Ultrasound Transducer and Method for Implementing High Aspect Ration Bumps for Flip-Chip Two Dimensional Arrays

• US 20070267945A1
• Filed: 08/15/2005
• Published: 11/22/2007
• Est. Priority Date: 08/18/2004
• Status: Abandoned Application

• Current Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Sudol, Wojtek
• Application Number:
  US11/573,753
• Publication Number:
  US 20070267945A1
• Time in Patent Office: Days
• US Class Current: 310/334
• CPC Class Codes: B06B 1/0629 Square array
• CPC Class Codes: G01S 15/8925 the array being a two-dimensional transducer configuration, i.e. matrix or orthogonal linear arrays
• CPC Class Codes: G01S 7/52079 Constructional features constructional features of transducers B06B; mounting transducers G10K11/00; constructional features of ultrasonic medical diagnostic devices A61B8/44
• CPC Class Codes: G01S 7/5208 with integration of processing functions inside probe or scanhead
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/1147 using a lift-off mask
• CPC Class Codes: H01L 2224/11902 Multiple masking steps
• CPC Class Codes: H01L 2224/13016 in side view
• CPC Class Codes: H01L 2224/1308 being stacked
• CPC Class Codes: H01L 2224/13083 Three-layer arrangements
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/81903 by means of a layer connector
• CPC Class Codes: H01L 2224/83102 using surface energy, e.g. capillary forces
• CPC Class Codes: H01L 2224/838 Bonding techniques
• CPC Class Codes: H01L 2224/83851 being an anisotropic conductive adhesive
• CPC Class Codes: H01L 2224/92125 the second connecting process involving a layer connector
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: Y10T 29/42 : Piezoelectric device making

Abstract

An ultrasound transducer (100) comprises an integrated circuit (52) and an array of acoustic elements (92,94,96) coupled to the integrated circuit via flip chip bumps (76,78). The flip chip bumps comprise high aspect ratio bumps having an aspect ratio greater than 1:1. The aspect ratio comprises a ratio of a bump height (82) to a bump width (84).

Claims

1. An ultrasound transducer (100), comprising:

an integrated circuit (52); and

an array of acoustic elements (92,94,96) coupled to the integrated circuit via flip chip bumps (76,78), wherein the flip chip bumps comprise high aspect ratio bumps having an aspect ratio greater than 1;

1, further wherein the aspect ratio comprises a ratio of a bump height (82) to a bump width (84).

2. The ultrasound transducer of claim 1, further wherein the high aspect ratio bumps comprise at least two layered portions (62,68,74) of flip-chip bumps.

3. The ultrasound transducer of claim 2, further wherein a height (82) of the high-aspect ratio bumps comprises a sum of a height of each layer portion of the at least two layered portions of flip-chip bumps.

4. The ultrasound transducer of claim 2, wherein a width dimension (88) of an uppermost layered portion of the flip-chip bumps is on the order of less than 50% of a width dimension of a lowermost layered portion of the flip-chip bumps.

5. The ultrasound transducer of claim 1, wherein the high-aspect ratio flip-chip bumps have a pitch on the order of 100 μ

m.

6. The ultrasound transducer of claim 2, wherein first layered portions (62) of flip-chip bumps (76,78) are formed by a process of photoresist deposition, mask patterning, and etch processing to form openings in a first layer of photoresist at locations of the flip-chip bumps for the first layer, followed by electrolytic deposition of the a flip-chip bump material, wherein the electrolytic deposition fills the openings in the first layer of photoresist.

7. The ultrasound transducer of claim 6, wherein the flip-chip bump material comprises metal.

8. The ultrasound transducer of claim 6, further wherein next layered portions (68) of flip-chip bumps (76,78) are formed by a process of photoresist deposition, mask patterning, and etching processing to form openings in a next layer of photoresist at locations of the flip-chip bumps for the next layer, followed by electrolytic deposition of the a flip-chip bump material, wherein the electrolytic deposition fills the openings in the next layer of photoresist.

9. The ultrasound transducer of claim 8, further wherein the openings in the next layer are smaller than the openings in the first layer.

10. The ultrasound transducer of claim 2, wherein a first layered portion (62) has a first width dimension and a subsequent layered portion (68,74) has a subsequent width dimension, the subsequent width dimension being less than the first width dimension.

11. The ultrasound transducer of claim 1, wherein the flip chip bumps (132,134) further comprise high-aspect ratio electroformed metal features.

12. The ultrasound transducer of claim 11, further wherein the electroformed metal features are formed using an x-ray deep etch lithography process.

13. The ultrasound transducer of claim 1, wherein the high aspect ratio bumps (76,78) further comprise one of two (2), three (3), or four (4) step plated bumps.

14. The ultrasound transducer of claim 1, wherein the flip chip bumps further comprise stud bumps of a first layer and stud bumps of a next layer, the stud bumps of the next layer being coupled on top of corresponding stud bumps of a previous layer.

15. The ultrasound transducer of claim 14, further wherein the stud bumps of a next layer comprise bumps with a smaller width dimension than a width dimension of the stud bumps of a previous layer.

16. The ultrasound transducer of claim 14, further wherein the flip chip bumps comprise multiple layer gold ball bonding stud bumps.

