THIN FILM BATTERY ON AN INTEGRATED CIRCUIT OR CIRCUIT BOARD AND METHOD THEREOF

• US 20070264564A1
• Filed: 05/14/2007
• Published: 11/15/2007
• Est. Priority Date: 03/16/2006
• Status: Abandoned Application

• Current Assignee: Sapurast Research LLC
• Original Assignee: Infinite Power Solutions, Inc. (Apple Inc.)
• Inventors: SNYDER, Shawn, BRANTNER, Paul, NEUDECKER, Bernd, BRADOW, Timothy, JOHNSON, Raymond
• Application Number:
  US11/748,471
• Publication Number:
  US 20070264564A1
• Time in Patent Office: Days
• US Class Current: 429/161
• CPC Class Codes: H01L 23/58 Structural electrical arrangements for semiconductor devices not otherwise provided for , e.g. in combination with batteries H01L23/49593, H01L23/49596 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01M 10/0436 Small-sized flat cells or batteries for portable equipment
• CPC Class Codes: H01M 10/052 Li-accumulators
• CPC Class Codes: H01M 10/0525 Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
• CPC Class Codes: H01M 10/0562 Solid materials
• CPC Class Codes: H01M 10/0585 of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
• CPC Class Codes: H01M 10/425 Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing printed circuits H05K1/00
• CPC Class Codes: H01M 2220/30 Batteries in portable systems, e.g. mobile phone, laptop
• CPC Class Codes: H01M 2300/0068 inorganic
• CPC Class Codes: H01M 50/534 characterised by the material of the leads or tabs
• CPC Class Codes: H01M 6/40 Printed batteries , e.g. thin film batteries
• CPC Class Codes: Y02E 60/10 Energy storage using batteries
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/4911 including sealing
• CPC Class Codes: Y10T 29/49114 including adhesively bonding

Abstract

The present invention relates to flexible thin film batteries on semiconducting surface or the conductive or insulating packaging surface of a semiconductor device and methods of constructing such batteries. Electrochemical devices may be glued to a semiconducting surface or the conductive or insulating packaging surface of a semiconductor device or deposited directly thereon. The invention also relates to flexible thin film batteries on flexible printed circuit boards where the electrochemical devices may also be glued or deposited on the flexible printed circuit board.

Claims

1. An integrated circuit including a battery, comprising:

a first electrical contact;

a bonding layer coupled with said first electrical contact and comprising at least one embedded conductor;

at least one battery cell structure in selective electrical contact with said first electrical contact via said at least one embedded conductor; and

a semiconducting surface or the conductive or insulating packaging surface of a semiconductor device;

wherein said bonding layer and said at least one battery cell structure are sandwiched between said first contact layer and said semiconducting surface or the conductive or insulating surface of a semiconductor device.

2. The integrated circuit of claim 1, further comprising said first electrical contact in selective electrical contact with the semiconducting surface or the conductive or insulating packaging surface of a semiconductor device via at least one embedded conductor.

3. The integrated circuit of claim 1, wherein said first electrical contact further comprises an encapsulate metal.

4. The integrated circuit of claim 1, wherein said semiconducting surface or the conductive or insulating packaging surface of a semiconductor device acts as an encapsulate of said at least one battery cell structure.

5. The integrated circuit of claim 1, wherein said bonding layer comprises a material selected from the group comprising an adhesive material, an insulating material, plastic, glass, Kevlar®

, reinforcement materials, and fiberglass.

6. The integrated circuit of claim 1, wherein said embedded conductor is selected from the group consisting of a tab, a wire, metal strip, a metal ribbon multiple wires, multiple metal strips, multiple metal ribbons, a wire mesh, perforated metal, a metal coating applied to the adhesive layer, and a disk.

7. The integrated circuit of claim 1, wherein said conductor is woven within said bonding layer.

8. The integrated circuit of claim 7, wherein said bonding layer comprises a slit within which said embedded conductor is woven.

9. The integrated circuit of claim 1, wherein said first contact comprises a material selected from the group consisting of gold, platinum, stainless steel, titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, zirconium, aluminum, indium, nickel, copper, silver, carbon, bronze, brass, beryllium, and oxides, nitrides, carbides and alloys thereof.

10. The integrated circuit of claim 1, wherein said battery cell structure comprises at least:

an anode,

an electrolyte; and

a cathode.

11. The integrated circuit of claim 10, wherein said cathode is annealed.

12. The integrated circuit of claim 10 wherein said cathode is crystallized.

13. The integrated circuit of claim 1, wherein the first contact acts as a positive terminal of said battery cell structure.

14. The integrated circuit of claim 1, wherein the first contact acts as a negative terminal of said battery cell structure.

15. The integrated circuit of claim 1, further comprising a barrier layer between said battery cell structure and said semiconducting surface or the conductive or insulating surface of a semiconductor device.

