Sensor device

• US 20070284713A1
• Filed: 05/24/2007
• Published: 12/13/2007
• Est. Priority Date: 06/12/2006
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Ninomiya, Yasunori, Abe, Ryuichiro
• Granted Patent: US 7,541,574 B2
• Time in Patent Office: Days
• US Class Current: 257/678
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type

Abstract

A sensor device includes a board, a sensor element and a resin member made of resin. The sensor element has a displace part to be displaced in a predetermined detection direction, and detects a displace amount of the displace part in the detection direction. The sensor element is mounted and connected to the board through the resin member. The resin member is arranged between the sensor element and the board in part such that a warp of the sensor element in the detection direction due to a temperature variation is smaller than a warp of the sensor element in a direction except for the detection direction.

Claims

1. A sensor device comprising:

a board;

a sensor element having a displace part to be displaced in a predetermined detection direction, the sensor element detecting a displace amount of the displace part in the detection direction; and

a first resin member made of resin, wherein

the sensor element is mounted and connected to the board through the first resin member, and

the first resin member is arranged between the sensor element and the board in part such that a warp of the sensor element in the detection direction due to a temperature variation is smaller than a warp of the sensor element in a direction except for the detection direction.

2. The sensor device according to claim 1, wherein

the board is a ceramic package or a resin board.

3. The sensor device according to claim 1, wherein

the board includes:

a first board, on which the sensor element is connected;

a second board for supporting the first board under the first board; and

a second resin member made of resin, wherein

the first board and the second board are connected through the second resin member, and

the second resin member is arranged between the first board and the second board in part such that a warp of the first board in the detection direction due to the temperature variation is smaller than a warp of the first board in the direction except for the detection direction.

4. The sensor device according to claim 1, wherein

the board includes:

a first board, on which the sensor element is connected;

a second board for supporting the first board under the first board; and

a second resin member made of resin, wherein

the first board and the second board are connected through the second resin member,

the first board has an end portion at each end of the first board in a direction approximately perpendicular to the detection direction, and

the second resin member is arranged only under the end portion of the first board.

5. The sensor device according to claim 4, wherein

the first board overlapping with the displace part of the sensor element and extending from the overlap part parallel to the detection direction is spaced from the second board without the second resin member.

6. The sensor device according to claim 3, wherein

the first board is a circuit chip to be electrically connected to the sensor element, and

the second board is a ceramic package to be electrically connected to the sensor element and the circuit chip.

7. The sensor device according to claim 1, wherein

the displace part is disposed on a face of the sensor element, and

the sensor element is mounted on the board such that the face of the sensor element faces the board.

8. The sensor device according to claim 1, wherein

the sensor element is made of a semiconductor chip.

9. A sensor device comprising:

a board;

a sensor element having a displace part to be displaced in a predetermined detection direction, the sensor element detecting a displace amount of the displace part in the detection direction; and

a first resin member made of resin, wherein

the sensor element has an end portion at each end of the sensor element in a direction approximately perpendicular to the detection direction,

the first resin member is arranged only under the end portion of the sensor element, and

the end portion of the sensor element is connected to the board through the first resin member.

10. The sensor device according to claim 9, wherein

the sensor element has a rectangular board shape constructed with a first pair of ends and a second pair of ends, wherein the first pair of ends oppose to each other in the detection direction and the second pair of ends oppose to each other in a direction approximately perpendicular to the detection direction, and

the first resin member extends parallel to the detection direction under the end portion of the sensor element corresponding to the second pair of ends.

11. The sensor device according to claim 9, wherein

the displace part of the sensor element and the sensor element extending from the displace part parallel to the detection direction are spaced from the board without the first resin member.

12. The sensor device according to claim 9, wherein

the board is a ceramic package or a resin board.

13. The sensor device according to claim 9, wherein

the board includes:

a first board, on which the sensor element is connected;

a second board for supporting the first board under the first board; and

a second resin member made of resin, wherein

the first board and the second board are connected through the second resin member, and

the second resin member is arranged between the first board and the second board in part such that a warp of the first board in the detection direction due to the temperature variation is smaller than a warp of the first board in the direction except for the detection direction.

14. The sensor device according to claim 9, wherein

the board includes:

a first board, on which the sensor element is connected;

a second board for supporting the first board under the first board; and

a second resin member made of resin, wherein

the first board and the second board are connected through the second resin member,

the first board has an end portion at each end of the first board in a direction approximately perpendicular to the detection direction, and

the second resin member is arranged only under the end portion of the first board.

15. The sensor device according to claim 13, wherein

the first board is a circuit chip to be electrically connected to the sensor element, and

the second board is a ceramic package to be electrically connected to the sensor element and the circuit chip.

16. The sensor device according to claim 9, wherein

the displace part is disposed on a face of the sensor element, and

the sensor element is mounted on the board such that the face of the sensor element faces the board.

17. The sensor device according to claim 9, wherein

the sensor element is made of a semiconductor chip.