High density integrated circuit apparatus, test probe and methods of use thereof

• US 20070271781A9
• Filed: 08/03/2001
• Published: 11/29/2007
• Est. Priority Date: 10/19/1992
• Status: Abandoned Application

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: GlobalFoundries, Inc.
• Inventors: Shih, Da-Yuan, Fogel, Keith, Norcott, Maurice, Walker, George, Lauro, Paul, Beaman, Brian
• Application Number:
  US09/921,867
• Publication Number:
  US 20020014004A1
• Time in Patent Office: Days
• US Class Current: 29/842
• CPC Class Codes: G01R 1/06711 Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
• CPC Class Codes: G01R 1/0675 Needle-like
• CPC Class Codes: G01R 1/07307 with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
• CPC Class Codes: G01R 1/07314 the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support on an elastic support, e.g. a film, G01R1/0735
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07371 using an intermediate card or back card with apertures through which the probes pass
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/45155 Nickel (Ni) as principal constituent
• CPC Class Codes: H01L 2224/45164 Palladium (Pd) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/78301 : Capillary
• CPC Class Codes: H01L 2224/85205 : Ultrasonic bonding
• CPC Class Codes: H01L 2224/85214 : using a laser
• CPC Class Codes: H01L 23/49827 : Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/5384 : Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors H01L23/5383, H01L23/5385 take precedence; pins attached to insulating substrates H01L23/49811
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15192 : Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/1627 : stacked type assemblies, e.g. stacked multi-cavities
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01L 2924/20754 : larger or equal to 40 microns less than 50 microns
• CPC Class Codes: H01L 2924/20755 : larger or equal to 50 microns less than 60 microns
• CPC Class Codes: H01L 2924/20756 : larger or equal to 60 microns less than 70 microns
• CPC Class Codes: H01L 2924/20757 : larger or equal to 70 microns less than 80 microns
• CPC Class Codes: H01L 2924/20758 : larger or equal to 80 microns less than 90 microns
• CPC Class Codes: H01L 2924/20759 : larger or equal to 90 microns less than 100 microns
• CPC Class Codes: H01L 2924/2076 : equal to or larger than 100 microns
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: Y10S 29/029 : Molding with other step
• CPC Class Codes: Y10T 29/49004 : including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49147 : Assembling terminal to base
• CPC Class Codes: Y10T 29/49149 : by metal fusion bonding
• CPC Class Codes: Y10T 29/49158 : with molding of insulated base
• CPC Class Codes: Y10T 29/49162 : by using wire as conductive path
• CPC Class Codes: Y10T 29/49192 : with insulation removal
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate

Abstract

The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed ion the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

Claims

1. An electronic device probe for probing an electronic device comprising:

a first space transformer having a first surface;

said first surface having a first plurality of contact locations;

a first plurality of elongated electrical conductors each having a protuberance at one end thereof;

said protuberance of each of said plurality of elongated conductors is bonded to one of said plurality of contact locations;

each of said plurality of elongated conductors extends outwardly away from said surface to form an array of elongated conductors;

said array of elongated conductors being embedded in a material; and

said elongated conductors having exposed probe tip ends at an exposed surface of said material.

2. An electronic device probe according to claim 1, further including a second space transformer in electrical connection with said first space transformer.

3. An electronic device probe according to claim 1, wherein said material is compliant.

4. An electronic device probe according to claim 1, wherein said material is rigid.

5. An electronic device probe according to claim 1, wherein said first space transformer has a second surface with a second plurality of contact locations;

a second plurality of elongated conductors each in electrical communication with said second plurality of contact locations, each of said second plurality of elongated conductors extends away from said second surface.

6. An electronic device probe according to claim 1, wherein said first space transformer has a second surface with a second plurality of contact locations thereon and said second space transformer has a surface with a plurality of third contact thereon.

7. An electronic device probe according to claim 6, further including an electrical interconnection means for electrically interconnecting said second plurality of electrical contact locations to said third plurality of electrical contact locations.

8. An electronic device probe according to claim 7, wherein said electrical interconnection means is a plurality of pins electrically connected to said second plurality of contact locations said pins are adapted for insertion into a socket which is electrically interconnected with said third plurality of contact locations.

