Kind of superconductive heat cooler package of vacuum used in computer CPU (Central Processing Unit)

• US 20070268668A1
• Filed: 05/19/2006
• Published: 11/22/2007
• Est. Priority Date: 05/19/2006
• Status: Abandoned Application

• Current Assignee: Fu-Hsing Hsieh, I-Ming Lin
• Original Assignee: Fu-Hsing Hsieh, I-Ming Lin
• Inventors: Lin, I-Ming, Hsieh, Fu-Hsing
• Application Number:
  US11/385,593
• Publication Number:
  US 20070268668A1
• Time in Patent Office: Days
• US Class Current: 361/697
• CPC Class Codes: F28D 15/00 Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies F28D17/00, F28D19/00, F28D20/00 take precedence
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28F 1/32 the means having portions engaging further tubular elements
• CPC Class Codes: F28F 13/00 Arrangements for modifying heat-transfer, e.g. increasing, decreasing F28F1/00 - F28F11/00 take precedence
• CPC Class Codes: F28F 2013/001 Particular heat conductive materials, e.g. superconductive elements
• CPC Class Codes: F28F 21/08 of metal
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

This is a type of superconductive vacuum heat cooler package used in computer CPU (Central Processing Unit). This invention dissipates heat through invented metal pipe materials and formula in single direction to achieve effective cooling result. This invention is to be utilized but not limited to computer Central Processing Unit.

Claims

1. A method of dissipating heat through invented metal pipe and liquid formula in single direction. The heat is pushed toward the cold end in single direction and the cool air does not need to flow down to the computer CPU to carry more heat. The new invention does not need the full heat flow cycle to dissipate heat.

A method of claim involves testing the metal pipes with various temperature and high-end CPU in the world.

A method of claim involves experimenting with different formula to allow fast dissipation result.

2. A method of dissipating heat without any angle restriction of cooler package. The superconductive vacuum cooler can be placed in any angle without being effected by outside environment. This is due to heat will dissipate toward cool end (location of the fan) in single direction only.

A method of claim involves testing this package on computer CPU in various angle. This results in this package can be utilized in various electronic products not limited to computer CPU.