System and Method for Making Lab Card by Embossing

• US 20070267782A1
• Filed: 06/11/2007
• Published: 11/22/2007
• Est. Priority Date: 11/02/2005
• Status: Active Grant

• Current Assignee: Affymetrix, Inc. (Thermo Fisher Scientific Incorporated)
• Original Assignee: Affymetrix, Inc. (Thermo Fisher Scientific Incorporated)
• Inventors: Gao, Chuan, Yamamoto, Melvin
• Granted Patent: US 8,007,267 B2
• Time in Patent Office: Days
• US Class Current: 264/320
• CPC Class Codes: B01L 2200/025 Align devices or objects to ensure defined positions relative to each other
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/0816 Cards, e.g. flat sample carriers usually with flow in two horizontal directions
• CPC Class Codes: B01L 2300/123 Flexible; Elastomeric
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: Y10S 977/887 Nanoimprint lithography, i.e. nanostamp

Abstract

In one aspect of the invention, systems, methods, and devices are provided for creating microfluidic and nanofluidic structures. In some embodiments, such systems, methods, and devices are used to create features with high aspect ratios in lab cards.

Claims

1. An apparatus for constructing at least one hole in a substrate comprising:

a mold structure having a top plate, middle plate and a back plate with at least one pin that will penetrate a substrate material during embossing;

a delay mechanism, wherein the delay mechanism is keeping the pin from penetrating through the substrate into a microfeature;

at least two alignment pins, wherein the alignment pins are aligning the top, middle and back plates; and

a heater to heat the mold structure and the substrate to the desired temperature such that the substrate become soft and flowing allowing the mold to be filled with the substrate material and activating the delay mechanism to penetrate the pin through the substrate wherein the substrate is now soft such that the pin is not damaged while constructing at least one hole in the substrate.

2. A method according to claim 1, wherein the hole has a high aspect ratio.

3. A method according to claim 2, wherein the aspect ratio is in the range of 1 to 20.

5. A method according to claim 2, wherein the aspect ratio is in the range of 1 to 50.

6. A method according to claim 2, wherein the aspect ratio is in the range of 1 to 100.

7. A method according to claim 1, wherein the substrate material is a material with a glass transition temperature.

8. A method according to claim 7, wherein the material with a glass transition temperature is thermoplastic.

9. A method according to claim 1, wherein the delay mechanism comprises at least one heating component.

10. A method according to claim 9, wherein the heating component is at least two spacers.

11. A method according to claim 8, wherein the spacers have the same glass transition temperature as the substrate.

12. A method for constructing at least one hole in a substrate comprising:

providing a mold structure having a top plate, middle plate and a back plate with at least one pin that will penetrate a substrate material during embossing;

providing a delay mechanism, wherein the delay mechanism is keeping the pin from penetrating through the substrate into a microfeature;

aligning the top, middle and back plates with at least two alignment pins;

holding the substrate between the top plate and the middle plate;

heating the mold structure and the substrate to the desired temperature such that the substrate becomes soft and flowing;

activating the delay mechanism to penetrate the pin through the substrate wherein the substrate is now soft such that the pin is not damaged while constructing at least one hole in the substrate.

13. A method according to claim 12, wherein the hole has a high aspect ratio.

14. A method according to claim 13, wherein the aspect ratio is in the range of 1 to 20.

15. A method according to claim 14, wherein the aspect ratio is in the range of 1 to 50.

16. A method according to claim 14, wherein the aspect ratio is in the range of 1 to 100.

17. A method according to claim 12, wherein the substrate material is a material with a glass transition temperature.

18. A method according to claim 17, wherein the material with a glass transition temperature is thermoplastic.

19. A method according to claim 12, wherein the delay mechanism comprises at least one heating component.

20. A method according to claim 19, wherein the heating component is at least two spacers.

21. A method according to claim 18, wherein the spacers have the same glass transition temperature as the substrate.

22. A system for constructing at least one hole in a substrate comprising:

a mold structure having a top plate, middle plate and a back plate with at least one pin that will penetrate a substrate material during embossing;

a delay mechanism, wherein the delay mechanism is keeping the pin from penetrating through the substrate into a microfeature;

at least two alignment pins, wherein the alignment pins are aligning the top, middle and back plates;

a heater to heat the mold structure and the substrate to the desired temperature such that the substrate become soft and flowing allowing the mold to be filled with the substrate material and activating the delay mechanism to penetrate the pin through the substrate wherein the substrate is now soft such that the pin is not damaged while constructing at least one hole in the substrate; and

a computer for controlling at least one operation as described above.

23. A system according to claim 22, wherein the hole has a high aspect ratio.

24. A system according to claim 23, wherein the aspect ratio is in the range of 1 to 20.

25. A system according to claim 23, wherein the aspect ratio is in the range of 1 to 50.

26. A system according to claim 23, wherein the aspect ratio is in the range of 1 to 100.

27. A system according to claim 22, wherein the substrate material is a material with a glass transition temperature.

28. A system according to claim 27, wherein the material with a glass transition temperature is thermoplastic.

29. A system according to claim 22, wherein the delay mechanism comprises at least one heating component.

30. A system according to claim 29, wherein the heating component is at least two spacers.

31. A system according to claim 28, wherein the spacers have the same glass transition temperature as the substrate.