METHOD FOR FORMING RADIO FREQUENCY ANTENNA
First Claim
1. An RF antenna comprising:
- a substrate layer;
a seed layer on top of the substrate layer in an antenna coil pattern, the seed layer including bond pads;
a conductive layer contacting the seed layer over portions of the antenna coil pattern, wherein the conductive layer does not cover at least a portion of the bond pads.
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Accused Products
Abstract
A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.
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Citations
13 Claims
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1. An RF antenna comprising:
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a substrate layer;
a seed layer on top of the substrate layer in an antenna coil pattern, the seed layer including bond pads;
a conductive layer contacting the seed layer over portions of the antenna coil pattern, wherein the conductive layer does not cover at least a portion of the bond pads. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An RF antenna comprising:
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a substrate layer;
a seed layer on top of the substrate layer in an antenna pattern, the seed layer including bond pads;
a conductive layer contacting the seed layer over portions of the antenna pattern, wherein the conductive layer does not cover at least a portion of the bond pads. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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Specification