Exposure apparatus, exposure method, and method for producing device

• US 20070279606A1
• Filed: 02/16/2007
• Published: 12/06/2007
• Est. Priority Date: 02/16/2006
• Status: Active Grant

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Nagasaka, Hiroyuki
• Granted Patent: US 8,390,779 B2
• Time in Patent Office: Days
• US Class Current: 355/40
• CPC Class Codes: G03F 7/70208 Multiple illumination paths, e.g. radiation distribution devices, microlens illumination systems, multiplexers or demultiplexers for single or multiple projection systems
• CPC Class Codes: G03F 7/70275 Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
• CPC Class Codes: G03F 7/70283 Mask effects on the imaging process
• CPC Class Codes: G03F 7/70341 Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply chemical composition of immersion liquids G03F7/2041
• CPC Class Codes: G03F 7/706 Aberration measurement
• CPC Class Codes: G03F 9/7026 Focusing
• CPC Class Codes: G03F 9/7088 Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Abstract

An exposure apparatus includes a projection optical system which is capable of forming an image of a first pattern in a first exposure area and which is capable of forming an image of a second pattern in a second exposure area, the second pattern being different from the first pattern, and a first detecting system which obtains at least one of position information about the image of the first pattern and position information about the image of the second pattern. A positional relationship between the images of the first and second patterns and a predetermined area on a substrate is adjusted based on a detection result to perform multiple exposure for the predetermined area on the substrate with the images of the first and second patterns. The substrate can be subjected to the multiple exposure efficiently.

Claims

1. An exposure apparatus which exposes a substrate, comprising:

an optical system which forms an image of a first pattern in a first exposure area and which forms an image of a second pattern in a second exposure area, the second pattern being different from the first pattern; and

a first detecting system which obtains at least one of position information about the image of the first pattern to be formed in the first exposure area and position information about the image of the second pattern to be formed in the second exposure area,

wherein a predetermined area on the substrate is subjected to multiple exposure with the image of the first pattern formed in the first exposure area and the image of the second pattern formed in the second exposure area.

2. The exposure apparatus according to claim 1, further comprising an adjusting device which adjusts at least one of a positional relationship between the image of the first pattern and the predetermined area on the substrate and a positional relationship between the image of the second pattern and the predetermined area on the substrate based on a detection result of the first detecting system.

3. The exposure apparatus according to claim 1, further comprising:

a reference which is arranged on a light-exit side of the optical system, wherein;

the first detecting system detects at least one of a first positional relationship between the first pattern and the reference and a second positional relationship between the second pattern and the reference, via at least a part of the optical system; and

at least one of the position information about the image of the first pattern to be formed in the first exposure area and the position information about the image of the second pattern to be formed in the second exposure area is obtained based on a detection result of the first detecting system.

4. The exposure apparatus according to claim 3, wherein the first detecting system detects at least one of the first positional relationship and the second positional relationship by detecting at least one of a positional relationship between the reference and a first mark which is formed in a predetermined positional relationship with respect to the first pattern and a positional relationship between the reference and a second mark which is formed in a predetermined positional relationship with respect to the second pattern, via at least a part of the optical system.

5. The exposure apparatus according to claim 3, wherein:

the first exposure area and the second exposure area are defined at different positions; and

the reference is arranged in the first exposure area to detect the first positional relationship by using the first detecting system, and then the reference is arranged in the second exposure area to detect the second positional relationship by using the first detecting system.

6. The exposure apparatus according to claim 5, wherein the first exposure area and the second exposure area are away from each other.

7. The exposure apparatus according to claim 3, wherein:

at least a part of the first exposure area and a part of the second exposure area are overlapped with each other at an overlap area; and

the reference is arranged in the overlap area to perform at least one of the detection of the first positional relationship and the detection of the second positional relationship by means of the first detecting system.

8. The exposure apparatus according to claim 3, wherein the detection of the first positional relationship and the detection of the second positional relationship are performed substantially simultaneously or unsimultaneously.

9. The exposure apparatus according to claim 3, wherein the first detecting system includes a first sub-detecting system which detects the first positional relationship, and a second sub-detecting system which detects the second positional relationship.

