ELECTRONIC DEVICE AND HEAT DISSIPATION MODULE THEREOF

• US 20070274040A1
• Filed: 04/09/2007
• Published: 11/29/2007
• Est. Priority Date: 05/29/2006
• Status: Active Grant

• Current Assignee: ASUSTek Computer, Inc.
• Original Assignee: ASUSTek Computer, Inc.
• Inventors: Chen, Chien-Ying
• Granted Patent: US 7,433,189 B2
• Time in Patent Office: Days
• US Class Current: 361/695
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G11B 33/1406 Reducing the influence of the temperature
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20172 Fan mounting or fan specifications
• CPC Class Codes: Y10T 24/42 Independent, headed, aperture pass-through fastener

Abstract

A heat dissipation module is suitable for being assembled on a circuit board to dissipate the heat source on the circuit board. The heat dissipation module includes a holding unit, a fan and a cover unit. The holding unit is formed by a holder base and multiple first support posts extending from the holder base downwards, each of the first support posts has an elastic snap sleeve to be snapped in a snap hole and the elastic snap sleeve has an accommodation space. The fan is assembled on the holder base and the cover unit covers the fan and is assembled on the holding unit, and an end of each second support post of the fan has a snap tenon plugged in the accommodation space.

Claims

1. A heat dissipation module, suitable for being assembled in multiple snap holes on a circuit board to dissipate heat generated by at least one heat source disposed on the circuit board, the heat dissipation module comprising:

a holding unit, comprising a holder base and multiple first support posts formed from extending the holder base;

a fan, assembled on the holder base, for dissipating heat generated by the heat source; and

a cover unit, comprising a cover case for covering the fan and multiple second support posts corresponding to the first support posts, wherein the second support posts are respectively combined with the first support posts to assemble the fan between the holding unit and the cover unit.

2. The heat dissipation module as recited in claim 1, wherein each of the first support posts comprises an elastic snap sleeve, and wherein the elastic snap sleeves are snapped in the snap holes on the circuit board.

3. The heat dissipation module as recited in claim 2, wherein each of the elastic snap sleeves comprises an accommodation space, each of the second support posts comprises a snap tenon, and wherein the snap tenons are respectively disposed in the accommodation spaces.

4. The heat dissipation module as recited in claim 3, wherein each of the elastic snap sleeves comprises multiple split slots to shape multiple snappers out of the elastic snap sleeve, an end of each snapper respectively comprises a protrusion portion, and wherein the protrusion portions are snapped in the snap holes, wherein the split slots pass to the elastic snap sleeve itself.

5. The heat dissipation module as recited in claim 4, wherein each of the protrusion portions respectively has a slide facet and a latch facet, the snappers are plugged in the snap holes through the slide facets such that the latch facets hold a bottom surface of the circuit board for latching.

6. The heat dissipation module as recited in claim 1, wherein each of the first support posts respectively has a guiding portion to guide the corresponding second support post.

7. The heat dissipation module as recited in claim 1, wherein the fan has multiple first snap portions and the holding unit further comprises multiple second snap portions corresponding to the first snap portions to snap the first snap portions and the second snap portions together.

8. The heat dissipation module as recited in claim 7, wherein the first snap portions are locking holes, while the second snap portions are snap hooks.

9. The heat dissipation module as recited in claim 1, wherein the cover unit further comprises multiple third snap portions disposed at the cover case, the holding unit further comprises multiple fourth snap portions disposed at the holder base and the third snap portions and the fourth snap portions are snapped to each other.

10. An electronic device, comprising:

a circuit board, having multiple memory modules plugged and disposed thereon, comprising multiple snap holes located around the memory modules; and

a heat dissipation module, assembled on the circuit board, for dissipating heat generated by the memory modules on the circuit board, the heat dissipation module comprising;

a holding unit, comprising a holder base and multiple first support posts formed by extending the holder base, wherein the holding unit is assembled on the circuit board through the first support post;

a fan, assembled on the holder base, for dissipating heat generated by the heat source; and

a cover unit, comprising a cover case covering the fan and multiple second support posts corresponding to the first support posts, wherein the second support posts are respectively combined with the first support posts to assemble the fan between the holding unit and the cover unit.

11. The electronic device as recited in claim 10, wherein each of the first support posts further comprises an elastic snap sleeve and the elastic snap sleeves are snapped in the snap holes on the circuit board.

12. The electronic device as recited in claim 11, wherein each of the elastic snap sleeves comprises an accommodation space, each of the second support posts has a snap tenon and the snap tenons are respectively located in the accommodation spaces.

13. The electronic device as recited in claim 12, wherein each of the elastic snap sleeves comprises multiple split slots to shape multiple snappers out of the elastic snap sleeve, an end of each snapper respectively has a protrusion portion and the protrusion portions are snapped in the snap holes, wherein the split slots pass to the elastic snap sleeve itself.

14. The electronic device as recited in claim 13, wherein each of the protrusion portions respectively has a slide facet and a latch facet, the snappers are plugged in the snap holes through the slide facets and the latch facets hold a bottom surface of the circuit board for latching.

15. The electronic device as recited in claim 10, wherein each of the first support posts respectively comprises a guiding portion to guide the corresponding second support post.

16. The electronic device as recited in claim 10, wherein the fan comprises multiple first snap portions and the holding unit comprises multiple second snap portions corresponding to the first snap portions to snap the first snap portions and the second snap portions together.

17. The electronic device as recited in claim 16, wherein the first snap portions are locking holes, while the second snap portions are snap hooks.

18. The electronic device as recited in claim 10, wherein the cover unit further comprises multiple third snap portions disposed at the cover case, the holding unit further comprises multiple fourth snap portions disposed at the holder base and the third snap portions and the fourth snap portions are snapped to each other.