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Heat sink electronic package having compliant pedestal

  • US 20070268671A1
  • Filed: 05/16/2006
  • Published: 11/22/2007
  • Est. Priority Date: 05/16/2006
  • Status: Active Grant
First Claim
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1. An electronic package comprising:

  • a substrate;

    an electronic device mounted on the substrate, the electronic device having electrical circuitry, a first surface and a second surface oppositely disposed from the first surface;

    a thermally conductive heat sink assembled over the electronic device, the heat sink comprising a compliant pedestal comprising a contact surface for contacting the second surface of the electronic device to conduct thermal energy away from the electronic device; and

    a holder for holding the contact surface of the heat sink in contact with the second surface of the electronic device such that the compliant pedestal compresses to apply a compressive force to the second surface of the electronic device.

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