10. The exposure apparatus according to claim 3, further comprising:

a second detecting system which detects the reference or a reference mark provided in a predetermined positional relationship with respect to the reference, and an alignment mark provided on the substrate, wherein a positional relationship among the image of the first pattern, the image of the second pattern, and the predetermined area on the substrate is adjusted based on the detection result of the first detecting system and a detection result of the second detecting system.

11. The exposure apparatus according to claim 1, further comprising:

a first reference and a second reference which are arranged on a light-exit side of the optical system and which are formed in a predetermined positional relationship,

wherein the first detecting system obtains the position information about the image of the first pattern to be formed in the first exposure area and the position information about the image of the second pattern to be formed in the second exposure area by detecting a first positional relationship between the first pattern and the first reference and a second positional relationship between the second pattern and the second reference via at least a part of the optical system.

12. The exposure apparatus according to claim 11, wherein the first detecting system detects the first positional relationship and the second positional relationship by detecting a positional relationship between the first reference and a first mark which is formed in a predetermined positional relationship with respect to the first pattern and a positional relationship between the second reference and a second mark which is formed in a predetermined positional relationship with respect to the second pattern, via at least a part of the optical system.

13. The exposure apparatus according to claim 11, wherein the first exposure area and the second exposure area are defined at different positions, and

the first reference is arranged in the first exposure area, the second reference is arranged in the second exposure area, so as to perform the detection of the first positional relationship and the detection of the second positional relationship by the first detecting system.

14. The exposure apparatus according to claim 12, wherein the first exposure area and the second exposure area are away from each other.

15. The exposure apparatus according to claim 11, wherein at least a part of the first exposure area and a part of the second exposure area are overlapped with each other at am overlap area, and the first reference and the second reference are arranged in the overlap area to perform the detection of the first positional relationship and the detection of the second positional relationship by the first detecting system.

16. The exposure apparatus according to claim 13, wherein the detection of the first positional relationship and the detection of the second positional relationship are performed substantially simultaneously or unsimultaneously.

17. The exposure apparatus according to claim 11, wherein the first detecting system includes a first sub-detecting system which detects the first positional relationship, and a second sub-detecting system which detects the second positional relationship.

18. The exposure apparatus according to claim 11, further comprising:

a second detecting system which detects an alignment mark provided on the substrate and at least one of the first and second references or a reference mark provided in a predetermined positional relationship with respect to at least one of the first and second references,

wherein a positional relationship among the image of the first pattern, the image of the second pattern, and the predetermined area on the substrate is adjusted based on a detection result of the first detecting system and a detection result of the second detecting system.

19. The exposure apparatus according to claim 1, wherein the first detecting system has a light-receiving system which receives a detection light beam on a light-exit side of the optical system.

20. The exposure apparatus according to claim 1, wherein the optical system includes one optical element which is arranged opposite to a surface of the substrate, and a first exposure light beam and a second exposure light beam are irradiated onto the first exposure area and the second exposure area respectively via the one optical element.

21. The exposure apparatus according to claim 20, wherein the optical system includes:

a first reflecting surface which is arranged in the vicinity of position optically conjugate with the first exposure area and the second exposure area and which guides the first exposure light beam to the optical element;

a second reflecting surface which is arranged in the vicinity of position optically conjugate with the first exposure area and the second exposure area and which guides the second exposure light beam to the optical element;

a first optical system which guides the first exposure light beam from the first pattern to the first reflecting surface;

a second optical system which guides the second exposure light beam from the second pattern to the second reflecting surface; and

a third optical system which includes the optical element and which guides the first exposure light beam from the first reflecting surface and the second exposure light beam from the second reflecting surface to the first exposure area and the second exposure area respectively.

22. The exposure apparatus according to claim 1, wherein the predetermined area on the substrate is subjected to the multiple exposure with the image of the first pattern and the image of the second pattern by irradiating a first exposure light beam and a second exposure light beam onto the first exposure area and the second exposure area respectively by the optical system while relatively moving the first exposure area, the second exposure area, and the predetermined area on the substrate.

