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IMPRINT CIRCUIT PATTERNING

  • US 20070283832A1
  • Filed: 10/25/2006
  • Published: 12/13/2007
  • Est. Priority Date: 06/09/2006
  • Status: Abandoned Application
First Claim
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1. A method for fabricating an imprinted substrate, the method comprising:

  • providing a substrate;

    imprinting the substrate by applying a tool to the substrate in the presence of at least one of heat and pressure to form an imprinted substrate;

    depositing at least a first material substantially uniformly on at least a first portion of the imprinted substrate; and

    depositing at least a second material substantially non-uniformly on at least a second portion of the imprinted substrate.

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