Methods for trapping charge in a microelectromechanical system and microelectromechanical system employing same
First Claim
1. A method for use in association with an electromechanical device having a substrate and an encapsulation structure, the encapsulation structure being disposed over at least a portion of the substrate and defining at least a portion of a chamber, the electromechanical device further having a micromechanical structure that includes a mechanical structure disposed in the chamber, the method comprising:
- supplying electrical charge to the mechanical structure of the micromechanical structure through an electrical connection disposed in the chamber; and
electrically isolating the mechanical structure, wherein electrically isolating the mechanical structure includes breaking the electrical connection.
3 Assignments
0 Petitions
Accused Products
Abstract
Many inventions are disclosed. Some aspects are directed to MEMS, and/or methods for use with and/or for fabricating MEMS, that supply, store, and/or trap charge on a mechanical structure disposed in a chamber. Various structures may be disposed in the chamber and employed in supplying, storing and/or trapping charge on the mechanical structure. In some aspects, a breakable link, a thermionic electron source and/or a movable mechanical structure are employed. The breakable link may comprise a fuse. In one embodiment, the movable mechanical structure is driven to resonate. In some aspects, the electrical charge enables a transducer to convert vibrational energy to electrical energy, which may be used to power circuit(s), device(s) and/or other purpose(s). In some aspects, the electrical charge is employed in changing the resonant frequency of a mechanical structure and/or generating an electrostatic force, which may be repulsive.
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Citations
37 Claims
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1. A method for use in association with an electromechanical device having a substrate and an encapsulation structure, the encapsulation structure being disposed over at least a portion of the substrate and defining at least a portion of a chamber, the electromechanical device further having a micromechanical structure that includes a mechanical structure disposed in the chamber, the method comprising:
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supplying electrical charge to the mechanical structure of the micromechanical structure through an electrical connection disposed in the chamber; and electrically isolating the mechanical structure, wherein electrically isolating the mechanical structure includes breaking the electrical connection. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. A method for use in association with an electromechanical device having a mechanical structure, the method comprising:
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depositing a sacrificial layer over the mechanical structure; depositing a first encapsulation layer over the sacrificial layer; forming at least one vent through the first encapsulation layer to allow removal of at least a portion of the sacrificial layer; removing at least a portion of the sacrificial layer to form the chamber; depositing a second encapsulation layer over or in the vent to seal the chamber; supplying electrical charge to at least one portion of the mechanical structure through an electrical connection disposed in the chamber; and electrically isolating the at least one portion of the mechanical structure. - View Dependent Claims (27, 28, 29)
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30. A method for use in association with an electromechanical device having a substrate and an encapsulation structure, the encapsulation structure being disposed over at least a portion of the substrate and defining at least a portion of a chamber, the electromechanical device further having a micromechanical structure that includes a mechanical structure disposed in the chamber, the method comprising:
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supplying electrical charge to the mechanical structure of the micromechanical structure through a breakable link disposed in the chamber; and irreversibly breaking at least a portion of the breakable link. - View Dependent Claims (31, 32, 33)
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34. A method for use in association with an electromechanical device having a substrate and an encapsulation structure, the encapsulation structure being disposed over at least a portion of the substrate and defining at least a portion of a chamber, the electromechanical device further having a micromechanical structure that includes a mechanical structure disposed in the chamber, the method comprising:
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controlling at least one portion of at least one movable mechanical structure disposed in the chamber to provide an electrical connection; supplying electrical charge to the mechanical structure of the micromechanical structure through the electrical connection; and breaking the electrical connection. - View Dependent Claims (35, 36, 37)
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Specification