33. The exposure apparatus according to claim 1, further comprising an imaging characteristic-adjusting device which adjusts at least one of an imaging characteristic of the image of the first pattern and an imaging characteristic of the image of the second pattern.

34. The exposure apparatus according to claim 1, wherein adjustment of a positional relationship among the image of the first pattern, the image of the second pattern, and the predetermined area on the substrate includes adjustment of at least one of positions of the image of the first pattern and the image of the second pattern.

35. The exposure apparatus according to claim 1, wherein adjustment of at least one of positions of the image of the first pattern and the image of the second pattern includes adjustment of at least one of positions of the first pattern and the second pattern.

36. The exposure apparatus according to claim 1, wherein a liquid immersion area is formed with a liquid on the substrate, and a first exposure light beam and a second exposure light beam are irradiated onto the predetermined area on the substrate through the liquid of the liquid immersion area.

37. A method for producing a device, comprising:

performing multiple exposure for a substrate by using the exposure apparatus as defined in claim 1;

developing the substrate for which the multiple exposure has been performed; and

processing the developed substrate.

23. An exposure apparatus which exposes a substrate while moving the substrate in a scanning direction, the exposure apparatus comprising:

an optical system which includes an optical element arranged opposite to a surface of the substrate, which irradiates a first exposure light beam from a first pattern onto a first exposure area via the optical element, and which irradiates a second exposure light beam from a second pattern onto a second exposure area via the optical element, the second exposure area being defined at a position different from that of the first exposure area in the scanning direction; and

a detecting system which detects an alignment mark on the substrate, wherein;

the optical system includes a first reflecting surface which is arranged in the vicinity of position optically conjugate with the first exposure area and the second exposure area and which guides the first exposure light beam to the optical element and a second reflecting surface which is arranged in the vicinity of position optically conjugate with the first exposure area and the second exposure area and which guides the second exposure light beam to the optical element; and

the detecting system detects the alignment mark on the substrate by irradiating a detection light beam onto the substrate via the optical element from a position between the first reflecting surface and the second reflecting surface.

24. The exposure apparatus according to claim 23, wherein the optical system includes an intermediate optical member which has the first reflecting surface and the second reflecting surface, and the detecting system irradiates the detection light beam onto the substrate via the intermediate optical member.

25. The exposure apparatus according to claim 23, wherein the optical system includes:

a first optical system which guides the first exposure light beam from the first pattern to the first reflecting surface;

a second optical system which guides the second exposure light beam from the second pattern to the second reflecting surface; and

a third optical system which has the optical element and which guides the first exposure light beam from the first reflecting surface and the second exposure light beam from the second reflecting surface to the first exposure area and the second exposure area respectively.

26. The exposure apparatus according to claim 23, wherein a predetermined area on the substrate is subjected to multiple exposure with an image of the first pattern formed by the first exposure light beam irradiated onto the first exposure area and an image of the second pattern formed by the second exposure light beam irradiated onto the second exposure area by irradiating the first exposure light beam and the second exposure light beam onto the first exposure area and the second exposure area respectively by means of the optical system while relatively moving the first exposure area, the second exposure area, and the predetermined area on the substrate in the scanning direction.

27. The exposure apparatus according to claim 23, further comprising:

a mask stage which is capable of moving a first mask having the first pattern in a predetermined scanning direction with respect to the first exposure light beam and which is capable of moving a second mask having the second pattern in a predetermined scanning direction with respect to the second exposure light beam; and

a substrate stage which is capable of moving a predetermined area on the substrate in a predetermined scanning direction with respect to the first exposure area and the second exposure area,

wherein the predetermined area on the substrate is subjected to multiple exposure with an image of the first pattern and an image of the second pattern while moving the predetermined area on the substrate in the scanning direction by using the substrate stage in synchronization with movement of each of the first mask and the second mask in the scanning direction by the mask stage.

28. The exposure apparatus according to claim 27, wherein the mask stage integrally moves the first and second masks.

29. The exposure apparatus according to claim 28, wherein the mask stage includes a main stage which is movable while holding the first mask and the second mask in substantially identical scanning directions.

