Sample preparation technique

• US 20070278421A1
• Filed: 04/23/2007
• Published: 12/06/2007
• Est. Priority Date: 04/24/2006
• Status: Abandoned Application

• Current Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Original Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Inventors: Gleason, K.
• Application Number:
  US11/789,298
• Publication Number:
  US 20070278421A1
• Time in Patent Office: Days
• US Class Current: 250/442.110
• CPC Class Codes: G01N 1/286 involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising microtomes G01N1/06; pulverising in general B02C; mixing in general B01F
• CPC Class Codes: H01J 2237/2007 Holding mechanisms
• CPC Class Codes: H01J 2237/204 Means for introducing and/or outputting objects
• CPC Class Codes: H01J 2237/31745 for preparing specimen to be viewed in microscopes or analyzed in microanalysers

Abstract

A method of testing a substrate includes separating the substrate from a larger substrate using a separating device and repositioning the substrate to be tested to a processing station apart from the separating device. The substrate is positioned on a holder for inspection.

Claims

1. A method of testing a substrate comprising:

(a) separating said substrate from a larger substrate using a separating device;

(b) repositioning said substrate to be said tested to a processing station apart from said separating device;

(c) positioning said substrate on a holder for inspection.

2. The method of claim 1 wherein said substrate is separated from a wafer using a focused ion beam.

3. The method of claim 1 wherein said substrate is repositioned to a processing station apart from a focused ion beam device used to separate said substrate from said larger substrate.

4. The method of claim 1 wherein said repositioning is performed with an elongate member detachably attached to said substrate.

5. The method of claim 4 wherein said elongate member includes sticky material at the end thereof.

6. The method of claim 5 wherein said sticky material is silicone.

7. The method of claim 4 wherein said substrate is detached from said large substrate by using said elongate member.

8. The method of claim 1 wherein said substrate is positioned with a controllable positioner.

9. The method of claim 1 wherein said substrate is positioned with a positioner that includes a transparent portion proximate said substrate.

10. The method of claim 9 wherein a microscope is used to inspect said sample through said transparent portion.

11. The method of claim 1 wherein said substrate is positioned with a positioner that includes a gripping device not in alignment with an axis of said positioner.

12. The method of claim 11 wherein said alignment is between 5 and 25 degrees with respect to said axis.

13. The method of claim 11 wherein said alignment is between 5 and 25 degrees with respect to the perpendicular to said axis.

14. The method of claim 1 wherein said holder is positioned in a TEM device.

15. The method of claim 14 wherein said TEM device includes a FIB for thinning said sample.

16. The method of claim 1 wherein said holder includes an opening into which said sample is inserted.

17. The method of claim 16 wherein said opening permits inspection through said sample.

18. The method of claim 17 wherein said holder sandwiches a portion of said sample.