Method of fabricating an electronic module having a side contact

• US 20070277364A1
• Filed: 03/26/2007
• Published: 12/06/2007
• Est. Priority Date: 06/02/2006
• Status: Abandoned Application

• Current Assignee: Chicony Electronics Company Limited
• Original Assignee: Chicony Electronics Company Limited
• Inventors: Chen, Chih-Ching, Liu, Liang-Jung
• Application Number:
  US11/727,374
• Publication Number:
  US 20070277364A1
• Time in Patent Office: Days
• US Class Current: 29/592.100
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H01R 12/7076 for connection between PCB and component, e.g. display
• CPC Class Codes: H01R 12/714 with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/049 PCB for one component, e.g. for mounting onto mother PCB
• CPC Class Codes: H05K 2201/056 Folded around rigid support or component
• CPC Class Codes: H05K 2201/10719 Land grid array [LGA]
• CPC Class Codes: H05K 3/403 Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof H05K3/4092 takes precedence
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

The present invention relates to a method of fabricating an electronic module having a side contact, at least comprising the steps of: providing a printed circuit board (PCB), with a first surface thereof having a first electrical contact as well as a second surface thereof forming a layout of a second electrical contact, such that the first electrical contact connects to the second electrical contact; providing an electronic actuator, having a pin thereof electrically connected to the first electrical contact on the first surface of the PCB; and bending an edge of at least one side of the PCB to the first surface, thereby forming an electronic module having a side contact through the layout of the second electrical contact.

Claims

1. A method of fabricating an electronic module having a side contact, at least comprising:

providing a printed circuit board (PCB), with a first surface thereof having a first electrical contact as well as a second surface thereof forming a layout of a second electrical contact such that said first electrical contact connects to said second electrical contact;

providing an electronic actuator, having a pin thereof electrically connected to said first electrical contact on said first surface of said PCB; and

bending an edge of at least one side of said PCB to said first surface, thereby forming an electronic module having a side contact through said layout of said second electrical contact.

2. The method of fabricating an electronic module having a side contact as claimed in claim 1, wherein said electronic actuator is an image chip.

3. The method of fabricating an electronic module having a side contact as claimed in claim 1, wherein said PCB is a printed circuit board made of soft materials.

4. The method of fabricating an electronic module having a side contact as claimed in claim 1, wherein said PCB is cross-shaped, and four sides of said PCB are bended to said first surface to envelop said electronic actuator, thereby an electronic module having a side contact will be formed through the layout of said second electrical contact.

5. The method of fabricating an electronic module having a side contact as claimed in claim 1, wherein said PCB is T-shaped, and at least one side of said PCB is bended to said first surface, thereby an electronic module having a side contact will be formed through the layout of said second electrical contact.

6. The method of fabricating an electronic module having a side contact as claimed in claim 1, wherein said PCB is L-shaped, and at least one side of said PCB is bended to said first surface, thereby an electronic module having a side contact will be formed through the layout of said second electrical contact.