Semiconductor light emitting diode and method of manufacturing the same
First Claim
1. A semiconductor light emitting diode comprising:
- a substrate;
an n-type nitride semiconductor layer that is formed on the substrate;
an active layer that is formed on the n-type nitride semiconductor layer;
a p-type nitride semiconductor layer that is formed on the active layer;
a first undoped GaN layer that is formed on the p-type nitride semiconductor layer;
an AlGaN layer that is formed on the first undoped GaN layer so as to provide a two-dimensional electron gas layer to the interface with the first undoped GaN layer;
a second undoped GaN layer that is formed on the AlGaN layer and has irregularities such that the light generated in the active layer is not internally reflected toward the active layer;
a p-type transparent electrode that is formed on the second undoped GaN layer; and
an n-type electrode and p-type bonding electrode that are formed to be respectively connected onto the n-type nitride semiconductor layer and the p-type transparent electrode.
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Abstract
The present invention relates to a semiconductor light emitting diode. The semiconductor light emitting diode includes a substrate; an n-type nitride semiconductor layer that is formed on the substrate; an active layer that is formed on the n-type nitride semiconductor layer; a p-type nitride semiconductor layer that is formed on the active layer; a first undoped GaN layer that is formed on the p-type nitride semiconductor layer; an AlGaN layer that is formed on the first undoped GaN layer so as to provide a two-dimensional electron gas layer to the interface with the first undoped GaN layer; a second undoped GaN layer that is formed on the AlGaN layer and has irregularities such that the light generated in the active layer is not internally reflected toward the active layer; a p-type transparent electrode that is formed on the second undoped GaN layer; and an n-type electrode and p-type electrode that are formed to be respectively connected onto the n-type nitride semiconductor layer and the p-type transparent electrode.
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Citations
12 Claims
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1. A semiconductor light emitting diode comprising:
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a substrate; an n-type nitride semiconductor layer that is formed on the substrate; an active layer that is formed on the n-type nitride semiconductor layer; a p-type nitride semiconductor layer that is formed on the active layer; a first undoped GaN layer that is formed on the p-type nitride semiconductor layer; an AlGaN layer that is formed on the first undoped GaN layer so as to provide a two-dimensional electron gas layer to the interface with the first undoped GaN layer; a second undoped GaN layer that is formed on the AlGaN layer and has irregularities such that the light generated in the active layer is not internally reflected toward the active layer; a p-type transparent electrode that is formed on the second undoped GaN layer; and an n-type electrode and p-type bonding electrode that are formed to be respectively connected onto the n-type nitride semiconductor layer and the p-type transparent electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of manufacturing a semiconductor light emitting diode comprising:
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forming an n-type nitride semiconductor layer on a substrate; forming an active layer on the n-type nitride semiconductor layer; forming a p-type nitride semiconductor layer on the active layer; mesa-etching portions of the p-type nitride semiconductor layer and the active layer so as to expose a portion of the n-type nitride semiconductor layer; forming the first undoped GaN layer on the p-type nitride semiconductor layer; forming an AlGaN layer on the first undoped GaN layer so that a two-dimensional electron gas layer is formed in the interface with the first undoped GaN layer; forming a second undoped GaN layer on the AlGaN layer; selectively etching the second undoped GaN layer so as to form irregularities such that the light generated in the active layer is not internally reflected toward the active layer; forming a p-type transparent electrode on the second undoped GaN layer having the irregularities; and forming an n-type electrode and p-type bonding electrode on the exposed n-type nitride semiconductor layer and the p-type transparent electrode, respectively. - View Dependent Claims (11, 12)
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Specification