POWER SYSTEM MODULE AND METHOD OF FABRICATING THE SAME

• US 20070284947A1
• Filed: 04/05/2007
• Published: 12/13/2007
• Est. Priority Date: 04/20/2006
• Status: Active Grant

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Fairchild Korea Semiconductor Limited (ON Semiconductor Corporation)
• Inventors: Lee, Keun-hyuk, Lim, Seung-won, Paek, Seung-han, Park, Sung-min
• Granted Patent: US 7,706,146 B2
• Time in Patent Office: Days
• US Class Current: 307/31
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14322 wherein the control and power circuits of a power converter are arranged within the same casing
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

Provided are a power system module allowing a user'"'"'s requirements to be easily met, and having economic practicality and high integration, and a manufacturing method thereof. The power system module includes a plastic case, a molding type power module package, a control circuit board, and at least one external terminal. The plastic case defines a bottom and a side wall. The molding type power module package is fixed to the bottom of the plastic case and includes at least a power device therein. The control circuit board is fixed to the side wall of the plastic case, includes at least a control device mounted thereon which is electrically connected to the power module package. The external terminal protrudes to outside the plastic case and is electrically connected to the control circuit board.

Claims

1. A power system module comprising:

a plastic case having a first region and a second region;

a power module package of a molding type fixed to the first region of the plastic case and including at least a power device;

a control circuit board fixed to the second region of the plastic case, including at least a control device mounted thereon, and electrically connected to the power module package; and

at least one external terminal protruding to outside the plastic case and electrically connected to the control circuit board.

2. The power system module of claim 1, wherein the plastic case comprises a fixing member for fixing the external terminal.

3. The power system module of claim 2, wherein the control circuit board further comprises at least one first hole, and the external terminal passes through the first hole and is fixed to the fixing member.

4. The power system module of claim 3, wherein the external terminal is electrically connected to the control circuit board by conductive solder.

5. The power system module of claim 1, wherein the power module package further comprises at least one lead electrically connected to the power device, the control circuit board further comprises at least one second hole, and the lead of the power module package is positioned to pass through the second hole of the control circuit board.

6. The power system module of claim 5, wherein the lead of the power module package and the control circuit board are electrically connected by conductive solder.

7. The power system module of claim 1, wherein the plastic case comprises a floor and a sidewall, where the first region is defined by the floor and the second region is defined by the sidewall.

8. The power system module of claim 7, wherein the floor of the plastic case comprises a through hole exposing at least a portion of the first region to the outside.

9. The power system module of claim 8, wherein the power module package further comprises a heat sink passing through the through hole of the plastic case and being exposed to the outside.

10. The power system module of claim 7, wherein the sidewall of the plastic case comprises a groove into which the control circuit board is fixed.

11. The power system module of claim 1, wherein the power module package further comprises a passive device, and the control circuit board further comprises another active device or a passive device mounted thereon.

12. A manufacturing method of a power system module, comprising:

providing a plastic case defining a first region and a second region;

fixing a power module package of a molding type including at least a power device to the first region of the plastic case;

fixing a control circuit board including at least a control device mounted thereon to the second region of the plastic case;

electrically connecting the control circuit board to the power module package; and

protruding at least one external terminal to outside the plastic case, and electrically connecting the external terminal to the control circuit board.

13. The manufacturing method of claim 12, further comprising the steps of forming at least one hole in the control circuit board and fixing the external terminal to the control circuit board.

14. The manufacturing method of claim 13, wherein the electrical connecting of the external terminal includes:

passing the external terminal through the first hole of the control circuit board and fixing the external terminal to the fixing member of the plastic case; and

connecting the external terminal to the control circuit board using soldering.

15. The manufacturing method of claim 13, including the additional step of forming a second hole in the control circuit board.

16. The manufacturing method of claim 15, wherein the electrical connecting of the control circuit board includes:

positioning a lead of the power module package to pass through the second hole of the control circuit board; and

connecting the lead of the power module package to the control circuit board using soldering.

17. The manufacturing method of claim 12, further comprising the steps of forming a through hole in a bottom of the plastic case and fixing the power module in the through hole such that the power module is exposed to the outside of the plastic case.

18. The manufacturing method of claim 12, further comprising the step of forming a groove in a sidewall of the plastic case and fixing the control circuit board in the groove.