PROCESS CHAMBER FOR DIELECTRIC GAPFILL

• US 20070277734A1
• Filed: 05/29/2007
• Published: 12/06/2007
• Est. Priority Date: 05/30/2006
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Liang, Qiwei, Yieh, Ellie, Park, Soonam, Lubomirsky, Dmitry, Chuc, Kien
• Application Number:
  US11/754,916
• Publication Number:
  US 20070277734A1
• Time in Patent Office: Days
• US Class Current: 118/715
• CPC Class Codes: C23C 16/402 Silicon dioxide
• CPC Class Codes: C23C 16/45565 Shower nozzles
• CPC Class Codes: C23C 16/45574 Nozzles for more than one gas
• CPC Class Codes: C23C 16/505 using radio frequency discharges

Abstract

A system to form a dielectric layer on a substrate from a plasma of dielectric precursors is described. The system may include a deposition chamber, a substrate stage in the deposition chamber to hold the substrate, and a remote plasma generating system coupled to the deposition chamber, where the plasma generating system is used to generate a dielectric precursor having one or more reactive radicals. The system may also include a precursor distribution system comprising a dual-channel showerhead positioned above the substrate stage. The showerhead may have a faceplate with a first set of openings through which the reactive radical precursor enters the deposition chamber, and a second set of openings through which a second dielectric precursor enters the deposition chamber. An in-situ plasma generating system may also be included to generate the plasma in the deposition chamber from the dielectric precursors supplied to the deposition chamber.

Claims

1. A system to form a dielectric layer on a substrate from a plasma of dielectric precursors, the system comprising:

a deposition chamber;

a substrate stage in the deposition chamber to hold the substrate;

a remote plasma generating system coupled to the deposition chamber, wherein the plasma generating system is used to generate a first dielectric precursor comprising a reactive radical;

a precursor distribution system comprising a dual-channel showerhead positioned above the substrate stage, wherein the showerhead comprises a faceplate with a first set of openings through which the reactive radical precursor enters the deposition chamber, and a second set of openings through which a second dielectric precursor enters the deposition chamber, and wherein the precursors are not mixed until entering the deposition chamber.

2. The system of claim 1, wherein the first set of openings have a circular shape and the second set of openings have an annular shape.

3. The system of claim 1, wherein each of the second openings is aligned concentrically around one of the first openings.

4. The system of claim 1, wherein the precursor distribution system further comprises a plurality of side nozzles for introducing one or more additional dielectric precursors to the deposition chamber.

5. The system of claim 4, wherein the additional dielectric precursors include the second dielectric precursor.

6. The system of claim 4, wherein the additional dielectric precursors include a third dielectric precursor that is different from the first and second dielectric precursor.

7. The system of claim 4, wherein at least two of the nozzles have different lengths.

8. The system of claim 1, wherein the substrate stage rotates the substrate during the formation of the dielectric layer.

9. The system of claim 1, wherein the substrate stage can be raised or lowered during the formation of the dielectric layer.

10. The system of claim 1, wherein the system comprises a substrate stage temperature control system to control a temperature for the substrate stage.

11. The system of claim 1, wherein the system comprises an in-situ plasma generating system to generate the plasma in the deposition chamber from the dielectric precursors supplied to the deposition chamber.

12. The system of claim 1, wherein the system comprises a radiative heating system.

13. The system of claim 1, wherein the first precursor comprises radical atomic oxygen.

14. The system of claim 1, wherein the second precursor is a silicon-containing precursor.

15. The system of claim 14, wherein the silicon-containing precursor is selected from the group consisting of silane, dimethylsilane, trimethylsilane, tetramethylsilane, diethylsilane, tetramethylorthosilicate (TMOS), tetraethylorthosilicate (TEOS), octamethyltrisiloxane (OMTS), octamethylcyclotetrasiloxane (OMCTS), tetramethylcyclotetrasiloxane (TOMCATS), DMDMOS, DEMS, methyl triethoxysilane (MTES), phenyldimethylsilane, and phenylsilane.

16. A system to form a dielectric layer on a substrate from a plasma of dielectric precursors, the system comprising:

a deposition chamber;

a substrate stage in the deposition chamber to hold the substrate, wherein the substrate stage is operable to rotate during the deposition of the dielectric layer;

a remote plasma generating system coupled to the deposition chamber, wherein the plasma generating system is used to generate a dielectric precursor comprising a reactive radical;

a precursor distribution system comprising a dual-channel showerhead positioned above the substrate stage, wherein the showerhead comprises a faceplate with a first set of openings through which the reactive radical precursor enters the deposition chamber, and a second set of openings through which a second dielectric precursor enters the deposition chamber, and wherein the precursors are not mixed until entering the deposition chamber; and

an in-situ plasma generating system to generate the plasma in the deposition chamber from the dielectric precursors supplied to the deposition chamber.

17. The system of claim 16, wherein the substrate is a 200 mm or 300 mm wafer.

18. The system of claim 16, wherein the substrate comprises silicon, germanium, or gallium arsenide.

19. The system of claim 16, wherein the substrate stage can be raised and lowered to adjust the position of the substrate relative to the showerhead during the formation of the dielectric layer.

20. The system of claim 16, wherein the substrate stage can simultaneously rotate and be raised and lowered during the formation of the dielectric layer.

21. The system of claim 16, wherein the system comprises a substrate stage temperature control system to control a temperature for the substrate stage.

22. The system of claim 21, wherein the temperature control system maintains the substrate stage at a temperature of about −

40°

C. to about 200°

C.

23. The system of claim 16, wherein the second dielectric precursor comprises a silicon-containing precursor selected from the group consisting of silane, dimethylsilane, trimethylsilane, tetramethylsilane, diethylsilane, tetramethylorthosilicate (TMOS), tetraethylorthosilicate (TEOS), octamethyltrisiloxane (OMTS), octamethylcyclotetrasiloxane (OMCTS), tetramethylcyclotetrasiloxane (TOMCATS), DMDMOS, DEMS, methyl triethoxysilane (MTES), phenyldimethylsilane, and phenylsilane.

24. The system of claim 16, wherein the reactive radical precursor comprises radical atomic oxygen.