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METHOD FOR MANUFACTURING WIRING BOARD

  • US 20070281394A1
  • Filed: 04/25/2007
  • Published: 12/06/2007
  • Est. Priority Date: 04/25/2006
  • Status: Active Grant
First Claim
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1. A method for manufacturing a wiring board, comprising:

  • a preparation step of preparing a core board including a core main surface, a core rear surface, an accommodation hole opening at least at the core main surface side and a core board main surface side conductor disposed on the core main surface, and preparing an electronic component including a component main surface, a component rear surface and a component main surface side electrode disposed on the component main surface;

    a fixing step of fixing the electronic component to the core board by filling a gap between the electronic component and the core board with a resin filler;

    an insulating layer formation step of forming a lowermost resin insulating layer, which serves as a lowermost layer of a wiring laminated body, on the core main surface, the component main surface and the resin filler after the fixing step;

    an opening portion formation step of forming an opening portion exposing a part of the core board main surface side conductor and the component main surface side electrode by removing at least a portion of the lowermost resin insulating layer located directly above the gap; and

    a main surface side connecting conductor formation step of forming a main surface side connecting conductor in the opening portion and connecting the core board main surface side conductor to the capacitor main surface side electrode.

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