Device, System and Method for Cutting, Cleaving or Separating a Substrate Material

• US 20070284785A1
• Filed: 06/20/2005
• Published: 12/13/2007
• Est. Priority Date: 06/21/2004
• Status: Abandoned Application

• Current Assignee: Applied Photonics, Inc., Toray Engineering Company Limited (Toray Industries Incorporated)
• Original Assignee: Applied Photonics, Inc., Toray Engineering Company Limited (Toray Industries Incorporated)
• Inventors: Hoekstra, Brian
• Application Number:
  US11/630,165
• Publication Number:
  US 20070284785A1
• Time in Patent Office: Days
• US Class Current: 264/400
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/03 Observing, e.g. monitoring, the workpiece
• CPC Class Codes: B23K 26/032 using optical means
• CPC Class Codes: B23K 26/034 Observing the temperature of the workpiece
• CPC Class Codes: B23K 26/0344 Observing the speed of the workpiece
• CPC Class Codes: B23K 26/04 Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
• CPC Class Codes: B23K 26/0604 by a combination of beams
• CPC Class Codes: B23K 26/073 Shaping the laser spot
• CPC Class Codes: B23K 26/083 Devices involving movement of the workpiece in at least one axial direction
• CPC Class Codes: B23K 26/0869 Devices involving movement of the laser head in at least one axial direction
• CPC Class Codes: B23K 26/142 for the removal of by-products
• CPC Class Codes: B23K 26/146 the fluid stream containing a liquid
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved
• CPC Class Codes: B23K 26/60 Preliminary treatment
• CPC Class Codes: C03B 33/03 Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
• CPC Class Codes: C03B 33/07 Cutting armoured, multi-layered, coated or laminated, glass products
• CPC Class Codes: C03B 33/093 using two or more focussed radiation beams

Abstract

An apparatus and method for separating a nonmetallic substrate is disclosed as including a first beam; a first quenching device positioned so that a coolant stream may be applied to the substrate at or immediately adjacent to the trailing end of the first spot; a second beam; and a second quenching device positioned between the first quenching device and the second beam. At least one of an angle at which the first scribe beam impinges on the substrate and an energy intensity of the first scribe beam impinging on the substrate are adjusted to obtain right angle separation. A crack sensor and controller can also be provided for measuring a position of the cut line, comparing the position with a reference position and adjusting the power intensity of the second beam based on the comparison of the position of the cut line with the reference position.

Claims

1. An apparatus for separating a portion of a nonmetallic substrate, comprising:

a first beam, the first beam impinging on the substrate at a first spot, the first spot having a leading end and a trailing end;

a first quenching device, said first quenching device positioned so that a coolant stream may be applied to the substrate at or immediately adjacent to the trailing end of the first spot;

a second beam, the second beam impinging on the substrate at a second spot, the second spot positioned on the substrate behind the first spot; and

a second quenching device, said second quenching device positioned between said first quenching device and said second beam.

2. An apparatus for separating a nonmetallic substrate as defined in claim 1, further comprising:

a third quenching device, said third quenching device positioned between said second quenching device and said second beam.

3. An apparatus for separating a nonmetallic substrate as defined in claim 1, wherein at least one of said first quenching device and said second quenching device includes an atomizing nozzle having a two fluid mixture.

4. An apparatus for separating a nonmetallic substrate as defined in claim 3, wherein the two fluid mixture includes water and air.

5. An apparatus for separating a nonmetallic substrate as defined in claim 1, further comprising means for independently adjusting parameters of said first quenching device relative to said second quenching device.

6. A method of controlling separation of a portion of a nonmetallic substrate, comprising the steps of:

impinging a first beam on the substrate at a first spot, the first spot having a leading end and a trailing end;

quenching with a first quenching nozzle positioned so that a coolant stream may be applied to the substrate adjacent to or spaced from a heat affected zone;

further quenching with a second quenching nozzle positioned adjacent to and spaced from the first quenching nozzle; and

impinging a second beam onto the substrate at a second spot to break through a portion of a thickness of the substrate.

7. The method of controlling separation of a portion of a nonmetallic substrate as defined in claim 6, further comprising the step of:

providing additional quenching with a third quenching nozzle positioned adjacent to and spaced from the second quenching nozzle.

8. The method of controlling separation of a portion of a nonmetallic substrate as defined in claim 6, further comprising the step of:

vacuuming excess quenching liquid prior to the second spot.

9. The method of controlling separation of a portion of a nonmetallic substrate as defined in claim 6, further comprising the step of:

providing at least one of the first quenching nozzle and the second quenching nozzle with an atomizing nozzle having a two fluid mixture.