9. An electronic device probe according to claim 7, wherein said electrical interconnection means comprises a body of elastomeric material having a fourth side and fifth side, a plurality of elongated conductors extending from said fourth side to said fifth side, each of said elongated conductors has a first end at said fourth side and a second end at said fifth side, said first ends are in electrical contact with said third plurality of contact locations and said second ends are in contact with said second plurality of contact locations.

10. An electronic device probe according to claim 7, further including a holding means for holding said first space transformer in a fixed spatial relationship with respect to said second space transformer.

11. An electronic device probe according to claim 10, wherein said holding means comprises an elongated member having a first end and second, said elongated member is fixedly attached to said second space transformer at said first end, there being a gripping means at said second end for gripping onto said first space transformer.

12. An electronic device probe according to claim 1, further including a means for disposing said probe tip ends in electrical contact with contact locations on said electronic device.

13. An electronic device probe according to claim 1, wherein said elastomeric material has a depression surrounding at least one of said probe tip ends.

14. An electronic device probe according to claim 1, wherein said probe tip ends extend beyond said exposed surface of said elastomeric material.

15. An electronic device probe according to claim 1, wherein said probe is part of an electronic device test tool.

16. An electronic device probe according to claim 10, further including a means for disposing said probe tip ends in electrical contact with contact locations on said electronic device.

17. An electronic device probe according to claim 1, wherein said electronic device is selected from the group consisting of a semiconductor chip and a semiconductor chip packaging substrate and a semiconductor wafer.

18. An electronic device probe according to claim 1, wherein said protuberance is selected from the group consisting of a wire bond ball bond, a solder bump bond and a laser weld bond.

19. An electronic device probe according to claim 7, wherein said electrical interconnection means is an interposer between said first space transformer and said second space transformer.

24. An electronic device probe according to claim 1, wherein said electronic device is selected from the group consisting of an integrated circuit chip, a wafer of a plurality of integrated circuit chips and a circuitized substrate.

20. An electronic device probe for probing an electronic device comprising:

a first space transformer having a surface;

said surface having a first plurality of contact locations;

a plurality of elongated electrical conductors each having a protuberance at one end thereof;

said each of said protuberance of each of said plurality of elongated conductors is bonded to one of said plurality of contact locations;

each of said plurality of elongated conductors extends outwardly away from said surface to form an array of elongated conductors;

said array of elongated conductors being embedded in an elastomeric material;

said elongated conductors being embedded in an elastomeric material;

a second space transformer in electrical connection with said first space transformer;

said first space transformer has a second surface with a second plurality of contact locations thereon and said second space transformer has a surface with a plurality of third contact thereon;

an electrical interconnection means for electrically interconnecting said second plurality of electrical contact locations to said third plurality of electrical contact locations;

a holding means for holding said first space transformer in a fixed spatial relationship with respect to said second space transformer; and

a means for disposing said probe tip ends in electrical contact with contact location on said electronic device.

21. An electronic device probe according to claim 20, wherein said holding means comprises an elongated member having a first end and second, said elongated member is fixedly attached to said second space transformer at said first end, there being a gripping means at said second end for gripping onto said first space transformer.

22. An electronic device probe according to claim 20, wherein said elastomeric material has a depression surrounding at least one of said probe tip ends.

23. An electronic device probe according to claim 20, wherein said electrical interconnection means is an interposer between said first space transformer and said second space transformer.

25. An apparatus for testing or burning in an electronic device having contact locations comprising:

a layer of elastomeric material having a first side and a second side;

a plurality of elongated electrical conductors extending from said first side to said second side;

means for holding said layer;

means for disposing said layer adjacent said electronic device so that said elongated electrical conductors are in electrical contact with said contact locations.

26. An apparatus according to claim 25, further including means selected from the group consisting of or applying electric current to said electronic device, voltage to said electronic device, temperature to said electronic device and humidity to said electronic device.

27. A method comprising:

providing an apparatus according to claim 25 and testings aid electronic device with said apparatus.

28. A method comprising:

providing an apparatus according to claims 26 and burning-in said electronic device with said apparatus.