LIGHTING DEVICE AND METHOD OF MAKING

• US 20070274063A1
• Filed: 05/22/2007
• Published: 11/29/2007
• Est. Priority Date: 05/23/2006
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: LED Lighting Fixtures, Inc. (Wolfspeed, Inc.)
• Inventors: Negley, Gerald
• Granted Patent: US 7,718,991 B2
• Time in Patent Office: Days
• US Class Current: 362/84
• CPC Class Codes: B29C 39/025 for making multilayered articles
• CPC Class Codes: B29C 39/10 incorporating preformed parts or layers, e.g. casting around inserts or for coating articles coating a surface by casting in general B05D1/30, B29C39/126 takes precedence
• CPC Class Codes: B29C 39/34 for undercut articles
• CPC Class Codes: B29C 41/14 Dipping a core B29C41/10 takes precedence
• CPC Class Codes: B29L 2011/00 Optical elements, e.g. lenses, prisms
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

A lighting device comprises a solid state light emitter, first and second electrodes connected to the emitter, an encapsulant region comprising a silicone compound and a supporting region. The encapsulant region extends to an external surface of the lighting device. At least a portion of the first electrode is surrounded by the supporting region. The encapsulant region and the supporting region together define an outer surface which substantially encompasses the emitter. A method of making a lighting device, comprises electrically connecting first and second electrodes to an emitter; inserting the emitter into mold cavity; inserting an encapsulant composition comprising a one silicone compound; and then inserting a second composition to substantially surround at least a portion of the first electrode.

Claims

1. A lighting device, comprising:

at least one solid state light emitter;

at least a first electrode and a second electrode, said first electrode and said second electrode each being electrically connected to said solid state light emitter;

at least one encapsulant region comprising at least one silicone compound, said encapsulant region extending to an external surface of said lighting device;

at least one supporting region, at least a portion of said first electrode being surrounded by said supporting region;

said at least one encapsulant region and said at least one supporting region together defining a lighting device outer surface which substantially encompasses said solid state light emitter.

2. A lighting device as recited in claim 1, wherein at least a portion of said second electrode is also surrounded by said supporting region.

3. A lighting device as recited in claim 1, further comprising a reflective element, said solid state light emitter being mounted in said reflective element.

4. A lighting device as recited in claim 3, wherein said solid state light emitter comprises a light emitting diode.

5. A lighting device as recited in claim 3, further comprising at least one luminescence region, said luminescence region comprising at least one luminescent material, said luminescence region being positioned inside said reflective element.

6. A lighting device as recited in claim 1, wherein at least 50% of light emitted from said solid state light emitter does not enter said at least one supporting region.

7. A lighting device as recited in claim 1, wherein said supporting region comprises at least one epoxy compound.

8. A lighting device as recited in claim 1, further comprising at least one luminescence region, said luminescence region comprising at least one luminescent material.

9. A lighting device as recited in claim 8, wherein said luminescence region is in contact with said solid state light emitter.

10. A lighting device as recited in claim 1, wherein said solid state light emitter comprises a light emitting diode.

11. A method of making a lighting device, comprising:

electrically connecting at least first and second electrodes to a solid state light emitter to form a light emitter element;

inserting said light emitter element into a region located within a space defined by a mold cavity;

inserting into a first portion of said space an encapsulant composition comprising at least one silicone compound; and

then inserting into a second portion of said space a supporting region forming composition, whereby said supporting region forming composition substantially surrounds at least a portion of said first electrode,

whereby at least a portion of an outer surface of said at least one encapsulant composition and at least a portion of an outer surface of said at least one supporting region forming composition together define a combined encapsulant-supporting region outer surface which substantially encompasses said solid state light emitter.

12. A method as recited in claim 11, wherein at least a portion of said second electrode is also surrounded by said supporting region forming composition.

13. A method as recited in claim 11, wherein said electrically connecting said first and second electrodes to said solid state light emitter is performed before said inserting said light emitter element into said region located within said space defined by said mold cavity.

14. A method as recited in claim 11, wherein said inserting said light emitter element into said region located within said space defined by said mold cavity is performed before said inserting said encapsulant composition into said first portion of said space.

15. A method as recited in claim 11, further comprising at least partially curing said encapsulant composition before said inserting said supporting region forming composition into said second portion of said space.

16. A method as recited in claim 11, wherein said supporting region forming composition comprises at least one epoxy compound.