Image sensor package having mount holder attached to image sensor die

• US 20070272827A1
• Filed: 04/27/2005
• Published: 11/29/2007
• Est. Priority Date: 04/27/2005
• Status: Abandoned Application

• Current Assignee: Amkor Technology Incorporated
• Original Assignee: Amkor Technology Incorporated
• Inventors: Lee, Won, Kim, Kyong, Heo, Byong
• Application Number:
  US11/116,631
• Publication Number:
  US 20070272827A1
• Time in Patent Office: Days
• US Class Current: 250/208.100
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

An image sensor package and a method for manufacturing the same are disclosed. For example, a mount holder is directly attached on an image sensor die, not a substrate. Here, on the mount holder, a lens or a barrel having lens are attached. Also, the mount holder is interlocked by an encapsulant, so that it is not easily separated from the image sensor. Accordingly, the width of the mount holder can be smaller than that of the image sensor die, so that the entire width of the image sensor package becomes smaller. Moreover, the electrically conductive wire is located at the outside of the mount holder and is perfectly surrounded by the encapsulant, thereby preventing the oxidization of the wire.

Claims

1. An image sensor package comprising:

an image sensor die comprising an approximately planar first surface, an approximately planar second surface opposed to the first surface, an image sensing region formed at an approximately center of the first surface, and at least one bond pad formed at an outside of the image sensing region;

a substrate attached to the second surface of the image sensor die;

at least one conductive wire electrically connecting the bond pad to the substrate;

a mount holder attached on the first surface of the image sensor die between an outside of the image sensing region and the bond pad;

at least one lens for transmitting external images to the image sensing region and located inside the mount holder; and

an encapsulant encapsulating the image sensor die located on an outside of the mount holder and the lens, the substrate, and the at least one conductive wire, wherein the encapsulant comprises an approximately planar first surface approximately perpendicular to a height direction of the mount holder and an approximately planar second surface approximately perpendicular to the first surface of the encapsulant at an end thereof, wherein the substrate comprises an approximately planar first surface bonded to the image sensor die and the electrically conductive wire, an approximately planar second surface opposed to the first surface of the substrate, and a third surface approximately flushed with the second surface of the encapsulant at an edge of the first and second surfaces of the substrate.

2. The image sensor package as claimed in claim 1, wherein a shape of the mount holder is an approximately hollow circular cylinder.

3. The image sensor package as claimed in claim 1, wherein a region of the mount holder is exposed to an outside of the encapsulant.

4. The image sensor package as claimed in claim 1, wherein the at least one lens is exposed to an external atmosphere.

5. The image sensor package as claimed in claim 1, wherein an infrared ray protection coating layer is formed at a surface of the at least one lens.

6. The image sensor package as claimed in claim 1, wherein an infrared ray protection glass is further bonded to an inside of the mount holder.

7. The image sensor package as claimed in claim 1, wherein a barrel having the at least one lens is further coupled to an inside of the mount holder.

8. The image sensor package as claimed in claim 7, wherein an infrared ray protection coating layer is formed at a surface of the at least one lens located at the inside of the barrel.

9. The image sensor package as claimed in claim 7, wherein a plurality of first screw threads is formed at an inside diameter surface of the mount holder and a plurality of second screw threads is formed at an outside diameter surface of the barrel coupled to the first screw threads.

10. The image sensor package as claimed in claim 7, wherein a protrusion protrudes inward from an inside of the mount holder at a lower end of the barrel and an infrared ray protection glass is bonded to the protrusion.

11. The image sensor package as claimed in claim 7, wherein the mount holder comprises a first portion bonded to the image sensor die, a second portion having a diameter larger than that of the first portion thereon, and a plurality of first screw threads formed at an inside diameter surface of the second portion.

12. The image sensor package as claimed in claim 11, wherein the barrel has a plurality of second screw threads formed at an outside diameter surface of the barrel.

13. The image sensor package as claimed in claim 11, wherein the first portion of the mount holder is encapsulated by the encapsulant.

14-19. -19. (canceled)

20. An image sensor assembly comprising:

image sensor dies comprising an approximately planar first surfaces, approximately planar second surfaces opposed to the first surfaces, image sensing regions formed at approximately centers of the first surfaces, and bond pads formed at outsides of the image sensing regions;

a substrate strip comprising a plurality of substrates in a strip, the substrate strip comprising substrates attached to the second surfaces of the image sensor dies;

conductive wires electrically connecting the bond pads to the substrates;

mount holders attached on the first surfaces of the image sensor dies between outsides of the image sensing regions and the bond pads;

lens for transmitting external images to the image sensing regions and located inside the mount holders; and

an encapsulant encapsulating the image sensor dies located on outsides of the mount holders and the lens, the substrates, and the conductive wires, the encapsulant filling spaces between the image sensor dies.

21. An image sensor package comprising:

an image sensor die having an image sensing region and bond pads at one surface thereof;

a mount holder directly attached on the image sensor die;

a substrate, the substrate comprising a first surface, a second surface opposite the first surface, and third surfaces approximately perpendicular to the first and second surfaces, the image sensor die being directly attached on the first surface of the substrate;

conductive wires electrically connecting the bond pads to the substrate; and

an encapsulant encapsulating the image sensor die and the conductive wires, the encapsulant located on an outside of the mount holder, the encapsulant having an approximately planar first surface and approximately planar second surfaces approximately perpendicular to the first surface of the encapsulant, the second surfaces of the encapsulant being flush with the third surfaces of the substrate.

22. The image sensor package as claimed in claim 21, wherein the mount holder is attached between an outside of the image sensing region and the bond pads.

23. The image sensor package as claimed in claim 21, wherein a barrel having at least one lens is further coupled to an inside of the mount holder.

24. The image sensor package as claimed in claim 23, wherein an infrared ray protection coating layer is formed at a surface of the at least one lens.