30. The exposure apparatus according to claim 29, wherein the mask stage includes a first substage which is capable of moving the first mask with respect to the main stage, and a second substage which is capable of moving the second mask with respect to the main stage.

31. The exposure apparatus according to claim 30, wherein a positional relationship between the first pattern of the first mask and the second pattern of the second mask is adjusted by moving at least one of the first substage and the second substage with respect to the main stage.

32. The exposure apparatus according to claim 30, further comprising a measuring system which measures position informations about the first substage and the second substage respectively.

53. The exposure apparatus according to claim 23, further comprising:

a mask stage which is capable of moving a first mask having the first pattern in a predetermined scanning direction with respect to the first exposure light beam and which is capable of moving a second mask having the second pattern in a predetermined scanning direction with respect to the second exposure light beam; and

a substrate stage which is capable of moving a predetermined area on the substrate in a predetermined scanning direction with respect to the first exposure area and the second exposure area,

wherein the predetermined area on the substrate is subjected to multiple exposure with an image of the first pattern and an image of the second pattern while moving the predetermined area on the substrate in the scanning direction by using the substrate stage in synchronization with movement of each of the first mask and the second mask in the scanning direction by the mask stage.

54. The exposure apparatus according to claim 53, wherein the mask stage integrally moves the first and second masks.

55. The exposure apparatus according to claim 54, wherein the mask stage includes a main stage which is movable while holding the first mask and the second mask in substantially identical scanning directions.

56. The exposure apparatus according to claim 55, wherein the mask stage includes a first substage which is capable of moving the first mask with respect to the main stage, and a second substage which is capable of moving the second mask with respect to the main stage.

57. The exposure apparatus according to claim 56, wherein a positional relationship between the first pattern of the first mask and the second pattern of the second mask is adjusted by moving at least one of the first substage and the second substage with respect to the main stage.

58. The exposure apparatus according to claim 56, further comprising a measuring system which measures position informations about the first substage and the second substage respectively.

59. The exposure apparatus according to claim 23, further comprising an imaging characteristic-adjusting device which adjusts at least one of an imaging characteristic of the image of the first pattern and an imaging characteristic of the image of the second pattern.

60. The exposure apparatus according to claim 23, wherein adjustment of a positional relationship among the image of the first pattern, the image of the second pattern, and the predetermined area on the substrate includes adjustment of at least one of positions of the image of the first pattern and the image of the second pattern.

61. The exposure apparatus according to claim 23, wherein adjustment of at least one of positions of the image of the first pattern and the image of the second pattern includes adjustment of at least one of positions of the first pattern and the second pattern.

62. The exposure apparatus according to claim 23, wherein a liquid immersion area is formed with a liquid on the substrate, and a first exposure light beam and a second exposure light beam are irradiated onto the predetermined area on the substrate through the liquid of the liquid immersion area.

63. A method for producing a device, comprising:

performing multiple exposure for a substrate by using the exposure apparatus as defined in claim 23;

developing the substrate for which the multiple exposure has been performed; and

processing the developed substrate.

38. An exposure method for performing multiple exposure for a substrate with an image of a first pattern and an image of a second pattern different from the first pattern, the exposure method comprising:

forming the image of the first pattern in a first exposure area;

forming the image of the second pattern in a second exposure area;

obtaining at least one of position information about the image of the first pattern to be formed in the first exposure area and position information about the image of the second pattern to be formed in the second exposure area; and

performing the multiple exposure for a predetermined area on the substrate with the image of the first pattern and the image of the second pattern based on at least one of the obtained position informations.

39. The exposure method according to claim 38, wherein the predetermined area is subjected to the multiple exposure while moving the substrate to make the predetermined area on the substrate pass across the first exposure area and the second exposure area.

40. The exposure method according to claim 38, further comprising adjusting at least one of a positional relationship between the image of the first pattern and the predetermined area on the substrate and a positional relationship between the image of the second pattern and the predetermined area on the substrate based on at least one of the obtained position informations.

41. The exposure method according to claim 38, wherein the images of the first and second patterns are formed via an optical system, a first positional relationship of the first pattern with respect to a reference arranged on a light-exit side of the optical system and a second positional relationship of the second pattern with respect to the reference are detected via at least a part of the optical system, and at least one of the position information about the image of the first pattern and the position information about the image of the second pattern is obtained based on a result of the detection.

