Device Comprising a Non-Detachable Electronic Device

• US 20070263368A1
• Filed: 10/20/2005
• Published: 11/15/2007
• Est. Priority Date: 11/03/2004
• Status: Abandoned Application

• Current Assignee: Gemplus (Thales SA)
• Original Assignee: Gemplus (Thales SA)
• Inventors: Ottobon, Stephane
• Application Number:
  US11/666,879
• Publication Number:
  US 20070263368A1
• Time in Patent Office: Days
• US Class Current: 361/760
• CPC Class Codes: G06K 19/07372 by detecting tampering with the circuit
• CPC Class Codes: G06Q 20/341 Active cards, i.e. cards including their own processing means, e.g. including an IC or chip
• CPC Class Codes: G07F 7/082 Features insuring the integrity of the data on or in the card
• CPC Class Codes: G07F 7/1008 Active credit-cards provided with means to personalise their use, e.g. with PIN-introduction/comparison system

Abstract

The invention relates to an electronic device comprising a module which is affixed to a support body by means of a layer of adhesive. According to the invention, the module comprises a support film having a first metallisation on an upper face and a printed circuit chip on a lower face, said chip being connected to the first metallisation through the film. The invention is characterised in that the device comprises a primer separation layer (9, 14) which is disposed between the lower face (10) and the chip (8). The invention is also characterised in that the primer separation layer adheres more to the adhesive layer than the film. The invention also relates to the associated modules.

Claims

1. An electronic device comprising a module affixed to a support body by means of an insertion adhesive layer, said module comprising a support film having a first metallisation on an upper face and a printed circuit chip on a lower face, said chip being connected to the first metallisation through the film,

further comprising a primer separation layer arranged between the lower face and the chip wherein the layer adheres more to the insertion adhesive layer than to the film.

2. A device according to claim 1, wherein the primer separation layer presents a force of adhesion to the dielectric of less than 8 N/cm.

3. A device according to claim 1, wherein the primer separation layer presents a force of adhesion to the dielectric of between 3 and 5 N/cm.

4. A device according to claim 1, wherein the primer separation layer presents adhesion to the adhesive greater than 10 N/cm.

5. A device according to claim 1, wherein the primer separation layer forms a second metallisation of the film.

6. A device according to claim 5, wherein the chip is also connected to the second metallisation.

7. A device according to claim 6, wherein the second metallisation presents a spiralled antenna pattern.

8. An electronic module comprising a support film having a first metallisation on an upper face and a printed circuit chip connected to the first metallisation through the film, further comprising a non-metallic primer separation layer arranged between the lower face and the chip.

9. An electronic module comprising a support film having a first metallisation on an upper face and a printed circuit chip on a lower face, said chip being connected to the first metallisation through the film, further comprising a primer separation layer arranged between the lower face and the chip presenting resistance to peeling of between approximately 1 and 5 N/cm.

10. A module according to claim 9, wherein the primer separation layer comprises a second metallisation of the film.

11. A module according to claim 10, wherein the chip is also connected to the second metallisation, said second metallisation presenting a spiralled antenna pattern.

12. A printed circuit comprising a metallisation on a dielectric plate and at least one electric/electronic component connected to said metallisation, further comprising a primer separation layer placed between the component and the dielectric plate.