METHOD FOR MANUFACTURING WIRING BOARD
First Claim
1. A method for manufacturing a wiring board, comprising:
- a preparation step of preparing a core board including a core main surface, a core rear surface, an accommodation hole opening at least at the core main surface side and a core board main surface side conductor disposed on the core main surface, and preparing an electronic component including a component main surface, a component rear surface and a component main surface side electrode disposed on the component main surface;
a fixing step of fixing the electronic component to the core board by filling a gap between the electronic component and the core board with a resin filler;
an insulating layer formation step of forming a lowermost resin insulating layer, which serves as a lowermost layer of a wiring laminated body, on the core main surface, the component main surface and the resin filler after the fixing step;
an opening portion formation step of forming an opening portion exposing a part of the core board main surface side conductor and the component main surface side electrode by removing at least a portion of the lowermost resin insulating layer located directly above the gap; and
a main surface side connecting conductor formation step of forming a main surface side connecting conductor in the opening portion and connecting the core board main surface side conductor to the capacitor main surface side electrode.
1 Assignment
0 Petitions
Accused Products
Abstract
A method for manufacturing a wiring board which can simplify a manufacturing step. In a preparation step, a core board and an electronic component are prepared. In an insulating layer formation and fixing step, after accommodating the electronic component in an accommodation hole, a lowermost resin insulating layer is formed, and a gap between the electronic component and the core board is filled with a part of the lowermost resin insulating layer so as to fix the electronic component to the core board. In an opening portion formation step, a portion of the lowermost resin insulating layer located directly above the gap between the electronic component and the core board is removed so as to form an opening portion exposing a part of a core board main surface side conductor and a component main surface side electrode. In a main surface side connecting conductor formation step, a main surface side connecting conductor is formed in the opening portion so as to connect the core board main surface side conductor to the component main surface side electrode.
68 Citations
12 Claims
-
1. A method for manufacturing a wiring board, comprising:
-
a preparation step of preparing a core board including a core main surface, a core rear surface, an accommodation hole opening at least at the core main surface side and a core board main surface side conductor disposed on the core main surface, and preparing an electronic component including a component main surface, a component rear surface and a component main surface side electrode disposed on the component main surface; a fixing step of fixing the electronic component to the core board by filling a gap between the electronic component and the core board with a resin filler; an insulating layer formation step of forming a lowermost resin insulating layer, which serves as a lowermost layer of a wiring laminated body, on the core main surface, the component main surface and the resin filler after the fixing step; an opening portion formation step of forming an opening portion exposing a part of the core board main surface side conductor and the component main surface side electrode by removing at least a portion of the lowermost resin insulating layer located directly above the gap; and a main surface side connecting conductor formation step of forming a main surface side connecting conductor in the opening portion and connecting the core board main surface side conductor to the capacitor main surface side electrode. - View Dependent Claims (3, 4, 5, 6, 7)
-
-
2. A method for manufacturing a wiring board, comprising:
-
a preparation step of preparing a core board including a core main surface, a core rear surface, an accommodation hole opening at least at the core main surface side and a core board main surface side conductor disposed on the core main surface, and preparing an electronic component including a component main surface, a component rear surface and a component main surface side electrode disposed on the component main surface; an insulating layer formation and fixing step of forming a lowermost resin insulating layer, which serves as a lowermost layer of a wiring laminated body, on the core main surface and the component main surface after accommodating the electronic component in the accommodation hole and fixing the electronic component to the core board by filling a gap between the electronic component and the core board with a portion of the lowermost resin insulating layer; an opening portion formation step of forming an opening portion exposing a part of the core board main surface side conductor and the component main surface side electrode by removing at least a portion of the lowermost resin insulating layer located directly above the gap; and a main surface side connecting conductor formation step of forming a main surface side connecting conductor in the opening portion and connecting the core board main surface side conductor to the component main surface side electrode. - View Dependent Claims (8, 9, 10, 11, 12)
-
Specification