Optoelectronic Module, and Method for the Production Thereof
First Claim
1. An optoelectronic module, comprising:
- a carrier element having electrical connection electrodes and electrical lines;
at least one semiconductor component for emitting or detecting electromagnetic radiation, said semiconductor component being applied on the carrier element and being electrically connected to connection electrodes of the carrier element and having a radiation coupling area;
at least one optical device assigned to the semiconductor component; and
a connecting layer made of a radiation-transmissive, deformable material arranged in a gap between the radiation coupling area and the optical device, wherein the optical device and the semiconductor component are fixed relative to one another in such a way that they are pressed against one another and that the connecting layer is thereby squeezed in such a way that it generates a force that strives to press the optical device and the radiation coupling area apart.
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Accused Products
Abstract
An optoelectronic module having a carrier element, at least one semiconductor component for emitting or detecting electromagnetic radiation, said semiconductor component being applied on the carrier element and being electrically conductively connected and having a radiation coupling area, and also at least one optical device assigned to the semiconductor component. A connecting layer made of a radiation-transmissive, deformable material is arranged between the radiation coupling area and the optical device, the optical device and the semiconductor component being fixed relative to one another in such a way that they are pressed against one another and that the connecting layer is thereby squeezed in such a way that it generates a force that strives to press the optical device and the radiation coupling area apart.
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Citations
17 Claims
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1. An optoelectronic module, comprising:
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a carrier element having electrical connection electrodes and electrical lines;
at least one semiconductor component for emitting or detecting electromagnetic radiation, said semiconductor component being applied on the carrier element and being electrically connected to connection electrodes of the carrier element and having a radiation coupling area;
at least one optical device assigned to the semiconductor component; and
a connecting layer made of a radiation-transmissive, deformable material arranged in a gap between the radiation coupling area and the optical device, wherein the optical device and the semiconductor component are fixed relative to one another in such a way that they are pressed against one another and that the connecting layer is thereby squeezed in such a way that it generates a force that strives to press the optical device and the radiation coupling area apart. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 16)
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10. A method for producing an optoelectronic module comprising the steps of:
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providing a carrier element having electrical connection electrodes and electrical lines;
providing a semiconductor component for emitting or detecting electromagnetic radiation, said semiconductor component having a radiation coupling area;
providing an optical device;
applying the semiconductor component on the carrier element and electrically connecting the semiconductor component to the connection electrodes;
mounting the optical device above the radiation coupling area of the semiconductor component; and
prior to mounting the optical device, providing a curable and—
in a cured state—
radiation-transmissive and deformable composition at least over the radiation coupling area of the semiconductor component,wherein the applied composition is at least partly cured or let to be cured, and wherein the optical device and the semiconductor component are fixed relative to one another in such a way that they are pressed against one another and thereby that the connecting layer is squeezed in such a way that it generates a force the composition strives to press the optical device and the radiation coupling area apart. - View Dependent Claims (11, 12, 13, 14, 15, 17)
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Specification