42. The exposure method according to claim 40, wherein at least one of the first positional relationship and the second positional relationship is detected by detecting at least one of a positional relationship between a reference and a first mark which is formed in a predetermined positional relationship with respect to the first pattern and a positional relationship between the reference and a second mark which is formed in a predetermined positional relationship with respect to the second pattern, via at least a part of the optical system.

43. The exposure method according to claim 41, wherein the first exposure area and the second exposure area are defined at different positions, the reference is arranged in the first exposure area to detect the first positional relationship, and then the reference is arranged in the second exposure area to detect the second positional relationship.

44. The exposure method according to claim 38, wherein both of the position information about the image of the first pattern to be formed in the first exposure area and the position information about the image of the second pattern to be formed in the second exposure area are obtained, and a positional relationship between the image of the first pattern and the predetermined area on the substrate and a positional relationship between the image of the second pattern and the predetermined area on the substrate are adjusted based on the obtained position informations.

45. The exposure method according to claim 38, wherein one of the position information about the pattern image formed in the first exposure area and the position information about the pattern image formed in the second exposure area is obtained, and a positional relationship between the image of the first pattern and the predetermined area on the substrate and a positional relationship between the image of the second pattern and the predetermined area on the substrate are adjusted based on the obtained one of the position information and a predetermined positional relationship between the first exposure area and the second exposure area.

46. The exposure method according to claim 38, wherein a liquid immersion area is formed with a liquid on the substrate, and the predetermined area on the substrate is subjected to the multiple exposure with the image of the first pattern and the image of the second pattern through the liquid of the liquid immersion area.

52. A method for producing a device, comprising:

performing multiple exposure for a substrate by using the exposure method as defined in claim 38;

developing the substrate for which the multiple exposure has been performed; and

processing the developed substrate.

47. An exposure method for exposing a substrate while moving the substrate in a scanning direction, the exposure method comprising:

irradiating a first exposure light beam from a first pattern onto a first exposure area via an optical element by reflecting the first exposure light beam by a first reflecting surface;

irradiating a second exposure light beam from a second pattern onto a second exposure area via the optical element by reflecting the second exposure light beam by a second reflecting surface, the second exposure area being defined at a different position in the scanning direction with respect to the first exposure area;

detecting an alignment mark on the substrate by irradiating a detection light beam via the optical element from a position between the first reflecting surface and the second reflecting surface; and

performing positional adjustment for the substrate and the first and second patterns based on the detected alignment mark,

wherein the first reflecting surface and the second reflecting surface are arranged in the vicinity of positions optically conjugate with the first exposure area and the second exposure area.

48. The exposure method according to claim 47, wherein the first reflecting surface and the second reflecting surface are formed on an intermediate optical member, and the detection light beam is irradiated onto the substrate via the intermediate optical member.

49. The exposure method according to claim 48, wherein a predetermined area on the substrate is subjected to multiple exposure with an image of the first pattern formed by the first exposure light beam irradiated onto the first exposure area and an image of the second pattern formed by the second exposure light beam irradiated onto the second exposure area by irradiating the first exposure light beam and the second exposure light beam onto the first exposure area and the second exposure area respectively while relatively moving the first exposure area, the second exposure area, and the predetermined area on the substrate in the scanning direction.

50. The exposure method according to claim 47, wherein a first mask having the first pattern and a second mask having the second pattern are provided on a mask stage, and a predetermined area on the substrate is subjected to multiple exposure with an image of the first pattern and an image of the second pattern by moving the substrate in the scanning direction in synchronization with movement of the first and second masks performed by the mask stage.

51. The exposure method according to claim 47, wherein a liquid immersion area is formed with a liquid on the substrate, and the first exposure light beam and the second exposure light beam are irradiated onto a predetermined area on the substrate through the liquid of the liquid immersion area.

64. A method for producing a device, comprising:

performing multiple exposure for a substrate by using the exposure method as defined in claim 47;

developing the substrate for which the multiple exposure has been performed; and

processing the developed substrate.