17. The ultrasound transducer of claim 1, further comprising a matrix transesophageal transducer designed for ultrasound heart imaging through an esophageal wall and further comprising on the order of 2,500 to 3,000 acoustic elements.

18. An ultrasound diagnostic imaging system (110) adapted for use with an ultrasound transducer (100), said ultrasound transducer comprising:

an integrated circuit (52); and

an array of piezoelectric elements (92,94,96) coupled to the integrated circuit via flip chip bumps (76,78), wherein the flip chip bumps comprise high aspect ratio bumps having an aspect ratio greater than 1;

1, further wherein the aspect ratio comprises a ratio of a bump height (82) to a bump width (84).

19. A method of fabricating an ultrasound transducer (100), comprising:

forming an array of flip chip bumps (76,78) on an integrated circuit (52), the flip chip bumps comprising high aspect ratio bumps having an aspect ratio greater than 1;

1; and

coupling an array of piezoelectric elements (92,94,96) to the integrated circuit via the high aspect ratio bumps.

20. The method of claim 19, wherein the high aspect ratio bumps comprise at least two layered portions of flip-chip bumps.

21. The method of claim 20, wherein a width dimension of an uppermost layered portion of the flip-chip bumps is on the order of less than 50% of a width dimension of a lowermost layered portion of the flip-chip bumps.

22. The method of claim 20, wherein first layered portions of flip-chip bumps are formed by a process of photoresist deposition, mask patterning, and etch processing to form openings in a first layer of photoresist at locations of the flip-chip bumps for the first layer, followed by electrolytic deposition of the a flip-chip bump material, wherein the electrolytic deposition fills the openings in the first layer of photoresist, and further wherein next layered portions of flip-chip bumps are formed by a process of photoresist deposition, mask patterning, and etching processing to form openings in a next layer of photoresist at locations of the flip-chip bumps for the next layer, followed by electrolytic deposition of the a flip-chip bump material, wherein the electrolytic deposition fills the openings in the next layer of photoresist.

23. The method of claim 19, wherein the flip chip bumps further comprise high-aspect ratio electroformed metal features.

24. The method of claim 23, further wherein the electroformed metal features are formed using an x-ray deep etch lithography process.

25. The method of claim 19, wherein the high aspect ratio bumps further comprise one of two (2), three (3), or four (4) step plated bumps.

26. The method of claim 19, wherein the flip chip bumps further comprise stud bumps of a first layer and stud bumps of a next layer, the stud bumps of the next layer being coupled on top of corresponding stud bumps of a previous layer, further wherein the stud bumps of a next layer comprise bumps with a smaller width dimension than a width dimension of the stud bumps of a previous layer.

27. The method of claim 19, wherein the integrated circuit has a thickness on the order of approximately 5-50 μ

m.

28. A semiconductor wafer, comprising:

one or more integrated circuit die; and

an array of high aspect ratio flip-chip bumps coupled to a surface of the one or more integrated circuit die, wherein the high aspect ratio of the flip-chip bumps is greater than 1;

1.

29. The semiconductor wafer of claim 28, wherein the high aspect ratio is on the order of 10:

1.

30. The semiconductor wafer of claim 28, further comprising an array of acoustic elements of one or more ultrasound transducers, the array of acoustic elements being coupled to the one or more integrated circuit die via the high aspect ratio flip chip bumps, further wherein the one or more integrated circuit die includes circuitry for performing at least one of control processing and signal processing functions of an ultrasound transducer.

31. The semiconductor wafer of claim 28, further wherein the high aspect ratio bumps comprise at least two layered portions of flip-chip bumps.

32. The semiconductor wafer of claim 31, wherein a width dimension of an uppermost layered portion of the flip-chip bumps is on the order of less than 50% of a width dimension of a lowermost layered portion of the flip-chip bumps.

33. The semiconductor wafer of claim 31, wherein first layered portions of flip-chip bumps are formed by a process of photoresist deposition, mask patterning, and etch processing to form openings in a first layer of photoresist at locations of the flip-chip bumps for the first layer, followed by electrolytic deposition of the a flip-chip bump material, wherein the electrolytic deposition fills the openings in the first layer of photoresist, and further wherein next layered portions of flip-chip bumps are formed by a process of photoresist deposition, mask patterning, and etching processing to form openings in a next layer of photoresist at locations of the flip-chip bumps for the next layer, followed by electrolytic deposition of the a flip-chip bump material, wherein the electrolytic deposition fills the openings in the next layer of photoresist.

34. The semiconductor wafer of claim 28, wherein the flip chip bumps further comprise high-aspect ratio electroformed metal features.

35. The semiconductor wafer of claim 34, further wherein the electroformed metal features are formed using an x-ray deep etch lithography process.

36. The semiconductor wafer of claim 28, wherein the high aspect ratio bumps further comprise one of two (2), three (3), or four (4) step plated bumps.

37. The semiconductor wafer of claim 28, wherein the flip chip bumps further comprise stud bumps of a first layer and stud bumps of a next layer, the stud bumps of the next layer being coupled on top of corresponding stud bumps of a previous layer, further wherein the stud bumps of a next layer comprise bumps with a smaller width dimension than a width dimension of the stud bumps of a previous layer.