portion of the mounting substrate to the housing, so as to provide a second thermal conduction path that is different from the first thermal conduction path, for at least some heat generated by the solid state light emitting elements. Related assembling methods are also described.
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Citations
31 Claims
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1. A light emitting apparatus comprising:
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a mounting substrate that includes a peripheral portion and a central portion;
a plurality of solid state light emitting elements on the mounting substrate;
a housing that is configured to thermally couple to the peripheral portion of the mounting substrate so as to provide a first thermal conduction path for at least some heat generated by the solid state light emitting elements; and
a thermal conduction apparatus that is configured to thermally couple the central portion of the mounting substrate to the housing so as to provide a second thermal conduction path that is different than the first thermal conduction path for at least some heat generated by the solid state light emitting elements. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A light emitting apparatus comprising:
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a cylindrical housing;
a disk-shaped mounting substrate that includes first and second opposing faces, each face including a peripheral portion and a central portion, and being mounted coaxially in the cylindrical housing;
a plurality of solid state light emitting elements on the peripheral and central portions of the first face of the mounting substrate; and
at least one thermally conductive member that extends from the central portion of the second face of the mounting substrate to the cylindrical housing remote from the second face. - View Dependent Claims (16, 17, 18, 19, 20)
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21. A light emitting apparatus comprising:
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a housing;
a mounting substrate in the housing;
a plurality of solid state light emitting elements on the mounting substrate; and
a thermal conduction apparatus that is configured to thermally couple the mounting substrate to the housing, remote from the mounting substrate. - View Dependent Claims (22, 23, 24, 25, 26, 27)
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28. A method of assembling a light emitting apparatus that includes a housing and a mounting substrate that has a peripheral portion and a central portion, and a plurality of solid state light emitting elements on the mounting substrate, the method comprising:
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inserting the mounting substrate into the housing; and
mounting at least one thermally conductive member in the housing to extend from the central portion of the mounting substrate to the housing remote from the mounting substrate. - View Dependent Claims (29, 30, 31)
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Specification