ARTICLE AND METHOD FOR PROVIDING A SEAL FOR AN ENCAPSULATED DEVICE

• US 20070267210A1
• Filed: 05/18/2007
• Published: 11/22/2007
• Est. Priority Date: 05/19/2006
• Status: Active Grant

• Current Assignee: Schweitzer Engineering Laboratories, Incorporated
• Original Assignee: Schweitzer Engineering Laboratories, Incorporated
• Inventors: Kesler, James R., Feight, Laurence Virgil
• Granted Patent: US 7,683,261 B2
• Time in Patent Office: Days
• US Class Current: 174/50.570
• CPC Class Codes: H05K 5/069 Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft

Abstract

An article for providing a sealing engagement between an electronic component and an encapsulate material is provided, wherein the electronic component extends from the encapsulate material. The article includes a housing including at least one opening for receiving the electronic component. The housing is filled with an encapsulate material such that it provides a seal between the housing and the electrical component. A sealing member is further disposed between the encapsulate material and the housing. A compression member is provided which exerts force onto the sealing member such that the sealing member engages the encapsulate material to provide a sealing engagement therebetween, and thereby provide a secondary seal between the housing and the electronic component.

Claims

1. An article for providing a sealing engagement between an electronic component and an encapsulate material, the electronic component extending from the encapsulate material including:

a housing including at least one opening for receiving the electronic component,

an encapsulate material disposed in relation to the opening of the housing, a portion of the encapsulate material providing a seal between the housing and the electrical component,

a sealing member disposed between another portion of the encapsulate material and the housing,

a compression member disposed in relation to the sealing member, said compression member exerting force onto the sealing member such that the sealing member engages the other portion encapsulate material to provide a sealing engagement therebetween, thereby providing a secondary seal between the housing and the electronic component.

2. The article of claim 1 wherein the compression member exerts a lateral force onto the sealing member such that the sealing member engages the other portion of the encapsulate material laterally.

3. The article of claim 1, wherein the compression member exerts a longitudinal force onto the sealing member such that the sealing member engages the other portion of the encapsulate material longitudinally.

4. The article of claim 1, wherein the compression member further engages the housing at a location in relation to the opening of the housing.

5. The article of claim 4, wherein the sealing member further engages both the compression member and the housing at a location in relation to the opening of the housing.

6. The article of claim 4, wherein the opening of the housing further includes an external shoulder and wherein the compression member further includes an engagement member for engaging the compression member to the external shoulder of the housing, thereby providing an external seal at the opening of the housing.

7. The article of claim 1, wherein the sealing member is further disposed in relation to the electronic component and wherein the compression member further exerts force onto the sealing member such that the sealing member engages the electronic component to provide a sealing engagement there between.

8. The article of claim 1, wherein the compression member further engages the electronic component to provide a sealing engagement therebetween.

9. The article of claim 1, wherein the encapsulate material is a potting material.

10. The article of claim 1, wherein the potting material is selected from the group consisting of an epoxy based material, an urethane based material, a silicone based material, an acrylic based material, and a polyester based material.

11. The article of claim 1, wherein the housing includes a latching member for securing the compression member thereto.

12. The article of claim 1, wherein the electronic component is a cable.

13. The article of claim 1, wherein the housing protects a radio interface unit.

14. The article of claim 13, wherein the radio interface unit communicates with a power system device.

15. The article of claim 13, wherein the electronic component is a cable which communicates with an external antenna.

16. The article of claim 14, wherein the electronic component is a cable which communicates with an external antenna to communicate power system data to an RF receiver.

17. The article of claim 1, wherein the housing protects an internal electronic component in the form of internal electrical circuitry.

19. The article of claim 1, wherein the electronic component is a cable.

20. A method for providing a sealing engagement between an electronic component and an encapsulate material, including the steps of

inserting the electronic component into the opening of the housing,

filling the housing with an encapsulate material such that the encapsulate material provides a sealing engagement between the electronic component and the housing

disposing a sealing member in relation to the encapsulate material such that the sealing member provides a seal between the encapsulate material and the housing, and

exerting force onto the sealing member to improve the engagement between the encapsulate material and the electronic component.

21. The method of claim 20, further comprising exerting a lateral force onto the gasket such that the sealing member engages a portion of the encapsulate material laterally.

22. The method of claim 20, further comprising exerting a longitudinal force onto the gasket such that the sealing member engages a portion of the encapsulate material longitudinally.

23. The method of claim 20, wherein the electronic component is a cable.

24. The method of claim 20, further comprising disposing a compression member in relation to the sealing member for exerting force onto the sealing member.

25. The method of claim 21, wherein the encapsulate material is a potting material.