RF TELEMETRY FOR AN ACTIVE MEDICAL DEVICE SUCH AS AN IMPLANT OR PROGRAMMER FOR AN IMPLANT

• US 20070279149A1
• Filed: 06/01/2007
• Published: 12/06/2007
• Est. Priority Date: 06/02/2006
• Status: Active Grant

• Current Assignee: Sorin CRM SAS (MicroPort Scientific Corp.)
• Original Assignee: Ela Medical SAS (MicroPort Scientific Corp.)
• Inventors: Dal Molin, Renzo
• Granted Patent: US 7,663,451 B2
• Time in Patent Office: Days
• US Class Current: 333/133
• CPC Class Codes: A61N 1/37223 Circuits for electromagnetic coupling
• CPC Class Codes: A61N 1/37276 characterised by means for reducing power consumption during telemetry
• CPC Class Codes: H03H 9/175 Acoustic mirrors

Abstract

RF telemetry for an active medical device such as active implant or programmer for such implant. The device includes at least one RF antenna (14), and at least one RF telemetry transmitter/receiver (44) with, for coupling to the antenna, an associated band rejection filter (54). The band rejection filter (54) comprises at least one volume acoustic wave BAW resonator (40) of the SMR type with insulation by Bragg acoustic reflector (42). The device can be a multi-band device comprising a plurality of RF transmitters/receivers (12, 44) operating in respective distinct bands of frequencies such as the 402˜405-MHz, 863˜870-MHz, 902˜928-MHz and 2.4-GHz bands or by UWB transmission.

Claims

1. An active medical device, comprising:

at least one RF antenna, and

at least one RF telemetry transmitter/receiver having an associated band rejection filter for coupling to the antenna, said band rejection filter including at least one volume acoustic waves BAW resonator of the SMR type with Bragg reflector insulation.

2. The device of claim 1, wherein said device comprises at least two RF telemetry transmitters/receivers operating within respectively distinct frequency bands, each transmitter/receiver having a respective band rejection filter, wherein at least one of said rejection filters including at least one volume acoustic waves BAW resonator of the SMR type with Bragg reflector insulation.

3. The device of claim 2, further comprising an antenna that is common to the RF telemetry transmitters/receivers and coupled therewith through said band rejection filters and impedance matching elements.

4. The device of claim 2, wherein the RF telemetry transmitters/receivers operate in at least two bands of frequencies selected from among the bands of 401-402 MHz, 402-405 MHz, 405-406 MHz, 863-870 MHz, 902-928 MHz and 2.4 GHz or by a transmission of the UWB type.

5. The device of claim 2, wherein said device comprises means for evaluating the performance of the different bands of frequencies, and means for selecting, for the transmission of RF telemetry signals, the one of the transmitters/receivers operating within the band presenting the best performance.

6. The device of claim 5, wherein said device further comprises means for commuting the transmitter(s)/receiver(s) operating within the band(s) that was (were) not selected towards a low power consumption mode.

7. The device of claim 1, wherein:

the device comprises a hybrid circuit board and at least one chip, bonded on said board, of a monolithic circuit integrating said RF telemetry transmitter/receiver, and

the BAW resonator is directly integrated to said chip on the surface thereof.

8. The device of claim 1, wherein:

the device comprises a hybrid circuit board and at least one chip, bonded on said board, of a monolithic circuit integrating said RF telemetry transmitter/receiver, and

the BAW resonator is a discrete component, distinct from the chip and bonded on the surface thereof.

9. The device of claim 8 wherein the BAW resonator is bonded on the surface of the chip through a flip-chip technique.

10. The device of claim 8 wherein the BAW resonator is bonded on the surface of the chip by a wire-bonding technique.

11. The device of claim 1, wherein:

the device comprises a hybrid circuit board and at least one chip, bonded on said board, of a monolithic circuit integrating said RF telemetry transmitter/receiver, and

the BAW resonator is a discrete component, distinct from the chip and bonded on the surface of the hybrid circuit board.

12. The device of claim 2, wherein:

the device comprises a hybrid circuit board and at least one chip, bonded on said board, of a monolithic circuit integrating said RF telemetry transmitter/receiver, and

the BAW resonator is directly integrated to said chip on the surface thereof.

13. The device of claim 2, wherein:

the device comprises a hybrid circuit board and at least one chip, bonded on said board, of a monolithic circuit integrating said RF telemetry transmitter/receiver, and

the BAW resonator is a discrete component, distinct from the chip and bonded on the surface thereof.

14. The device of claim 13 wherein the BAW resonator is bonded on the surface of the chip through a flip-chip technique.

15. The device of claim 13 wherein the BAW resonator is bonded on the surface of the chip by a wire-bonding technique.

16. The device of claim 2, wherein:

the device comprises a hybrid circuit board and at least one chip, bonded on said board, of a monolithic circuit integrating said RF telemetry transmitter/receiver, and

the BAW resonator is a discrete component, distinct from the chip and bonded on the surface of the hybrid circuit board.

17. The device of claim 1, wherein the BAW resonator is a tunable resonator comprising an erodable superficial charge layer.

18. The device of claim 1, wherein the band rejection filter is a filter having a differential input and an output comprising a plurality of BAW resonators in a mesh configuration.

19. The device of claim 1, wherein the band rejection filter is a filter having an asymmetric input and an output comprising a plurality of BAW resonators in a ladder configuration.