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Semiconductor Device with Improved Contacts

  • US 20070284740A1
  • Filed: 05/08/2007
  • Published: 12/13/2007
  • Est. Priority Date: 08/11/2005
  • Status: Active Grant
First Claim
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1. A device comprising:

  • a semiconductor chip;

    a substrate, on which the chip is assembled, having contacts for external connections;

    each contact including;

    a contact area with copper;

    an alloy layer covering the contact area, the alloy layer including copper/tin alloys and copper/nickel/tin alloys, metallurgically attached to the copper area and substantially free of regions of unalloyed nickel;

    the copper/nickel/tin alloys including(Cu, Ni, Au)6Sn5 intermetallic compound;

    a reflow element comprising tin metallurgically attached to the alloy layer; and

    the substrate further having a second contact area with copper and a region over the copper including nickel and an gold member;

    the semiconductor chip mechanically assembled on the substrate via the gold member.

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