Method of fabricating an electronic module having a side contact
First Claim
1. A method of fabricating an electronic module having a side contact, at least comprising:
- providing a printed circuit board (PCB), with a first surface thereof having a first electrical contact as well as a second surface thereof forming a layout of a second electrical contact such that said first electrical contact connects to said second electrical contact;
providing an electronic actuator, having a pin thereof electrically connected to said first electrical contact on said first surface of said PCB; and
bending an edge of at least one side of said PCB to said first surface, thereby forming an electronic module having a side contact through said layout of said second electrical contact.
1 Assignment
0 Petitions
Accused Products
Abstract
The present invention relates to a method of fabricating an electronic module having a side contact, at least comprising the steps of: providing a printed circuit board (PCB), with a first surface thereof having a first electrical contact as well as a second surface thereof forming a layout of a second electrical contact, such that the first electrical contact connects to the second electrical contact; providing an electronic actuator, having a pin thereof electrically connected to the first electrical contact on the first surface of the PCB; and bending an edge of at least one side of the PCB to the first surface, thereby forming an electronic module having a side contact through the layout of the second electrical contact.
-
Citations
6 Claims
-
1. A method of fabricating an electronic module having a side contact, at least comprising:
-
providing a printed circuit board (PCB), with a first surface thereof having a first electrical contact as well as a second surface thereof forming a layout of a second electrical contact such that said first electrical contact connects to said second electrical contact; providing an electronic actuator, having a pin thereof electrically connected to said first electrical contact on said first surface of said PCB; and bending an edge of at least one side of said PCB to said first surface, thereby forming an electronic module having a side contact through said layout of said second electrical contact. - View Dependent Claims (2, 3, 4, 5, 6)
-
Specification