Chamfered Memory Card

• US 20070270040A1
• Filed: 05/05/2006
• Published: 11/22/2007
• Est. Priority Date: 05/05/2006
• Status: Abandoned Application

• Current Assignee: Amkor Technology Incorporated
• Original Assignee: Amkor Technology Incorporated
• Inventors: Lee, Choon, Park, Chul, Kim, Jae, Jang, Sang, Choi, Jong
• Application Number:
  US11/381,877
• Publication Number:
  US 20070270040A1
• Time in Patent Office: Days
• US Class Current: 439/660
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 2201/09154 Bevelled, chamferred or tapered edge
• CPC Class Codes: H05K 2201/2018 Presence of a frame in a printed circuit or printed circuit assembly

Abstract

A memory card including a printed circuit board having an electronic circuit device mounted thereto and at least one I/O pad disposed thereon. The printed circuit board and the electronic circuit device are at least partially encapsulated or covered by an encapsulant material which hardens into a body of the memory card, such body generally defining the outer appearance of the memory card. The I/O pads of the printed circuit board are exposed in the body. The body is formed to include one or more chamfers. Such chamfer(s) are sized and configured to minimize potential damage to the connection terminals or host socket of a device during the process of interfacing the memory card thereto.

Claims

1. A memory card comprising:

a circuit board including an insulative layer having at least one I/O pad formed thereon and defining opposed front and back sides;

at least one electronic circuit device mounted to the circuit board and electrically connected to the I/O pad; and

a body covering the electronic circuit device and a portion of the circuit board such that the I/O pad is uncovered by the body and at least the front side of the insulative layer is covered thereby, the body including;

a top surface;

a bottom surface;

a front side surface which extends between the top and bottom surfaces in close proximity to the front side of the insulative layer, the front side and bottom surfaces being separated by a front corner; and

a chamfer which is formed in at least a portion of the front corner and extends at a prescribed angle relative to the front side and bottom surfaces of the body.

2. The memory card of claim 1 wherein the body is fabricated from an encapsulant material comprising a resin having spherical fillers distributed therein and extending to the chamfer.

3. The memory card of claim 1 wherein the insulative layer includes a plurality of I/O pads which extend along and in close proximity to the front side of the insulative layer.

4. The memory card of claim 3 wherein:

the I/O pads include an outer pair which are separated from each by a prescribed distance; and

the chamfer has a width which is not less than the prescribed distance separating the outer pair of the I/O pads from each other.

5. The memory card of claim 3 wherein the chamfer comprises a plurality of sub-chamfers which are generally aligned with respective ones of the I/O pads.

6. The memory card of claim 5 wherein:

each of the I/O pads is of a prescribed width; and

each of the sub-chamfers has a maximum width which is not less than the prescribed width of each of the I/O pads.

7. The memory card of claim 5 wherein each of the sub-chamfers has a generally quadrangular configuration when viewed from the front side surface of the body.

8. The memory card of claim 7 wherein each of the sub-chamfers is of gradually decreasing width from the front side surface of the body toward a respective one of the I/O pads.

9. The memory card of claim 5 wherein each of the sub-chamfers has a generally triangular configuration when viewed from the front side surface of the body.

10. The memory card of claim 1 wherein the body further covers the back side of the insulative layer and includes:

a back side surface which extends between the top and bottom surfaces in close proximity the back side of the insulative layer, the back side and bottom surfaces being separated by a back corner; and

a second chamfer which is formed in a least a portion of the back corner and extends at a prescribed angle relative to the back side and bottom surfaces of the body.

11. The memory card of claim 10 wherein the insulative layer includes a plurality of I/O pads which are each disposed in substantially equidistantly spaced relation to the front and back sides of the insulative layer.

12. The memory card of claim 10 wherein the chamfer and the second chamfer are identically configured to each other.

13. (canceled)

14. (canceled)

15. (canceled)

16. (canceled)

17. (canceled)

18. (canceled)

19. (canceled)

20. A memory card for use in conjunction with a device defining a socket which includes a plurality of connection terminals, the memory card comprising:

a circuit board including an insulative layer having at least one I/O pad formed thereon and defining opposed front and back sides;

at least one electronic circuit device mounted to the circuit board and electrically connected to the I/O pad; and

a body covering the electronic circuit device and a portion of the circuit board such that the I/O pad is uncovered by the body and at least the front side of the insulative layer is covered thereby, the body including;

a top surface;

a bottom surface;

a front side surface which extends between the top and bottom surfaces in close proximity the front side of the insulative layer, the front side and bottom surfaces being separated by a front corner; and

a means which is formed in at least a portion of the front corner for minimizing potential damage to the connection terminals during the process of advancing the memory card into the socket of the device.

21. A memory card comprising:

a circuit board including at least one I/O pad and defining opposed front and back sides;

at least one electronic circuit device disposed on the circuit board and electrically connected to the I/O pad; and

a body covering the electronic circuit device and at least the front side of the circuit board, the body including a bottom surface and a front side surface, at least portions of the front side and bottom surfaces being separated from each other by a beveled edge which extends at a prescribed angle relative thereto.

22. The memory card of claim 21 wherein the body further includes a top surface, and the front side surface extends generally perpendicularly between the top and bottom surfaces.

23. The memory card of claim 21 wherein the circuit board includes a plurality of I/O pads which extend along and in close proximity to the front side thereof.

24. The memory card of claim 23 wherein:

the I/O pads include an outer pair which are separated from each by a prescribed distance; and

the beveled edge has a width which is not less than the prescribed distance separating the outer pair of the I/O pads from each other.

25. The memory card of claim 21 wherein the body further covers the back side of the circuit board and includes a back side surface, at least portions of the back side and bottom surfaces being separated from each other by a second beveled edge which extends at a prescribed angle relative thereto.

26. The memory card of claim 25 wherein the body further includes a top surface, and the front and back side surfaces each extend generally perpendicularly between the top and bottom surfaces.

27. The memory card of claim 25 wherein the circuit board includes a plurality of I/O pads which are each disposed in substantially equidistantly spaced relation to the front and back sides thereof.