Package module of light emitting diode

• US 20070278500A1
• Filed: 04/24/2007
• Published: 12/06/2007
• Est. Priority Date: 04/25/2006
• Status: Abandoned Application

• Current Assignee: Gigno Technology Co., Ltd.
• Original Assignee: Gigno Technology Co., Ltd.
• Inventors: Lin, Feng-Li
• Application Number:
  US11/790,243
• Publication Number:
  US 20070278500A1
• Time in Patent Office: Days
• US Class Current: 257/81
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

A package module of a light emitting diode includes a substrate, a first light emitting diode and a transistor. The first light emitting diode is disposed on the substrate, and the transistor is electrically connected with the first light emitting diode. The transistor is disposed on the substrate and turns on or off the first light emitting diode. The first light emitting diode and the transistor are disposed in a same package.

Claims

1. A package module, comprising:

a substrate;

a first light emitting diode disposed on the substrate; and

a transistor, which is electrically connected with the first light emitting diode and disposed on the substrate to turn on or off the first light emitting diode, wherein the first light emitting diode and the transistor are disposed in a same package.

2. The package module according to claim 1, wherein the substrate is a printed circuit board, a heat dissipating plate or a glass substrate, and the first light emitting diode is a light emitting diode chip or a light emitting diode die.

3. The package module according to claim 1, further comprising a photosensor disposed in the package.

4. The package module according to claim 3, further comprising:

a transparent cover for covering the photosensor.

5. The package module according to claim 1, further comprising a driving control loop, which is electrically connected with the first light emitting diode and the transistor, and controls a light emitting intensity of the first light emitting diode.

6. The package module according to claim 5, wherein the driving control loop is disposed in the package.

7. The package module according to claim 5, further comprising a memory, which is disposed on the substrate and electrically connected with the driving control loop.

8. The package module according to claim 1, further comprising a second light emitting diode, which is electrically connected with the first light emitting diode and disposed on the substrate.

9. The package module according to claim 8, wherein the second light emitting diode is disposed in the package.

10. The package module according to claim 8, wherein the second light emitting diode is driven by a backward bias to form a photosensor.

11. The package module according to claim 8, wherein the second light emitting diode and the first light emitting diode are connected in series.

12. The package module according to claim 8, wherein the second light emitting diode and the first light emitting diode are connected in parallel and reversely.

13. A package module, comprising:

a substrate;

a first light emitting diode disposed on the substrate;

a photosensor disposed on the substrate; and

a transistor, which is electrically connected with the first light emitting diode and disposed on the substrate, and turns on or off the first light emitting diode, wherein any two of the first light emitting diode, the photosensor and the transistor are disposed in a same package.

14. The package module according to claim 13, wherein the substrate is a printed circuit board, a heat dissipating plate or a glass substrate, and the first light emitting diode is a light emitting diode chip or a light emitting diode die.

15. The package module according to claim 13, further comprising:

a transparent cover for covering the photosensor.

16. The package module according to claim 13, further comprising a driving control loop, which is electrically connected with the first light emitting diode, the photosensor and the transistor.

17. The package module according to claim 16, wherein the driving control loop is disposed in the package.

18. The package module according to claim 16, further comprising a memory, which is disposed on the substrate and electrically connected with the driving control loop.

19. The package module according to claim 13, further comprising a second light emitting diode, which is electrically connected with the first light emitting diode and disposed on the substrate.

20. The package module according to claim 19, wherein the second light emitting diode is disposed in the package.

21. The package module according to claim 19, wherein the second light emitting diode is driven by a backward bias to form a photosensor.

22. The package module according to claim 19, wherein the second light emitting diode and the first light emitting diode are connected in series.

23. The package module according to claim 19, wherein the second light emitting diode and the first light emitting diode are connected in parallel and reversely.