10. The method of controlling separation of a portion of a nonmetallic substrate as defined in claim 6, further comprising the step of:

varying an amount of power supplied in the second beam.

11. The method of controlling separation of a portion of a nonmetallic substrate as defined in claim 6, further comprising the step of:

controlling parameters of the first quenching nozzle independently of the second quenching nozzle.

12. A method of making a right angle separation in a nonmetallic substrate, comprising the steps of:

impinging a first scribe beam on the substrate at a first spot, the first spot having a leading end and a trailing end;

quenching with a first quenching nozzle positioned so that a coolant stream may be applied to the substrate in a heat affected zone;

impinging a second beam onto the substrate at a second spot to break through a portion of a thickness of the substrate; and

adjusting at least one of an angle at which the first scribe beam impinges on the substrate and an energy intensity of the first scribe beam impinging on the substrate.

13. A method of making a right angle separation in a nonmetallic substrate as defined in claim 12, wherein said step of adjusting at least one of an angle at which the first scribe beam impinges on the substrate includes adjusting a position of a lens related to the first scribe beam.

14. A method of making a right angle separation in a nonmetallic substrate as defined in claim 12, wherein said step of adjusting at least one of an angle at which the first scribe beam impinges on the substrate includes adjusting a position of the first spot.

15. A method of making a right angle separation in a nonmetallic substrate as defined in claim 14, wherein said step of adjusting at least one of an angle at which the first scribe beam impinges on the substrate includes adjusting a position of the first spot by adjusting a position of a table holding the substrate.

16. A method of making a right angle separation in a nonmetallic substrate as defined in claim 14, wherein said step of adjusting at least one of an angle at which the first scribe beam impinges on the substrate includes adjusting the position of the first spot by adjustment of a mirror.

17. A method of making a right angle separation in a nonmetallic substrate as defined in claim 12, wherein said step of adjusting at least one of an angle at which the first scribe beam impinges on the substrate includes adjusting the position of the first spot by adjustment of a mirror.

18. A method of making a right angle separation in a nonmetallic substrate as defined in claim 12, wherein said step of adjusting at least one of an angle at which the first scribe beam impinges on the substrate includes adjusting a position of a table holding the substrate.

19. A method of separating a nonmetallic substrate, comprising the steps of:

impinging a first beam on a first side of the substrate at a first spot;

quenching with a first quenching nozzle positioned so that a coolant stream may be applied to the first side of the substrate;

impinging a second beam onto the substrate at a second spot to break through a portion of a thickness of the substrate;

rotating the substrate so a second side of the substrate is facing the first beam, the first quenching nozzle and the second beam;

impinging the first beam on the second side of the substrate at a third spot;

quenching with the first quenching nozzle positioned so that a coolant stream may be applied to the second side of the substrate; and

impinging the second beam onto the substrate at a fourth spot to break through at least another portion of the thickness of the substrate.

20. A method of separating a nonmetallic substrate as defined in claim 19, further comprising the step of:

quenching with a second quenching nozzle positioned between said first quenching nozzle and the second beam.

21. A method of separating a nonmetallic substrate as defined in claim 19, wherein said step of impinging a second beam onto the substrate forms an approximately half cut through the first side of the substrate and said step of impinging the second beam onto the second side of the substrate forms a full cut through the substrate.

22. An apparatus for separating a portion of a nonmetallic substrate, comprising:

a first beam, the first beam impinging on the substrate at a first spot, the first spot having a leading end and a trailing end;

a first quenching device, said first quenching device positioned so that a coolant stream may be applied to the substrate at or immediately adjacent to the trailing end of the first spot;

a second beam, the second beam impinging on the substrate at a second spot, the second spot positioned on the substrate behind the first spot for forming a cut line in the substrate;

a crack sensor separated from the substrate for measuring a position of the cut line; and

a controller operatively connected to said crack sensor for receiving information about the position of the cut line and comparing the position of the cut line with a reference position, and said controller including means for adjusting the power intensity of the second beam based on the comparison of the position of the cut line with the reference position.

23. An apparatus for separating a portion of a nonmetallic substrate as defined in claim 22, wherein said crack sensor includes at least one of a CCD sensor, a CMOS sensor, an acoustic sensor, an image sensor and an ultrasonic sensor.

24. An apparatus for separating a portion of a nonmetallic substrate as defined in claim 22, wherein said means for adjusting the power intensity of the second beam includes decreasing the power intensity if the cracking position is ahead of the reference position.

25. An apparatus for separating a portion of a nonmetallic substrate as defined in claim 22, wherein said means for adjusting the power intensity of the second beam includes increasing the power intensity if the cracking position is behind the reference position.

