LED Structure and Fabricating Method for the same

• US 20070262713A1
• Filed: 05/12/2006
• Published: 11/15/2007
• Est. Priority Date: 05/12/2006
• Status: Active Grant

• Current Assignee: Hung-Hsun Chou, Hung-Ta Laio, Kuo-Shih Hsu, Pao-Shen Chen, Tsung-Ting Sun
• Original Assignee: Hung-Hsun Chou, Hung-Ta Laio, Kuo-Shih Hsu, Pao-Shen Chen, Tsung-Ting Sun
• Inventors: Sun, Tsung-Ting, Chou, Hung-Hsun, Laio, Hung-Ta, Hsu, Kuo-Shih, Chen, Pao-Shen
• Granted Patent: US 7,755,282 B2
• Time in Patent Office: Days
• US Class Current: 313/512
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05B 33/10 Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
• CPC Class Codes: H05B 33/145 Arrangements of the electroluminescent material
• CPC Class Codes: H05B 33/22 characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers

Abstract

A method is performed for the fabrication of LED and its structure. The LED is capable of emitting uniform white light and includes a substrate, an LED die, a holding frame and fluorescent substance where the holding frame is of hollow shape. The LED contains a die emitting blue light, and the fluorescent substance is a yellow phosphor. As the LED die is mounted on the substrate, the holding frame is seated on the die, and a bond wiring is performed. The holding frame is filled with the fluorescent substance in a uniform distribution on the die to form a layer of fluorescence. Finally the structure of the LED is accomplished as the packaging is completed.

Claims

1. A light emitting diode (LED) structure, comprising:

a substrate;

a light emitting die, mounted on said substrate; and

a fluorescent layer made of fluorescent substance and having a thickness between 20 and 60 um, said fluorescent layer uniformly covering a top surface of said light emitting die.

2. An LED structure as in claim 1, wherein said substrate is a semi-finished LED product.

3. A light emitting diode (LED) structure, comprising:

a substrate;

a light emitting die, mounted on said substrate;

a holding frame, being of a hollow shape and encircling a top surface of said light emitting die; and

a fluorescent layer, uniformly covering the top surface of said light emitting die.

4. An LED structure as in claim 3, wherein said substrate is a semi-finished LED product.

5. An LED structure as in claim 3, wherein said holding frame is made of insulation material.

6. An LED structure as in claim 3, wherein said holding frame is made of silicone.

7. An LED structure as in claim 3, wherein said holding frame is located on the top surface of said light emitting die.

8. An LED structure as in claim 3, wherein said holding frame is located on rim of said light emitting die.

9. An LED structure as in claim 3, wherein said fluorescent layer has a thickness between 20 and 60 um.

10. A method of fabricating an LED structure including a substrate, a light emitting die mounted on the substrate, a holding frame being of hollow shape and encircling top surface of said light emitting die, and a fluorescent layer uniformly covering the top surface of said light emitting die, the method comprising the steps of:

providing a semi-finished LED product furnished with said light emitting die;

locating said holding frame on rim of said light emitting die and around said light emitting die and performing a wire bonding;

filling said holding frame with fluorescent substance uniformly on said die to form a fluorescent layer; and

proceeding with packaging to accomplish the LED structure.

11. A method as in claim 10, wherein said holding frame is made of insulation material.

12. A method as in claim 10, wherein said holding frame is made of silicone.

13. A method as in claim 10, wherein said holding frame is located on the top surface of said light emitting die.

14. A method as in claim 10, wherein said holding frame is located on the rim of said light emitting die.

15. A method as in claim 10, wherein said fluorescent layer has a thickness between 20 and 60 um.

16. A method as in claim 10, wherein the step of locating said holding frame further comprises

removing said holding frame.

17. A light emitting diode (LED) structure, comprising:

a substrate;

a light emitting die, mounted on said substrate, having a concave space at center and a wall on rim thereof; and

a fluorescent layer, uniformly covering top surface of said light emitting die.

18. An LED structure as in claim 17, wherein said substrate is a semi-finished LED product.

19. An LED structure as in claim 17, wherein said fluorescent layer has a thickness between 20 and 60 um.

20. A method of fabricating a LED structure including a substrate, a light emitting die mounted on said substrate and having a concave space at center thereof and a wall on rim thereof and a fluorescent layer uniformly covering top surface of said light emitting die, the method comprising the steps of:

providing a semi-finished LED product;

mounting said die which has a concave space at the center on the semi-finished LED and performing a wire bonding step;

filling the concave space with fluorescent substance and uniformly spreading the fluorescent substance on said light emitting die to form a fluorescent layer; and

proceeding packaging to accomplish the LED structure.

21. A method as in claim 20, wherein the concave space is fabricated by one of lithography and etching processes.

22. A light emitting diode (LED) structure, comprising:

a substrate, said substrate having a planar surface;

a barrier, being located on the planar surface of said substrate;

a light emitting die, mounted inside of said barrier; and

a fluorescent layer, covering top surface of said die.

23. An LED structure as in claim 22, wherein said barrier is fabricated by injection molding.

24. An LED structure as in claim 22, wherein said barrier is a heat-resisting plastic.

25. An LED structure as in claim 22, wherein said barrier has a height greater than the thickness of said die.

26. An LED structure as in claim 22, wherein said fluorescent layer has a thickness between 20 and 60 um.

27. A method of fabricating a LED structure including a substrate having a planar surface, a barrier being located on the planar surface of said substrate, a light emitting die mounted inside of said barrier and a fluorescent layer covering top surface of said die, the method comprising the steps of:

providing a semi-finished LED product furnished with said barrier;

mounting said LED die inside said barrier;

filling said barrier with fluorescent substance and uniformly spreading said fluorescent substance on said die to form a fluorescent layer;

proceeding with packaging to accomplish the LED structure.

28. A method as in claim 27, wherein said barrier is fabricated by injection molding.

29. A method as in claim 27, wherein said barrier is an heat-resisting plastic.

30. A method as in claim 27, wherein said barrier has a height greater than the thickness of said die.

31. A method as in claim 27, wherein said fluorescent layer has a thickness between 20 and 60 um.