16. The integrated circuit of claim 1, wherein said first contact comprises a metal foil.

17. The integrated circuit of claim 1, further comprising a plurality of battery cell structures stacked one upon another with at least one metal foil encapsulating each battery cell structure.

18. The integrated circuit of claim 1, wherein portions of said first contact are coated with an insulating material.

19. The integrated circuit of claim 1, wherein said battery cell structure further comprising a substrate sandwiched between said battery cell structure and said first electrical contact.

20. The integrated circuit of claim 1, further comprising an encapsulate sandwiched between said bonding layer and said first electrical contact.

68. An apparatus an comprising integrated circuit including a battery, said integrated circuit including a battery selected from the integrated circuits including a battery of claims 1 and 21.

69. The apparatus of claim 68, wherein said apparatus is selected from a computer, cell phone, calculator, appliance, memory device, camera, smart card, identification tag, and computer peripheral hardware.

21. An integrated circuit including a battery, comprising:

a semiconducting device having a surface;

a bonding layer coupled with said surface of said semiconductor device, said bonding layer comprising at least one embedded conductor;

at least one battery cell structure in selective electrical contact with said surface of a semiconductor device via said at least one embedded conductor; and

a first electrical contact;

wherein said bonding layer and said at least one battery cell structure are sandwiched between said surface of said semiconductor device and said first contact layer.

22. The integrated circuit device of claim 21, wherein said surface of said semiconducting device is selected from a semiconducting surface, a conductive surface and an insulating packaging surface.

23. The integrated circuit of claim 21, further comprising said surface of said semiconductor device in selective electrical contact with said first electrical contact via said at least one embedded conductor.

24. The integrated circuit of claim 21, further comprising a barrier layer between said battery cell structure and said first electrical contact.

25. The integrated circuit of claim 21, wherein said battery cell structure further comprising a substrate sandwiched between said battery cell structure and said first electrical contact.

26. The integrated circuit of claim 21, further comprising an encapsulate sandwiched between said bonding layer and said surface of said semiconductor device.

27. A method of manufacturing a battery on a semiconducting surface or the conductive or insulating surface of a semiconductor device comprising:

creating a selectively conductive bonding layer;

coupling said bonding layer with a first contact layer;

coupling a first side of a battery cell structure with a semiconducting surface or the conductive or insulating surface of a semiconductor device; and

coupling a second side of said battery cell structure with said bonding layer.

28. The method of claim 27, wherein said step of coupling a first side of a battery cell structure with a semiconducting surface or the conductive or insulating surface of a semiconductor device comprises gluing a first side of a battery cell structure with a semiconducting surface or the conductive or insulating surface of a semiconductor device.

29. The method of claim 27, further comprising depositing a cathode on said semiconducting surface or the conductive or insulating packaging surface of a semiconductor device.

30. The method of claim 29, further comprising crystallizing said cathode with a laser.

31. The method of claim 29, further comprising annealing said cathode via rapid thermal anneal.

32. A method of manufacturing a battery on a first electrical contact comprising:

creating a selectively conductive bonding layer;

coupling said bonding layer with a surface of a semiconductor device;

coupling a first side of a battery cell structure with a first electrical contact; and

coupling a second side of said battery cell structure with said bonding layer.

33. The method of claim 32, further comprising selecting the surface of the semiconductor device from a group of a semiconducting surface, a conductive surface and an insulating surface.

34. The method of claim 32, wherein said step of coupling a first side of a battery cell structure with a first electrical contact comprises gluing a first side of a battery cell structure with a first electrical contact.

35. The method of claim 32, further comprising fabricating a substrate that is sandwiched between said first side of the battery cell structure and first electrical contact.

36. The method of claim 32, further comprising fabricating an encapsulate that is sandwiched between said bonding layer and said semiconducting surface or the conductive or insulating surface of a semiconductor device.

37. A battery on a flexible printed circuit board, comprising:

a first electrical contact;

a bonding layer coupled with said first electrical contact and comprising at least one embedded conductor;

at least one battery cell structure in selective electrical contact with said first electrical contact via said at least one embedded conductor; and

a flexible printed circuit board;

wherein said bonding layer and said at least one battery cell structure are sandwiched between said first contact layer and said flexible printed circuit board.

38. The battery on flexible printed circuit board of claim 37, further comprising said first electrical contact in selective electrical contact with the flexible printed circuit board via at least one embedded conductor.

39. The battery on a flexible printed circuit board of claim 37, wherein said flexible printed circuit board is selected from the group consisting of multiple circuit board layers with and without traces, single sided printed circuit board, double sided printed circuit board, and a semi-rigid printed circuit board.

40. The battery on a flexible printed circuit board of claim 37, wherein said flexible printed circuit board comprises a polyimide film.