26. A method of adjusting a separation process of a nonmetallic substrate, comprising the steps of:

impinging a first beam on the substrate at a first spot;

quenching with a first quenching nozzle positioned so that a coolant stream may be applied to the substrate in a heat affected zone;

impinging a second beam onto the substrate at a second spot to break through a portion of a thickness of the substrate thereby forming a cut line in the substrate;

measuring a position of the cut line using a crack sensor;

comparing the position of the cut line with a reference position; and

adjusting the power intensity of the second beam based on the comparison of the position of the cut line with the reference position.

27. A method of adjusting a separation process of a nonmetallic substrate as defined in claim 26, wherein said step of adjusting the power intensity of the second beam includes decreasing the power intensity if the cracking position is ahead of the reference position.

28. A method of adjusting a separation process of a nonmetallic substrate as defined in claim 26, wherein said step of adjusting the power intensity of the second beam includes increasing the power intensity if the cracking position is behind the reference position.

29. A method of adjusting a separation process of a nonmetallic substrate as defined in claim 26, further comprising the step of continuing said steps of measuring, comparing and adjusting along an entire length of the cut line.

30. A method of adjusting a beam shape during a separation process of a nonmetallic substrate, comprising the steps of:

impinging a first beam on the substrate at a first spot;

quenching with a first quenching nozzle positioned so that a coolant stream may be applied to the substrate in a heat affected zone;

impinging a second beam onto the substrate at a second spot to break through a portion of a thickness of the substrate thereby forming a cut line in the substrate; and

adjusting at least one of a shape of a first spot where the first beam impinges on the substrate and an energy density profile of the first beam so that there is a varying energy density profile of the first beam impinging on the substrate.

31. A method of adjusting a beam shape during a separation process of a nonmetallic substrate as defined in claim 30, wherein said step of adjusting includes adjusting the shape of the first spot to include an asymmetrical beam shape.

32. A method of adjusting a beam shape during a separation process of a nonmetallic substrate as defined in claim 30, wherein said step of adjusting includes adjusting the energy density profile of the first beam so that there is an asymmetrical energy density.

33. A method of adjusting a beam shape during a separation process of a nonmetallic substrate as defined in claim 30, wherein said step of adjusting includes adjusting the energy density profile of the first beam so that a center of the energy density profile is closer to one side of the first spot than another side.

34. A method of adjusting a beam shape during a separation process of a nonmetallic substrate as defined in claim 30, wherein said step of adjusting includes forming one portion of the first spot to be thinner than another portion of the first spot.

35. A method of adjusting a beam shape during a separation process of a nonmetallic substrate as defined in claim 30, wherein said step of adjusting includes forming a tilt angle between the substrate and a direction of the first beam.

36. A method of adjusting a beam shape during a separation process of a nonmetallic substrate as defined in claim 35, wherein said step of adjusting includes forming the tilt angle between the substrate and a direction of the first beam by adjusting a lens position forming the first beam.

37. An apparatus for adjusting a beam shape during separation of a nonmetallic substrate, comprising:

a first beam, the first beam impinging on the substrate at a first spot, the first spot having a leading end and a trailing end;

a first quenching device, said first quenching device positioned so that a coolant stream may be applied to the substrate at or immediately adjacent to the trailing end of the first spot;

a second beam, the second beam impinging on the substrate at a second spot, the second spot positioned on the substrate behind the first spot for forming a cut line in the substrate; and

a controller means for adjusting a shape of the first spot produced by the first beam.

38. An apparatus for adjusting a beam shape during separation of a nonmetallic substrate as defined in claim 37, wherein said controller means includes means for adjusting the shape of the first spot into an asymmetrical beam shape.

39. An apparatus for adjusting a beam shape during separation of a nonmetallic substrate as defined in claim 37, wherein said controller means includes means for adjusting the energy density profile of the first beam into an asymmetrical energy density.

40. An apparatus for adjusting a beam shape during separation of a nonmetallic substrate as defined in claim 37, wherein said controller means includes means for adjusting the energy density profile of the first beam so that a center of the energy density profile is closer to one side of the first spot than another side.

41. An apparatus for adjusting a beam shape during separation of a nonmetallic substrate as defined in claim 37, wherein said controller means includes means for forming one portion of the first spot to be thinner than another portion of the first spot.

42. An apparatus for adjusting a beam shape during separation of a nonmetallic substrate as defined in claim 37, wherein said controller means includes means for forming a tilt angle between the substrate and a direction of the first beam by adjusting a lens position forming the first beam.