LED Structure and Fabricating Method for the same
First Claim
1. A light emitting diode (LED) structure, comprising:
- a substrate;
a light emitting die, mounted on said substrate; and
a fluorescent layer made of fluorescent substance and having a thickness between 20 and 60 um, said fluorescent layer uniformly covering a top surface of said light emitting die.
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Abstract
A method is performed for the fabrication of LED and its structure. The LED is capable of emitting uniform white light and includes a substrate, an LED die, a holding frame and fluorescent substance where the holding frame is of hollow shape. The LED contains a die emitting blue light, and the fluorescent substance is a yellow phosphor. As the LED die is mounted on the substrate, the holding frame is seated on the die, and a bond wiring is performed. The holding frame is filled with the fluorescent substance in a uniform distribution on the die to form a layer of fluorescence. Finally the structure of the LED is accomplished as the packaging is completed.
7 Citations
31 Claims
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1. A light emitting diode (LED) structure, comprising:
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a substrate;
a light emitting die, mounted on said substrate; and
a fluorescent layer made of fluorescent substance and having a thickness between 20 and 60 um, said fluorescent layer uniformly covering a top surface of said light emitting die. - View Dependent Claims (2)
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3. A light emitting diode (LED) structure, comprising:
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a substrate;
a light emitting die, mounted on said substrate;
a holding frame, being of a hollow shape and encircling a top surface of said light emitting die; and
a fluorescent layer, uniformly covering the top surface of said light emitting die. - View Dependent Claims (4, 5, 6, 7, 8, 9)
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10. A method of fabricating an LED structure including a substrate, a light emitting die mounted on the substrate, a holding frame being of hollow shape and encircling top surface of said light emitting die, and a fluorescent layer uniformly covering the top surface of said light emitting die, the method comprising the steps of:
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providing a semi-finished LED product furnished with said light emitting die;
locating said holding frame on rim of said light emitting die and around said light emitting die and performing a wire bonding;
filling said holding frame with fluorescent substance uniformly on said die to form a fluorescent layer; and
proceeding with packaging to accomplish the LED structure. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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17. A light emitting diode (LED) structure, comprising:
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a substrate;
a light emitting die, mounted on said substrate, having a concave space at center and a wall on rim thereof; and
a fluorescent layer, uniformly covering top surface of said light emitting die. - View Dependent Claims (18, 19)
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20. A method of fabricating a LED structure including a substrate, a light emitting die mounted on said substrate and having a concave space at center thereof and a wall on rim thereof and a fluorescent layer uniformly covering top surface of said light emitting die, the method comprising the steps of:
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providing a semi-finished LED product;
mounting said die which has a concave space at the center on the semi-finished LED and performing a wire bonding step;
filling the concave space with fluorescent substance and uniformly spreading the fluorescent substance on said light emitting die to form a fluorescent layer; and
proceeding packaging to accomplish the LED structure. - View Dependent Claims (21)
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22. A light emitting diode (LED) structure, comprising:
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a substrate, said substrate having a planar surface;
a barrier, being located on the planar surface of said substrate;
a light emitting die, mounted inside of said barrier; and
a fluorescent layer, covering top surface of said die. - View Dependent Claims (23, 24, 25, 26)
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27. A method of fabricating a LED structure including a substrate having a planar surface, a barrier being located on the planar surface of said substrate, a light emitting die mounted inside of said barrier and a fluorescent layer covering top surface of said die, the method comprising the steps of:
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providing a semi-finished LED product furnished with said barrier;
mounting said LED die inside said barrier;
filling said barrier with fluorescent substance and uniformly spreading said fluorescent substance on said die to form a fluorescent layer;
proceeding with packaging to accomplish the LED structure. - View Dependent Claims (28, 29, 30, 31)
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Specification