Molding device for an expandable interspinous process implant

• US 20070270829A1
• Filed: 04/28/2006
• Published: 11/22/2007
• Est. Priority Date: 04/28/2006
• Status: Active Grant

• Current Assignee: Warsaw Orthopedic Incorporated (Medtronic Plc)
• Original Assignee: SDGI Holdings Incorporated (Medtronic Plc)
• Inventors: Bruneau, Aurelien, Carls, Thomas, Lim, Roy, Anderson, Kent, Trieu, Hai, Lange, Eric
• Granted Patent: US 8,252,031 B2
• Time in Patent Office: Days
• US Class Current: 606/249
• CPC Class Codes: A61B 17/7065 Devices with changeable shape, e.g. collapsible or having retractable arms to aid implantation; Tools therefor
• CPC Class Codes: A61B 2017/00557 inflatable A61B2017/22051 takes precedence
• CPC Class Codes: B29C 33/26 by pivotal movement
• CPC Class Codes: B29C 45/03 Injection moulding apparatus transfer moulding B29C45/02
• CPC Class Codes: B29K 2105/0035 Medical or pharmaceutical agents
• CPC Class Codes: B29L 2031/753 Medical equipment; Accessories therefor bloodbags, medical bags B29L2031/7148; artificial eyes B29L2011/0008

Abstract

A molding device is disclosed and can include a first mold component and a second mold component substantially opposite the first mold component. The first mold component and the second mold component can fit around a superior spinous process and an inferior spinous process.

Claims

1. A molding device, the molding device comprising:

a first mold component; and

a second mold component substantially opposite the first mold component,

wherein the first mold component and the second mold component are configured to fit around a superior spinous process and an inferior spinous process.

2. The molding device of claim 1, wherein the molding device is configured to receive an implant between the first mold component and the second mold component.

3. The molding device of claim 2, wherein the first mold component includes an interior surface and the second mold component includes an interior surface and wherein the interior surface of the first mold component, the interior surface of the second mold component, the superior spinous process, and the inferior spinous process create a mold area into which the implant can be expanded.

4. A molding device, the molding device comprising:

a first mold component; and

a second mold component substantially opposite the first mold component,

wherein the first mold component and the second mold component are rotatable between an open position and a closed position, wherein the molding device is configured to be placed around an unmolded implant, a superior spinous process, and an inferior spinous process.

5. The molding device of claim 4, wherein in the closed position the molding device is configured to mold the unmolded implant at least partially around the superior spinous process and the inferior spinous process.

6. The molding device of claim 5, wherein the first mold component includes an interior surface and the second mold component includes an interior surface and wherein the interior surface of the first mold component and the interior surface of the second mold component are configured to mold the unmolded implant at least partially around the superior spinous process and the inferior spinous process.

7. A kit for field use, comprising:

a molding device configured to be placed around a superior spinous process and an inferior spinous process; and

an expandable interspinous process implant configured to be placed between the superior spinous process and the inferior spinous process within the molding device.

8. A kit for field use, comprising:

an unmolded interspinous process implant configured to be placed between a superior spinous process and an inferior spinous process; and

a molding device configured to be placed around the unmolded interspinous process implant.

9. The kit of claim 8, wherein the molding device is movable between an open position, wherein the molding device is configured to be placed around the unmolded interspinous process implant, the superior spinous process, and the inferior spinous process, and a closed position wherein the unmolded interspinous process implant is molded within the molding device at least partially around the superior spinous process and the inferior spinous process.

10. A molding device, the molding device comprising:

a first arm;

a first mold component attached to the first arm;

a second arm substantially opposite the first arm; and

a second mold component attached to the second arm, wherein the first mold component and the second mold component are configured to fit around a superior spinous process and an inferior spinous process.

11. The molding device of claim 10, wherein the molding device is configured to receive the implant between the first mold component and the second mold component.

12. The molding device of claim 11, wherein the first mold component includes an interior surface and the second mold component includes an interior surface and wherein the interior surface of the first mold component, the interior surface of the second mold component, the superior spinous process, and the inferior spinous process create a mold area into which the implant can be expanded.

13. The molding device of claim 11, wherein the first mold component and the second mold component form an open-ended, barrel-shaped mold and the implant can expand out of the open-ended, barrel-shaped mold to distract the superior spinous process and the inferior spinous process.

14. A molding device, the molding device comprising:

a first arm;

a first mold component attached to the first arm;

a second arm substantially opposite the first arm; and

a second mold component attached to the second arm, wherein the molding device is rotatable between an open position and a closed position, wherein the molding device is configured to be placed around an implant, a superior spinous process, and an inferior spinous process.

15. The molding device of claim 14, wherein in the closed position, the implant can be expanded within the molding device and can at least partially conform to a volume bound by the first mold component, the second mold component, the superior spinous process, and the inferior spinous process.

16. The molding device of claim 14, wherein in the closed position, the first mold component and the second mold component form an open-ended, barrel-shaped mold and the implant can expand out of the open-ended, barrel-shaped mold to distract the superior spinous process and the inferior spinous process.

17. The molding device of claim 14, wherein the first mold component comprises an opening configured to allow an injection tube from the implant to extend therethrough.

18. The molding device of claim 14, wherein the second mold component comprises an opening configured to allow an injection tube from the implant to extend therethrough.

19. The molding device of claim 14, wherein the first mold component comprises an opening and the second mold component forms an opening and wherein the openings are configured to allow the molding device to close around an injection tube from the implant.

20. A method of treating a spine, comprising:

installing an expandable interspinous process implant between a superior spinous process and an inferior spinous process;

installing a molding device around the expandable interspinous process; and

expanding the expandable interspinous process implant to distract the superior spinous process and the inferior spinous process.

21. The method of claim 20, wherein the expandable interspinous process at least partially conforms to a volume bound by the molding device, the superior spinous process, and the inferior spinous process.

22. The method of claim 21, further comprising:

curing an injectable biocompatible material within the expandable interspinous process implant.

23. The method of claim 22, further comprising:

rotating the molding device from closed position to an open position;

24. The method of claim 23, further comprising:

removing the molding device.