PLATED ANTENNA FOR HIGH FREQUENCY DEVICES

• US 20070262471A1
• Filed: 05/15/2007
• Published: 11/15/2007
• Est. Priority Date: 05/15/2006
• Status: Active Grant

• Current Assignee: Ensurge Micropower ASA
• Original Assignee: Kovio Incorporated (Ensurge Micropower ASA)
• Inventors: Cleeves, James Montague
• Granted Patent: US 7,675,464 B2
• Time in Patent Office: Days
• US Class Current: 257/784
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

A method of making a double-sided antenna for high frequency devices is discussed. The method includes forming metal patterns on both sides of a substrate having pre-formed connection holes. Preferably, the metal patterns are formed using a printing ink having a precursor and a solvent. In one embodiment, the metal patterns include coils which are formed on both sides of the substrate. In one embodiment, shunt bars are used to speed up the process of making the metal patterns. The shunt bars are punched out at the end of the process to electrically isolate the metal patterns.

Claims

1. A method for making a double-sided electronic device on a semiconductor substrate having one or more pre-formed connection holes through the substrate, comprising the steps of:

a) forming a first metal pattern on a first side of the substrate, including in the connection holes, the first metal pattern comprising a first coil and at least one first shunt bar connecting at least two loops in the first coil;

b) forming a second metal pattern on a second side of the substrate, in alignment with the connection holes, the second metal pattern comprising a second coil and at least one second shunt bar connecting at least two loops in the second coil, wherein the first metal pattern is coupled to the second metal pattern through a connection formed in said connection hole; and

c) electrically disconnecting the first and second shunt bars.

2. The method of claim 1, wherein said step of forming said first metal pattern comprises printing a first ink pattern comprising a plating material and a solvent substantially in the form of the first metal pattern on the first side of the substrate.

3. The method of claim 2, wherein said step of forming said second metal pattern comprises printing a second ink pattern comprising a plating material and a solvent substantially in the form of the second metal pattern on the second side of the substrate.

4. The method of claim 2, wherein said step of forming said first metal pattern further comprises plating metal on said first ink pattern.

5. The method of claim 3, wherein said steps of forming said first and second metal patterns comprise concurrently plating said metal on said first and second ink patterns.

6. The method of claim 2, wherein said plating material comprises an organometallic compound or suspension of metal nanoparticles which, after heating sufficiently to remove substantially all carbon-based material, provides a surface on which the metal can be electroplated or electrolessly plated.

7. The method of claim 3, wherein said plating material comprises an organometallic compound or suspension of metal nanoparticles which, after heating sufficiently to remove substantially all carbon-based material, provides a surface on which the metal can be electroplated or electrolessly plated.

8. The method of claim 1, wherein said step of forming said first metal pattern comprises printing a first ink pattern comprising metal nanoparticles and a solvent substantially in the form of the first metal pattern on the first side of the substrate.

9. The method of claim 8, wherein said step of forming said second metal pattern comprises printing a second ink pattern substantially in the form of the second metal pattern on the second side of the substrate.

10. The method of claim 1, wherein electrically disconnecting the first shunt bar comprises forming a disconnection hole in the substrate at a location of the first shunt bar of sufficient width to electrically disconnect the first shunt bar.

11. The method of claim 10, wherein the disconnection hole is formed by a hole punch.

12. The method of claim 11, wherein the hole punch is automated.

13. The method of claim 1, wherein the first metal pattern comprises a plurality of first shunt bars.

14. The method of claim 13, wherein the second metal pattern comprises a plurality of second shunt bars.

15. The method of claim 13, wherein the first metal pattern comprises m loops, and the plurality of first shunt bars comprises n first shunt bars, where n is an integer of from m/2 to (m−

1).

16. The method of claim 15, wherein the second metal pattern comprises p loops, and the plurality of second shunt bars comprises q second shunt bars, where q is an integer of from p/2 to (p−

1).

17. The method of claim 16, wherein m=p.

18. The method of claim 14, wherein the locations of the first shunt bars are sufficiently distant from the locations of the second shunt bars so that the disconnection holes disconnecting the first shunt bars do not overlap with the disconnection holes disconnecting the second shunt bars.

19. The method of claim 1, further comprising forming said connection hole in the substrate before forming the first and second metal patterns.

20. The method of claim 19, wherein the connection hole is formed using a hole punch.

21. The method of claim 20, wherein the hole punch is automated.

22. An electronic device, comprising:

a) a substrate including a connection hole formed through the substrate;

b) a first metal pattern on a first side of a substrate, the first metal pattern comprising a first coil; and

c) a second metal pattern on a second side of the substrate opposite to the first side, wherein the first metal pattern is coupled to the second metal pattern through a connection formed in said connection hole, and wherein at least one disconnection hole is formed in the substrate between loops in the first coil.

23. The device of claim 22, comprising at least two disconnection holes formed in the substrate between loops in the first coil, wherein at least one disconnection hole goes through a shunt bar which had been connecting at least two loops in the first coil.

24. The device of claim 22, wherein the first metal pattern comprises m loops, and the device comprises n disconnection holes, where n is an integer of from m/2 to (m−

1).

25. The device of claim 24, wherein the second metal pattern comprises p loops, and the device comprises q disconnection holes, where q is an integer of from p/2 to (p−

1).

26. The device of claim 24, wherein the second metal pattern comprises p loops, and the device comprises n+q disconnection holes, where q is an integer of from p/2 to (p−

1).

27. The device of claim 26, wherein m=p and q=n.

28. The device of claim 22, wherein the locations of the disconnection holes are a sufficient distance from each other to provide mechanically support any material subsequently formed on the substrate between the disconnection holes.

29. An antenna for a high frequency device comprising:

a) a substrate including a connection hole formed through the substrate;

b) a first metal pattern on a first side of a substrate, the first metal pattern comprising a first coil; and

c) a second metal pattern on a second side of the substrate opposite to the first side, wherein the first metal pattern is coupled to the second metal pattern through a connection formed in said connection hole, and wherein the first metal pattern comprises a shunt bar connecting at least two loops in the first coil.