41. The battery on a flexible printed circuit board of claim 37, wherein said first electrical contact further comprises an encapsulate metal.

42. The battery on a flexible printed circuit board of claim 37, wherein said bonding layer comprises a material selected from the group comprising an adhesive material, an insulating material, plastic, glass, Kevlar®

, reinforcement materials, and fiberglass.

43. The battery on a flexible printed circuit board of claim 37, wherein said conductor is selected from the group consisting of a tab, a wire, metal strip, a metal ribbon multiple wires, multiple metal strips, multiple metal ribbons, a wire mesh, perforated metal, a metal coating applied to the adhesive layer, and a disk.

44. The battery on a flexible printed circuit board of claim 37, wherein said conductor is woven within said bonding layer.

45. The battery on a flexible printed circuit board of claim 37, wherein said bonding layer comprises a slit within which said embedded conductor is woven.

46. The battery on a flexible printed circuit board of claim 37, wherein said first contact comprises a material selected from the group consisting of gold, platinum, stainless steel, titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, zirconium, aluminum, indium, nickel, copper, silver, carbon, bronze, brass, beryllium, and oxides, nitrides, carbides and alloys thereof.

47. The battery on a flexible printed circuit board of claim 37, wherein said battery cell structure comprises at least:

an anode,

an electrolyte; and

a cathode.

48. The battery on a flexible printed circuit board of claim 47, wherein said cathode is annealed.

49. The battery on a flexible printed circuit board of claim 47, wherein said cathode is crystallized.

50. The battery on a flexible printed circuit board of claim 37, further comprising a barrier layer between said battery cell structure and said semiconducting surface or the conductive or insulating surface of a semiconductor device.

51. The battery on a flexible printed circuit board of claim 37, wherein said first contact comprises a metal foil.

52. The battery on a flexible printed circuit board of claim 37, further comprising a plurality of battery cell structures stacked one upon another with at least one metal foil encapsulating each battery cell structure.

53. The battery on a flexible printed circuit board of claim 37, wherein portions of said first contact are coated with an insulating material.

70. An apparatus comprising a battery on flexible printed circuit board, said battery on flexible printed circuit board selected from the batteries on flexible printed circuit boards of claims 37, and 54.

71. The apparatus of claim 70, wherein said apparatus is selected from a computer, cell phone, calculator, appliance, memory device, camera, smart card, identification tag, and computer peripheral hardware.

54. A battery on a flexible printed circuit board, comprising:

a flexible printed circuit board;

a bonding layer coupled with said flexible printed circuit board and comprising at least one embedded conductor;

at least one battery cell structure in selective electrical contact with said flexible printed circuit board via said at least one embedded conductor; and

a first electrical contact;

wherein said bonding layer and said at least one battery cell structure are sandwiched between said flexible printed circuit board and said first contact layer.

55. The battery on a flexible printed circuit board of claim 54, including said flexible printed circuit board in selective electrical contact with first electrical contact via at least one embedded conductor.

56. The battery on a flexible printed circuit board of claim 54, further comprising a barrier layer between said battery cell structure and said first electrical contact.

57. The battery on a flexible printed circuit board of claim 54, wherein said battery cell structure further comprises a substrate sandwiched between said battery cell structure and said first electrical contact.

58. The battery on a flexible printed circuit board of claim 54, further comprising an encapsulate sandwiched between said bonding layer and said flexible printed circuit board.

59. A method of manufacturing a battery on a flexible printed circuit board comprising:

creating a selectively conductive bonding layer;

coupling said bonding layer with a first contact layer;

coupling a first side of a battery cell structure with a flexible printed circuit board; and

coupling a second side of said battery cell structure with said bonding layer.

60. The method of claim 59, wherein said step of coupling a first side of a battery cell structure with a flexible printed circuit board comprises gluing a first side of a battery cell structure with a flexible printed circuit board.

61. The method of claim 59, further comprising depositing a cathode on said flexible printed circuit board.

62. The method of claim 61, further comprising crystallizing said cathode with a laser.

63. The method of claim 61, further comprising annealing said cathode via rapid thermal anneal.

64. A method of manufacturing a battery on flexible printed circuit board comprising:

creating a selectively conductive bonding layer;

coupling said bonding layer with a flexible printed circuit board;

coupling a first side of a battery cell structure with a first electrical contact; and

coupling a second side of said battery cell structure with said bonding layer.

65. The method of claim 64, wherein said step of coupling a first side of a battery cell structure with a first electrical contact comprises gluing a first side of a battery cell structure with a first electrical contact.

66. The method of claim 64, further comprising fabricating a substrate that is sandwiched between said first side of the battery cell structure and said first electrical contact.

67. The method of claim 64, further comprising fabricating an encapsulate that is sandwiched between said bonding layer and said semiconducting surface or the conductive or insulating surface of a semiconductor device.