Electronic Circuit

• US 20070274198A1
• Filed: 08/17/2005
• Published: 11/29/2007
• Est. Priority Date: 08/24/2004
• Status: Active Grant

• Current Assignee: ThruChip Japan Inc.
• Original Assignee: KEIO University
• Inventors: Miura, Noriyuki, Kuroda, Tadahiro, Mizoguchi, Daisuke
• Granted Patent: US 7,813,259 B2
• Time in Patent Office: Days
• US Class Current: 370/201
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2225/06513 Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06527 Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices

Abstract

The invention provides an electronic circuit capable of reducing crosstalk to such a degree that the crosstalk can be substantially disregarded even where a plurality of communications channels are juxtaposed in close proximity to each other when achieving communications between substrates by inductive coupling. The transmitter coils 11 are placed on a lower chip and the receiver coils 12 are placed on an upper chip, and where it is assumed that the distance between the chips is X, and the distance between the communications channels is Y(that is, the horizontal distance between the coil centers), there exists a position, where the magnetic flux density in the receiver coils 12 resulting from the transmitter coils 11 becomes zero (0), at a predetermined Yo. That is, since large crosstalk occurs when Y is small, and small crosstalk of an inverted symbol occurs when Y is large, in the meantime, there will exist a position, where the value obtained by integrating the magnetic flux density B in the receiver coils 12 becomes zero (0), without fail. Any crosstalk is not generated theoretically at the position.

Claims

1. An electronic circuit according to the invention comprising:

a first substrate including a plurality of transmitter coils formed by wiring on the substrate; and

a second substrate including a plurality of receiver coils that are respectively formed at the position corresponding to said transmitter coils by wiring on the substrate and thus compose communications channels by being inductively coupled to said transmitter coils,

wherein the transmitter coils and the receiver coils of respective communications channels are disposed at positions where positive and negative crosstalk from proximal communications channels depending on distance are counterbalanced.

2. The electronic circuit according to claim 1, comprising three or more substrates, wherein the distance between said first substrate and said second substrate thereof is longest.

3. The electronic circuit according to claim 1, wherein the communications channels nearest to each other operate in different phases;

communications channels next nearest to each other operate in the same phase and are disposed at the positions where crosstalk is counterbalanced.

4. The electronic circuit according to claim 2, wherein the communications channels nearest to each other operate in different phases;

communications channels next nearest to each other operate in the same phase and are disposed at the positions where crosstalk is counterbalanced.