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ELECTRONIC ASSEMBLIES AND SYSTEMS WITH FILLED NO-FLOW UNDERFILL

  • US 20070278655A1
  • Filed: 08/16/2007
  • Published: 12/06/2007
  • Est. Priority Date: 10/26/2001
  • Status: Active Grant
First Claim
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1. An electronic assembly comprising:

  • at least one integrated circuit package having a plurality of terminals;

    a substrate having a plurality of pads coupled to the plurality of terminals via a corresponding plurality of connections;

    a hardened underfill encapsulating the terminals, pads, and connections; and

    a plurality of particles in the underfill, wherein some of the particles are of such size and shape as to potentially inhibit suitable physical and electrical contact between corresponding terminals and pads if such particles remained in the connections, and wherein one or more particles are embedded in one of the terminals, in its corresponding pad, or in both the one terminal and its corresponding pad, but such one or more particles are of such size and shape that they do not prevent adequate physical and electrical contact between corresponding terminals and pads.

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